USD928105S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD928105S1 USD928105S1 US29/731,623 US202029731623F USD928105S US D928105 S1 USD928105 S1 US D928105S1 US 202029731623 F US202029731623 F US 202029731623F US D928105 S USD928105 S US D928105S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- line
- design
- dash
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The even broken lines illustrate portions of the semiconductor device that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.
In FIGS. 1 and 4 , the solid line extending in the vertical length direction, and which is co-linear with an even broken line at one end and a dash-dotted line at the other end, represents a claimed structure line of an electrode plate of the semiconductor device.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2019-23880F JP1664528S (en) | 2019-10-28 | 2019-10-28 | |
JP2019-023880 | 2019-10-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD928105S1 true USD928105S1 (en) | 2021-08-17 |
Family
ID=71663464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/731,623 Active USD928105S1 (en) | 2019-10-28 | 2020-04-16 | Semiconductor device |
Country Status (2)
Country | Link |
---|---|
US (1) | USD928105S1 (en) |
JP (1) | JP1664528S (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1699856S (en) | 2020-12-15 | 2021-11-15 | semiconductor element |
Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4346396A (en) * | 1979-03-12 | 1982-08-24 | Western Electric Co., Inc. | Electronic device assembly and methods of making same |
US4951124A (en) | 1986-10-24 | 1990-08-21 | Kabushiki Kaisha Toshiba | Semiconductor device |
US5459350A (en) * | 1993-01-13 | 1995-10-17 | Mitsubishi Denki Kabushiki Kaisha | Resin sealed type semiconductor device |
US5512784A (en) * | 1994-04-19 | 1996-04-30 | Jerrold Communications, General Instrument Corporation | Surge protector semiconductor subassembly for 3-lead transistor aotline package |
US5563441A (en) * | 1992-12-11 | 1996-10-08 | Mitsubishi Denki Kabushiki Kaisha | Lead frame assembly including a semiconductor device and a resistance wire |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD420983S (en) * | 1998-10-16 | 2000-02-22 | Ixys Corporation | Semiconductor power package with three leads |
US6100580A (en) | 1988-09-20 | 2000-08-08 | Hitachi, Ltd. | Semiconductor device having all outer leads extending from one side of a resin member |
US6362517B1 (en) * | 1999-09-22 | 2002-03-26 | Michael Ray Bell | High voltage package for electronic device |
US6404065B1 (en) * | 1998-07-31 | 2002-06-11 | I-Xys Corporation | Electrically isolated power semiconductor package |
USD489695S1 (en) * | 2002-03-29 | 2004-05-11 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD515520S1 (en) * | 2002-03-29 | 2006-02-21 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD729250S1 (en) * | 2013-07-30 | 2015-05-12 | Samsung Electronics Co., Ltd. | Semiconductor memory device |
USD730911S1 (en) * | 2014-05-02 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD736216S1 (en) * | 2014-07-30 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736213S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD769832S1 (en) * | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD874412S1 (en) * | 2018-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
USD901405S1 (en) * | 2017-03-28 | 2020-11-10 | Rohm Co., Ltd. | Semiconductor device |
USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
-
2019
- 2019-10-28 JP JPD2019-23880F patent/JP1664528S/ja active Active
-
2020
- 2020-04-16 US US29/731,623 patent/USD928105S1/en active Active
Patent Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4346396A (en) * | 1979-03-12 | 1982-08-24 | Western Electric Co., Inc. | Electronic device assembly and methods of making same |
US4951124A (en) | 1986-10-24 | 1990-08-21 | Kabushiki Kaisha Toshiba | Semiconductor device |
US6100580A (en) | 1988-09-20 | 2000-08-08 | Hitachi, Ltd. | Semiconductor device having all outer leads extending from one side of a resin member |
US5563441A (en) * | 1992-12-11 | 1996-10-08 | Mitsubishi Denki Kabushiki Kaisha | Lead frame assembly including a semiconductor device and a resistance wire |
US5459350A (en) * | 1993-01-13 | 1995-10-17 | Mitsubishi Denki Kabushiki Kaisha | Resin sealed type semiconductor device |
US5512784A (en) * | 1994-04-19 | 1996-04-30 | Jerrold Communications, General Instrument Corporation | Surge protector semiconductor subassembly for 3-lead transistor aotline package |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US6404065B1 (en) * | 1998-07-31 | 2002-06-11 | I-Xys Corporation | Electrically isolated power semiconductor package |
USD420983S (en) * | 1998-10-16 | 2000-02-22 | Ixys Corporation | Semiconductor power package with three leads |
US6362517B1 (en) * | 1999-09-22 | 2002-03-26 | Michael Ray Bell | High voltage package for electronic device |
USD489695S1 (en) * | 2002-03-29 | 2004-05-11 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD515520S1 (en) * | 2002-03-29 | 2006-02-21 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD769832S1 (en) * | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
USD729250S1 (en) * | 2013-07-30 | 2015-05-12 | Samsung Electronics Co., Ltd. | Semiconductor memory device |
USD730911S1 (en) * | 2014-05-02 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD736213S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736216S1 (en) * | 2014-07-30 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD901405S1 (en) * | 2017-03-28 | 2020-11-10 | Rohm Co., Ltd. | Semiconductor device |
USD874412S1 (en) * | 2018-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
Non-Patent Citations (1)
Title |
---|
Notice of Allowance issued for U.S. Appl. No. 29/731,618, dated Mar. 8, 2021, 12 pages. |
Also Published As
Publication number | Publication date |
---|---|
JP1664528S (en) | 2020-07-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |