USD903611S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD903611S1
USD903611S1 US29/697,804 US201929697804F USD903611S US D903611 S1 USD903611 S1 US D903611S1 US 201929697804 F US201929697804 F US 201929697804F US D903611 S USD903611 S US D903611S
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United States
Prior art keywords
semiconductor device
view
ornamental design
side perspective
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/697,804
Inventor
Hiroya Sannai
Tatsuya Kawase
Seiichiro Inokuchi
Naoki HIGASHIKAWA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIGASHIKAWA, NAOKI, INOKUCHI, SEIICHIRO, KAWASE, TATSUYA, Sannai, Hiroya
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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device showing our new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof;
FIG. 7 is a right side view thereof; and,
FIG. 8 is a left side view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/697,804 2019-03-29 2019-07-11 Semiconductor device Active USD903611S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-006781 2019-01-18
JP2019006781 2019-03-29

Publications (1)

Publication Number Publication Date
USD903611S1 true USD903611S1 (en) 2020-12-01

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ID=73528644

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US29/697,804 Active USD903611S1 (en) 2019-03-29 2019-07-11 Semiconductor device

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US (1) USD903611S1 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD927437S1 (en) * 2019-08-29 2021-08-10 Rohm Co., Ltd. Power semiconductor module
USD934189S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934188S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD934190S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934822S1 (en) 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD952585S1 (en) * 2020-03-16 2022-05-24 Dynatron Corporation Vapor chamber
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD976852S1 (en) * 2020-04-24 2023-01-31 Industrial Technology Research Institute Power module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board

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USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
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US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US20040227231A1 (en) * 2003-05-16 2004-11-18 Ballard Power Systems Corporation Power module with voltage overshoot limiting
US20070126445A1 (en) * 2005-11-30 2007-06-07 Micron Technology, Inc. Integrated circuit package testing devices and methods of making and using same
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USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
US9418975B1 (en) * 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
US20160276234A1 (en) * 2015-03-20 2016-09-22 Fuji Electric Co., Ltd. Semiconductor module and resin case
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device

Patent Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US20040227231A1 (en) * 2003-05-16 2004-11-18 Ballard Power Systems Corporation Power module with voltage overshoot limiting
US20070126445A1 (en) * 2005-11-30 2007-06-07 Micron Technology, Inc. Integrated circuit package testing devices and methods of making and using same
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD805485S1 (en) * 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD773412S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
US20160276234A1 (en) * 2015-03-20 2016-09-22 Fuji Electric Co., Ltd. Semiconductor module and resin case
US9418975B1 (en) * 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
An Office Action dated by the Japanese Patent Office on Sep. 3, 2019, which corresponds to Japanese Design Application No. 2019-006781 and is related to Design U.S. Appl. No. 29/697,804.

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD934822S1 (en) 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934189S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934188S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD934190S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD927437S1 (en) * 2019-08-29 2021-08-10 Rohm Co., Ltd. Power semiconductor module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD952585S1 (en) * 2020-03-16 2022-05-24 Dynatron Corporation Vapor chamber
USD976852S1 (en) * 2020-04-24 2023-01-31 Industrial Technology Research Institute Power module
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board

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