USD928105S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD928105S1
USD928105S1 US29/731,623 US202029731623F USD928105S US D928105 S1 USD928105 S1 US D928105S1 US 202029731623 F US202029731623 F US 202029731623F US D928105 S USD928105 S US D928105S
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United States
Prior art keywords
semiconductor device
view
line
design
dash
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
US29/731,623
Inventor
Koshun SAITO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
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Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAITO, KOSHUN
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FIG. 1 is a perspective view of a semiconductor device showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is an enlarged cross-sectional view taken along line 6-6 in FIG. 4; and,
FIG. 7 is an enlarged cross-sectional view taken along line 7-7 in FIG. 4.
The even broken lines illustrate portions of the semiconductor device that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.
In FIGS. 1 and 4, the solid line extending in the vertical length direction, and which is co-linear with an even broken line at one end and a dash-dotted line at the other end, represents a claimed structure line of an electrode plate of the semiconductor device.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/731,623 2019-10-28 2020-04-16 Semiconductor device Active USD928105S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2019-23880F JP1664528S (en) 2019-10-28 2019-10-28
JP2019-023880 2019-10-28

Publications (1)

Publication Number Publication Date
USD928105S1 true USD928105S1 (en) 2021-08-17

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ID=71663464

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/731,623 Active USD928105S1 (en) 2019-10-28 2020-04-16 Semiconductor device

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US (1) USD928105S1 (en)
JP (1) JP1664528S (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1699856S (en) 2020-12-15 2021-11-15 semiconductor element

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4951124A (en) 1986-10-24 1990-08-21 Kabushiki Kaisha Toshiba Semiconductor device
US5459350A (en) * 1993-01-13 1995-10-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed type semiconductor device
US5512784A (en) * 1994-04-19 1996-04-30 Jerrold Communications, General Instrument Corporation Surge protector semiconductor subassembly for 3-lead transistor aotline package
US5563441A (en) * 1992-12-11 1996-10-08 Mitsubishi Denki Kabushiki Kaisha Lead frame assembly including a semiconductor device and a resistance wire
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD420983S (en) * 1998-10-16 2000-02-22 Ixys Corporation Semiconductor power package with three leads
US6100580A (en) 1988-09-20 2000-08-08 Hitachi, Ltd. Semiconductor device having all outer leads extending from one side of a resin member
US6362517B1 (en) * 1999-09-22 2002-03-26 Michael Ray Bell High voltage package for electronic device
US6404065B1 (en) * 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
USD489695S1 (en) * 2002-03-29 2004-05-11 Kabushiki Kaisha Toshiba Semiconductor device
USD515520S1 (en) * 2002-03-29 2006-02-21 Kabushiki Kaisha Toshiba Semiconductor device
USD729250S1 (en) * 2013-07-30 2015-05-12 Samsung Electronics Co., Ltd. Semiconductor memory device
USD730911S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD736216S1 (en) * 2014-07-30 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736213S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4951124A (en) 1986-10-24 1990-08-21 Kabushiki Kaisha Toshiba Semiconductor device
US6100580A (en) 1988-09-20 2000-08-08 Hitachi, Ltd. Semiconductor device having all outer leads extending from one side of a resin member
US5563441A (en) * 1992-12-11 1996-10-08 Mitsubishi Denki Kabushiki Kaisha Lead frame assembly including a semiconductor device and a resistance wire
US5459350A (en) * 1993-01-13 1995-10-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed type semiconductor device
US5512784A (en) * 1994-04-19 1996-04-30 Jerrold Communications, General Instrument Corporation Surge protector semiconductor subassembly for 3-lead transistor aotline package
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6404065B1 (en) * 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
USD420983S (en) * 1998-10-16 2000-02-22 Ixys Corporation Semiconductor power package with three leads
US6362517B1 (en) * 1999-09-22 2002-03-26 Michael Ray Bell High voltage package for electronic device
USD489695S1 (en) * 2002-03-29 2004-05-11 Kabushiki Kaisha Toshiba Semiconductor device
USD515520S1 (en) * 2002-03-29 2006-02-21 Kabushiki Kaisha Toshiba Semiconductor device
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD729250S1 (en) * 2013-07-30 2015-05-12 Samsung Electronics Co., Ltd. Semiconductor memory device
USD730911S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD736213S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736216S1 (en) * 2014-07-30 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Notice of Allowance issued for U.S. Appl. No. 29/731,618, dated Mar. 8, 2021, 12 pages.

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