USD396211S - Integrated circuit device - Google Patents

Integrated circuit device Download PDF

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Publication number
USD396211S
USD396211S US29/068,462 US6846297F USD396211S US D396211 S USD396211 S US D396211S US 6846297 F US6846297 F US 6846297F US D396211 S USD396211 S US D396211S
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US
United States
Prior art keywords
integrated circuit
circuit device
view
ornamental design
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/068,462
Inventor
Yoshinari Enomoto
Satomi Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ENOMOTO, YOSHINARI, KAJIWARA, SATOMI
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Application granted granted Critical
Publication of USD396211S publication Critical patent/USD396211S/en
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. MERGER AND CHANGE OF NAME Assignors: FUJI ELECTRIC SYSTEMS CO., LTD. (FES), FUJI TECHNOSURVEY CO., LTD. (MERGER BY ABSORPTION)
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the top, front and left side of an integrated circuit device showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a front elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for an integrated circuit device, as shown.
US29/068,462 1996-09-09 1997-03-03 Integrated circuit device Expired - Lifetime USD396211S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2683396 1996-09-09
JP8-26833 1996-09-09

Publications (1)

Publication Number Publication Date
USD396211S true USD396211S (en) 1998-07-21

Family

ID=71597859

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/068,462 Expired - Lifetime USD396211S (en) 1996-09-09 1997-03-03 Integrated circuit device

Country Status (1)

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US (1) USD396211S (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device

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