USD902877S1 - Packaged semiconductor module - Google Patents

Packaged semiconductor module Download PDF

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Publication number
USD902877S1
USD902877S1 US29/672,087 US201829672087F USD902877S US D902877 S1 USD902877 S1 US D902877S1 US 201829672087 F US201829672087 F US 201829672087F US D902877 S USD902877 S US D902877S
Authority
US
United States
Prior art keywords
semiconductor module
packaged semiconductor
packaged
view
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/672,087
Inventor
Shigeru Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
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Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIRATA, SHIGERU
Application granted granted Critical
Publication of USD902877S1 publication Critical patent/USD902877S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a packaged semiconductor module showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side view thereof; and,
FIG. 7 is a left side view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a packaged semiconductor module, as shown and described.
US29/672,087 2018-06-12 2018-12-03 Packaged semiconductor module Active USD902877S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-012838 2018-06-12
JPD2018-12838F JP1632999S (en) 2018-06-12 2018-06-12

Publications (1)

Publication Number Publication Date
USD902877S1 true USD902877S1 (en) 2020-11-24

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ID=66671668

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/672,087 Active USD902877S1 (en) 2018-06-12 2018-12-03 Packaged semiconductor module

Country Status (2)

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US (1) USD902877S1 (en)
JP (1) JP1632999S (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1711418S (en) 2021-10-13 2022-03-31 Semiconductor element
USD1009818S1 (en) 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device

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US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
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USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5119269A (en) * 1989-08-23 1992-06-02 Seiko Epson Corporation Semiconductor with a battery unit
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD358806S (en) * 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
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US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
US5646443A (en) * 1993-10-15 1997-07-08 Nec Corporation Semiconductor package
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5959842A (en) * 1998-05-14 1999-09-28 Lucent Technologies Inc. Surface mount power supply package and method of manufacture thereof
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module

Patent Citations (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3255055A (en) * 1963-03-20 1966-06-07 Hoffman Electronics Corp Semiconductor device
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US5119269A (en) * 1989-08-23 1992-06-02 Seiko Epson Corporation Semiconductor with a battery unit
US5434357A (en) * 1991-12-23 1995-07-18 Belcher; Donald K. Reduced semiconductor size package
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD358806S (en) * 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US5646443A (en) * 1993-10-15 1997-07-08 Nec Corporation Semiconductor package
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US5959842A (en) * 1998-05-14 1999-09-28 Lucent Technologies Inc. Surface mount power supply package and method of manufacture thereof
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package

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