USD902877S1 - Packaged semiconductor module - Google Patents
Packaged semiconductor module Download PDFInfo
- Publication number
- USD902877S1 USD902877S1 US29/672,087 US201829672087F USD902877S US D902877 S1 USD902877 S1 US D902877S1 US 201829672087 F US201829672087 F US 201829672087F US D902877 S USD902877 S US D902877S
- Authority
- US
- United States
- Prior art keywords
- semiconductor module
- packaged semiconductor
- packaged
- view
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
Claims (1)
- The ornamental design for a packaged semiconductor module, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-012838 | 2018-06-12 | ||
JPD2018-12838F JP1632999S (en) | 2018-06-12 | 2018-06-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD902877S1 true USD902877S1 (en) | 2020-11-24 |
Family
ID=66671668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/672,087 Active USD902877S1 (en) | 2018-06-12 | 2018-12-03 | Packaged semiconductor module |
Country Status (2)
Country | Link |
---|---|
US (1) | USD902877S1 (en) |
JP (1) | JP1632999S (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1711418S (en) | 2021-10-13 | 2022-03-31 | Semiconductor element | |
USD1009818S1 (en) | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
Citations (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3255055A (en) * | 1963-03-20 | 1966-06-07 | Hoffman Electronics Corp | Semiconductor device |
US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US3825876A (en) * | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
US4391408A (en) * | 1980-09-05 | 1983-07-05 | Augat Inc. | Low insertion force connector |
US4441119A (en) * | 1981-01-15 | 1984-04-03 | Mostek Corporation | Integrated circuit package |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
US4916519A (en) * | 1989-05-30 | 1990-04-10 | International Business Machines Corporation | Semiconductor package |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US5119269A (en) * | 1989-08-23 | 1992-06-02 | Seiko Epson Corporation | Semiconductor with a battery unit |
USD345731S (en) * | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
US5337216A (en) * | 1992-05-18 | 1994-08-09 | Square D Company | Multichip semiconductor small outline integrated circuit package structure |
USD358806S (en) * | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD359028S (en) * | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
US5434357A (en) * | 1991-12-23 | 1995-07-18 | Belcher; Donald K. | Reduced semiconductor size package |
US5557504A (en) * | 1993-08-31 | 1996-09-17 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with detachable module |
US5570273A (en) * | 1993-08-31 | 1996-10-29 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with low-profile detachable module |
US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
USD401912S (en) * | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US5959842A (en) * | 1998-05-14 | 1999-09-28 | Lucent Technologies Inc. | Surface mount power supply package and method of manufacture thereof |
US6093957A (en) * | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
USD432097S (en) * | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
USD448739S1 (en) * | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
USD466873S1 (en) * | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD472528S1 (en) * | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD824866S1 (en) * | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
-
2018
- 2018-06-12 JP JPD2018-12838F patent/JP1632999S/ja active Active
- 2018-12-03 US US29/672,087 patent/USD902877S1/en active Active
Patent Citations (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3255055A (en) * | 1963-03-20 | 1966-06-07 | Hoffman Electronics Corp | Semiconductor device |
US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3825876A (en) * | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
US4391408A (en) * | 1980-09-05 | 1983-07-05 | Augat Inc. | Low insertion force connector |
US4441119A (en) * | 1981-01-15 | 1984-04-03 | Mostek Corporation | Integrated circuit package |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US4916519A (en) * | 1989-05-30 | 1990-04-10 | International Business Machines Corporation | Semiconductor package |
US5119269A (en) * | 1989-08-23 | 1992-06-02 | Seiko Epson Corporation | Semiconductor with a battery unit |
US5434357A (en) * | 1991-12-23 | 1995-07-18 | Belcher; Donald K. | Reduced semiconductor size package |
US5337216A (en) * | 1992-05-18 | 1994-08-09 | Square D Company | Multichip semiconductor small outline integrated circuit package structure |
USD345731S (en) * | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
US5557504A (en) * | 1993-08-31 | 1996-09-17 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with detachable module |
US5570273A (en) * | 1993-08-31 | 1996-10-29 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with low-profile detachable module |
USD359028S (en) * | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD358806S (en) * | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD401912S (en) * | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US6093957A (en) * | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
US5959842A (en) * | 1998-05-14 | 1999-09-28 | Lucent Technologies Inc. | Surface mount power supply package and method of manufacture thereof |
USD432097S (en) * | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
USD448739S1 (en) * | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD466873S1 (en) * | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
USD472528S1 (en) * | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD824866S1 (en) * | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD969762S1 (en) | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
Also Published As
Publication number | Publication date |
---|---|
JP1632999S (en) | 2019-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD903611S1 (en) | Semiconductor device | |
USD881718S1 (en) | Packaging for bottles | |
USD859334S1 (en) | Semiconductor device | |
USD850782S1 (en) | Pill box | |
USD869618S1 (en) | Sink | |
USD881021S1 (en) | Packaging for bottles | |
USD920094S1 (en) | Food package | |
USD889956S1 (en) | Packaging | |
USD903612S1 (en) | Semiconductor module | |
USD903613S1 (en) | Semiconductor module | |
USD796459S1 (en) | Packaged semiconductor circuit module | |
USD856793S1 (en) | Package | |
USD932885S1 (en) | Package for foodstuff | |
USD934821S1 (en) | Semiconductor device | |
USD884662S1 (en) | Semiconductor module | |
USD902877S1 (en) | Packaged semiconductor module | |
USD932452S1 (en) | Semiconductor device | |
USD873424S1 (en) | Cover for foot | |
USD852765S1 (en) | Semiconductor device | |
USD872288S1 (en) | Cover for foot | |
USD934820S1 (en) | Semiconductor device | |
USD888818S1 (en) | Sunglasses | |
USD814615S1 (en) | Sink | |
USD937232S1 (en) | Semiconductor device | |
USD873224S1 (en) | Heatsink |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |