USD396847S - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD396847S USD396847S US29/069,590 US6959097F USD396847S US D396847 S USD396847 S US D396847S US 6959097 F US6959097 F US 6959097F US D396847 S USD396847 S US D396847S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- ornamental design
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of the top, front and left side of a semiconductor device showing our new design;
FIG. 2 is a perspective view of the bottom, rear and right side thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a rear elevational view thereof; and,
FIG. 8 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a semiconductor device, as shown.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8-31320 | 1996-10-17 | ||
JP3132096 | 1996-10-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD396847S true USD396847S (en) | 1998-08-11 |
Family
ID=71518405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/069,590 Expired - Lifetime USD396847S (en) | 1996-10-17 | 1997-04-16 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (1) | USD396847S (en) |
Cited By (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
USD432097S (en) * | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
US6501362B1 (en) | 2000-11-28 | 2002-12-31 | Umec Usa, Inc. | Ferrite core |
US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD738834S1 (en) * | 2014-07-29 | 2015-09-15 | Jianhui Xie | Driver circuit integrated LED module |
USD752000S1 (en) | 2013-03-07 | 2016-03-22 | Vlt, Inc. | Semiconductor device |
USD758329S1 (en) * | 2013-08-06 | 2016-06-07 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD769834S1 (en) * | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD824866S1 (en) * | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD839244S1 (en) * | 2016-04-29 | 2019-01-29 | Laird Technologies, Inc. | Antenna housing |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
USD922970S1 (en) * | 2019-10-28 | 2021-06-22 | Rohm Co., Ltd. | Semiconductor device |
USD928105S1 (en) * | 2019-10-28 | 2021-08-17 | Rohm Co., Ltd. | Semiconductor device |
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
-
1997
- 1997-04-16 US US29/069,590 patent/USD396847S/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
Catalog--Fujita--GaAs FET Issued prior to Oct. 17, 1996, 3 pages. |
Cited By (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
USD432097S (en) * | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
US6501362B1 (en) | 2000-11-28 | 2002-12-31 | Umec Usa, Inc. | Ferrite core |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
USD752000S1 (en) | 2013-03-07 | 2016-03-22 | Vlt, Inc. | Semiconductor device |
US9269661B1 (en) | 2013-03-07 | 2016-02-23 | Vlt, Inc. | Low resistance power switching device |
US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
USD769834S1 (en) * | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD758329S1 (en) * | 2013-08-06 | 2016-06-07 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
USD738834S1 (en) * | 2014-07-29 | 2015-09-15 | Jianhui Xie | Driver circuit integrated LED module |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD839244S1 (en) * | 2016-04-29 | 2019-01-29 | Laird Technologies, Inc. | Antenna housing |
USD824866S1 (en) * | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD864135S1 (en) | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
USD922970S1 (en) * | 2019-10-28 | 2021-06-22 | Rohm Co., Ltd. | Semiconductor device |
USD928105S1 (en) * | 2019-10-28 | 2021-08-17 | Rohm Co., Ltd. | Semiconductor device |
USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD969762S1 (en) | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
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