USD877707S1 - Semiconductor package - Google Patents

Description

FIG. 1 is a front, top and left side perspective view of a semiconductor package showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof; the right side view being a mirror image thereof;

FIG. 7 is a cross sectional view taken along line 7-7 of FIG. 2, with the internal system omitted; and,

FIG. 8 is another perspective view thereof, showing the state in use.

The parts shown in even dashed broken lines do not form part of the claimed design.

Claims (1)

CLAIM
1. The ornamental design for a semiconductor package, as shown and described.

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