USD984397S1 - Circuit board - Google Patents

Circuit board Download PDF

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Publication number
USD984397S1
USD984397S1 US29/774,287 US202129774287F USD984397S US D984397 S1 USD984397 S1 US D984397S1 US 202129774287 F US202129774287 F US 202129774287F US D984397 S USD984397 S US D984397S
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US
United States
Prior art keywords
circuit board
view
elevational view
ornamental design
broken lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/774,287
Inventor
Yidong Cai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
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Individual
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Publication date
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Priority to US29/774,287 priority Critical patent/USD984397S1/en
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Publication of USD984397S1 publication Critical patent/USD984397S1/en
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Description

FIG. 1 is a perspective view of a circuit board showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines and lightened areas within the broken lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a circuit board, as shown and described.
US29/774,287 2021-03-16 2021-03-16 Circuit board Active USD984397S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/774,287 USD984397S1 (en) 2021-03-16 2021-03-16 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/774,287 USD984397S1 (en) 2021-03-16 2021-03-16 Circuit board

Publications (1)

Publication Number Publication Date
USD984397S1 true USD984397S1 (en) 2023-04-25

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ID=86008041

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/774,287 Active USD984397S1 (en) 2021-03-16 2021-03-16 Circuit board

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US (1) USD984397S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1012050S1 (en) * 2019-06-21 2024-01-23 Raspberry Pi (Trading) Limited Computer

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069496A (en) * 1976-12-30 1978-01-17 Honeywell Information Systems Inc. Reusable fixture for an integrated circuit chip
US4575747A (en) * 1982-09-20 1986-03-11 Siemens Aktiengesellschaft Device for protecting film-mounted integrated circuits against destruction due to electrostatic charges
US20110156225A1 (en) * 2008-09-10 2011-06-30 Renesas Electronics Corporation Semiconductor device and method of manufacturing the same
US20130329384A1 (en) * 2011-03-01 2013-12-12 Hitachi Automotive Systems, Ltd. Transmission Control Device and Electronic Circuit Device
US9645163B2 (en) * 2011-08-24 2017-05-09 Continental Teves Ag & Co. Ohg Sensor with a single electrical carrier means
USD805485S1 (en) * 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
US10015882B1 (en) * 2015-01-05 2018-07-03 Qorvo Us, Inc. Modular semiconductor package
US10271448B2 (en) * 2012-08-06 2019-04-23 Investar Corporation Thin leadframe QFN package design of RF front-ends for mobile wireless communication
US10375816B2 (en) * 2015-05-08 2019-08-06 Canon Kabushiki Kaisha Printed-circuit board, printed-wiring board, and electronic apparatus
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
US10980131B2 (en) * 2017-01-26 2021-04-13 Nano Dimension Technologies, Ltd. Chip embedded printed circuit boards and methods of fabrication
US11508646B2 (en) * 2018-04-12 2022-11-22 Mitsubishi Electric Corporation Semiconductor device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069496A (en) * 1976-12-30 1978-01-17 Honeywell Information Systems Inc. Reusable fixture for an integrated circuit chip
US4575747A (en) * 1982-09-20 1986-03-11 Siemens Aktiengesellschaft Device for protecting film-mounted integrated circuits against destruction due to electrostatic charges
US20110156225A1 (en) * 2008-09-10 2011-06-30 Renesas Electronics Corporation Semiconductor device and method of manufacturing the same
US20130329384A1 (en) * 2011-03-01 2013-12-12 Hitachi Automotive Systems, Ltd. Transmission Control Device and Electronic Circuit Device
US9645163B2 (en) * 2011-08-24 2017-05-09 Continental Teves Ag & Co. Ohg Sensor with a single electrical carrier means
US10271448B2 (en) * 2012-08-06 2019-04-23 Investar Corporation Thin leadframe QFN package design of RF front-ends for mobile wireless communication
USD805485S1 (en) * 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
US10015882B1 (en) * 2015-01-05 2018-07-03 Qorvo Us, Inc. Modular semiconductor package
US10375816B2 (en) * 2015-05-08 2019-08-06 Canon Kabushiki Kaisha Printed-circuit board, printed-wiring board, and electronic apparatus
US10980131B2 (en) * 2017-01-26 2021-04-13 Nano Dimension Technologies, Ltd. Chip embedded printed circuit boards and methods of fabrication
US11508646B2 (en) * 2018-04-12 2022-11-22 Mitsubishi Electric Corporation Semiconductor device
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1012050S1 (en) * 2019-06-21 2024-01-23 Raspberry Pi (Trading) Limited Computer

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