USD805485S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD805485S1
USD805485S1 US29/591,886 US201729591886F USD805485S US D805485 S1 USD805485 S1 US D805485S1 US 201729591886 F US201729591886 F US 201729591886F US D805485 S USD805485 S US D805485S
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Prior art keywords
semiconductor device
view
elevational view
broken lines
side perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/591,886
Inventor
Tatsuya Kawase
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to US29/591,886 priority Critical patent/USD805485S1/en
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Publication of USD805485S1 publication Critical patent/USD805485S1/en
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Description

FIG. 1 is a top, left and rear side perspective view of a semiconductor device, showing my new design;
FIG. 2 is bottom, right and rear side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is another top, left and rear side perspective view thereof, shown in a used condition mounted on a board shown in broken lines; and,
FIG. 10 is another rear view thereof, shown in a used condition mounted on a board shown in broken lines.
The broken lines shown in the drawing views in FIGS. 9 and 10 form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/591,886 2013-08-21 2017-01-25 Semiconductor device Active USD805485S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/591,886 USD805485S1 (en) 2013-08-21 2017-01-25 Semiconductor device

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2013-019056 2013-08-21
JP2013019057 2013-08-21
JP2013-019030 2013-08-21
JP2013019030 2013-08-21
JP2013-019057 2013-08-21
JP2013019056 2013-08-21
US29/472,087 USD754084S1 (en) 2013-08-21 2013-11-08 Semiconductor device
US29/555,470 USD785577S1 (en) 2013-08-21 2016-02-22 Semiconductor device
US29/591,886 USD805485S1 (en) 2013-08-21 2017-01-25 Semiconductor device

Related Parent Applications (1)

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US29/555,470 Division USD785577S1 (en) 2013-08-21 2016-02-22 Semiconductor device

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USD805485S1 true USD805485S1 (en) 2017-12-19

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US29/472,087 Active USD754084S1 (en) 2013-08-21 2013-11-08 Semiconductor device
US29/555,470 Active USD785577S1 (en) 2013-08-21 2016-02-22 Semiconductor device
US29/591,886 Active USD805485S1 (en) 2013-08-21 2017-01-25 Semiconductor device

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US29/472,087 Active USD754084S1 (en) 2013-08-21 2013-11-08 Semiconductor device
US29/555,470 Active USD785577S1 (en) 2013-08-21 2016-02-22 Semiconductor device

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USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD827593S1 (en) * 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD884662S1 (en) * 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD927437S1 (en) * 2019-08-29 2021-08-10 Rohm Co., Ltd. Power semiconductor module
USD934188S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD934189S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934190S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934822S1 (en) 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board

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USD754084S1 (en) 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD742581S1 (en) * 2013-12-09 2015-11-03 Kenall Manufacturing Company Driver housing
USD803663S1 (en) 2014-11-20 2017-11-28 Green Inova Lighting Technology Limited Bracket
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
CN104619117A (en) * 2015-02-20 2015-05-13 王镇山 Magnetic combined structure between circuit boards
USD865689S1 (en) * 2015-02-20 2019-11-05 Microduino Inc. Electrical module
JP1551317S (en) * 2015-09-30 2016-06-13
JP1551316S (en) * 2015-09-30 2016-06-13
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
JP1578687S (en) * 2016-11-08 2017-06-12
JP1586205S (en) * 2017-01-26 2017-09-19
USD853342S1 (en) * 2017-02-28 2019-07-09 Infineon Technologies Ag High-performance semiconductor module
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
JP1603980S (en) * 2017-09-07 2018-05-14
JP1604003S (en) * 2017-09-27 2018-05-14
JP1604002S (en) * 2017-09-27 2018-05-14
JP1603911S (en) * 2017-09-27 2018-05-14
JP1603793S (en) * 2017-09-29 2018-05-14
USD1003889S1 (en) * 2019-12-24 2023-11-07 Hangzhou Chipjet Technology Co., Ltd. Data processing chip
TWD206651S (en) * 2020-04-24 2020-08-21 財團法人工業技術研究院 Power module

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USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD875058S1 (en) 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD873227S1 (en) 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD884662S1 (en) * 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD934188S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD927437S1 (en) * 2019-08-29 2021-08-10 Rohm Co., Ltd. Power semiconductor module
USD934189S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934190S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934822S1 (en) 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board

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