USD832228S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD832228S1
USD832228S1 US29/602,897 US201729602897F USD832228S US D832228 S1 USD832228 S1 US D832228S1 US 201729602897 F US201729602897 F US 201729602897F US D832228 S USD832228 S US D832228S
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US
United States
Prior art keywords
semiconductor module
view
shown
described
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/602,897
Inventor
Kentaro Chikamatsu
Koshun SAITO
Kenichi Yoshimochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JPD2016-24832F priority Critical patent/JP1577511S/ja
Priority to JP2016-024832 priority
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIKAMATSU, KENTARO, SAITO, KOSHUN, YOSHIMOCHI, KENICHI
Application granted granted Critical
Publication of USD832228S1 publication Critical patent/USD832228S1/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front, top, and right side perspective view of a semiconductor module showing our new design;

FIG. 2 is a rear, bottom, and left side perspective view thereof;

FIG. 3 is a front view thereof, the rear view being an identical image of FIG. 3;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a right side view thereof, the left side view being a mirror image of FIG. 6.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module, as shown and described.
US29/602,897 2016-11-15 2017-05-04 Semiconductor module Active USD832228S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2016-24832F JP1577511S (en) 2016-11-15 2016-11-15
JP2016-024832 2016-11-15

Publications (1)

Publication Number Publication Date
USD832228S1 true USD832228S1 (en) 2018-10-30

Family

ID=58746183

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/602,897 Active USD832228S1 (en) 2016-11-15 2017-05-04 Semiconductor module

Country Status (2)

Country Link
US (1) USD832228S1 (en)
JP (1) JP1577511S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device

Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US5105257A (en) * 1990-08-08 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device and semiconductor device packaging element
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD509810S1 (en) * 2003-07-30 2005-09-20 Delta Electronics Inc. Molding structure of electric element
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259559S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259782S (en) * 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US5105257A (en) * 1990-08-08 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device and semiconductor device packaging element
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD509810S1 (en) * 2003-07-30 2005-09-20 Delta Electronics Inc. Molding structure of electric element
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device

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