USD420983S - Semiconductor power package with three leads - Google Patents

Semiconductor power package with three leads Download PDF

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Publication number
USD420983S
USD420983S US29/095,110 US9511098F USD420983S US D420983 S USD420983 S US D420983S US 9511098 F US9511098 F US 9511098F US D420983 S USD420983 S US D420983S
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US
United States
Prior art keywords
leads
semiconductor power
power package
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/095,110
Inventor
KangRim Choi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IXYS LLC
Original Assignee
IXYS LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IXYS LLC filed Critical IXYS LLC
Priority to US29/095,110 priority Critical patent/USD420983S/en
Assigned to IXYS CORPORATION reassignment IXYS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHOI, KANGRIM
Application granted granted Critical
Publication of USD420983S publication Critical patent/USD420983S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a semiconductor power package with three leads showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side elevational view thereof, the left side elevational view being a mirror image;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a rear elevational view thereof; and,
FIG. 6 is a front elevational view thereof.

Claims (1)

  1. The ornamental design for a semiconductor power package with three leads, as shown and described.
US29/095,110 1998-10-16 1998-10-16 Semiconductor power package with three leads Expired - Lifetime USD420983S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/095,110 USD420983S (en) 1998-10-16 1998-10-16 Semiconductor power package with three leads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/095,110 USD420983S (en) 1998-10-16 1998-10-16 Semiconductor power package with three leads

Publications (1)

Publication Number Publication Date
USD420983S true USD420983S (en) 2000-02-22

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US29/095,110 Expired - Lifetime USD420983S (en) 1998-10-16 1998-10-16 Semiconductor power package with three leads

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
USD877707S1 (en) * 2017-03-30 2020-03-10 Mitsubishi Electric Corporation Semiconductor package
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD922970S1 (en) * 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD277955S (en) * 1981-10-30 1985-03-12 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
USD288557S (en) * 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
US5754405A (en) * 1995-11-20 1998-05-19 Mitsubishi Semiconductor America, Inc. Stacked dual in-line package assembly
US5861721A (en) * 1996-11-25 1999-01-19 Beacon Light Products, Inc. Smooth switching module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD277955S (en) * 1981-10-30 1985-03-12 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
USD288557S (en) * 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
US5754405A (en) * 1995-11-20 1998-05-19 Mitsubishi Semiconductor America, Inc. Stacked dual in-line package assembly
US5861721A (en) * 1996-11-25 1999-01-19 Beacon Light Products, Inc. Smooth switching module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Ixys Corporation Product Catalog, p. 18, HiPerFET™ Power Mosfets.

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
USD877707S1 (en) * 2017-03-30 2020-03-10 Mitsubishi Electric Corporation Semiconductor package
USD908647S1 (en) 2017-03-30 2021-01-26 Mitsubishi Electric Corporation Semiconductor package
USD908646S1 (en) 2017-03-30 2021-01-26 Mitsubishi Electric Corporation Semiconductor package
USD909318S1 (en) 2017-03-30 2021-02-02 Mitsubishi Electric Corporation Semiconductor package
USD909317S1 (en) 2017-03-30 2021-02-02 Mitsubishi Electric Corporation Semiconductor package
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD922970S1 (en) * 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device

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