USD396847S - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD396847S
USD396847S US29/069,590 US6959097F USD396847S US D396847 S USD396847 S US D396847S US 6959097 F US6959097 F US 6959097F US D396847 S USD396847 S US D396847S
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United States
Prior art keywords
semiconductor device
view
elevational view
ornamental design
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US29/069,590
Inventor
Masao Nakayama
Kaoru Muramatsu
Katsuji Tara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to MATSUSHITA ELECTRONICS CORPORATION reassignment MATSUSHITA ELECTRONICS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MURAMATSU, KAORU, NAKAYAMA, MASAO, TARA, KATSUJI
Application granted granted Critical
Publication of USD396847S publication Critical patent/USD396847S/en
Assigned to PANASONIC CORPORATION reassignment PANASONIC CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. reassignment MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: MATSUSHITA ELECTRONICS CORPORATION
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the top, front and left side of a semiconductor device showing our new design;
FIG. 2 is a perspective view of the bottom, rear and right side thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a rear elevational view thereof; and,
FIG. 8 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown.
US29/069,590 1996-10-17 1997-04-16 Semiconductor device Expired - Lifetime USD396847S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8-31320 1996-10-17
JP3132096 1996-10-17

Publications (1)

Publication Number Publication Date
USD396847S true USD396847S (en) 1998-08-11

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Family Applications (1)

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US29/069,590 Expired - Lifetime USD396847S (en) 1996-10-17 1997-04-16 Semiconductor device

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US (1) USD396847S (en)

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD416872S (en) * 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
US6501362B1 (en) 2000-11-28 2002-12-31 Umec Usa, Inc. Ferrite core
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD839244S1 (en) * 2016-04-29 2019-01-29 Laird Technologies, Inc. Antenna housing
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD922970S1 (en) * 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Catalog--Fujita--GaAs FET Issued prior to Oct. 17, 1996, 3 pages.

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD416872S (en) * 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
US6501362B1 (en) 2000-11-28 2002-12-31 Umec Usa, Inc. Ferrite core
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
US9269661B1 (en) 2013-03-07 2016-02-23 Vlt, Inc. Low resistance power switching device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD839244S1 (en) * 2016-04-29 2019-01-29 Laird Technologies, Inc. Antenna housing
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD922970S1 (en) * 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package

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