USD719537S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD719537S1 USD719537S1 US29/464,434 US201329464434F USD719537S US D719537 S1 USD719537 S1 US D719537S1 US 201329464434 F US201329464434 F US 201329464434F US D719537 S USD719537 S US D719537S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- broken lines
- elevational view
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/503,992 USD769834S1 (en) | 2013-05-08 | 2014-10-01 | Semiconductor device |
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-010104 | 2013-01-23 | ||
JP2013-010102 | 2013-05-08 | ||
JP2013010099 | 2013-05-08 | ||
JP2013-010099 | 2013-05-08 | ||
JP2013-010103 | 2013-05-08 | ||
JP2013-010101 | 2013-05-08 | ||
JP2013010100 | 2013-05-08 | ||
JP2013010102 | 2013-05-08 | ||
JP2013010103 | 2013-05-08 | ||
JP2013-010100 | 2013-05-08 | ||
JP2013010101 | 2013-05-08 | ||
JP2013010104 | 2013-05-08 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/503,992 Division USD769834S1 (en) | 2013-05-08 | 2014-10-01 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
USD719537S1 true USD719537S1 (en) | 2014-12-16 |
Family
ID=52015596
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/464,434 Active USD719537S1 (en) | 2013-05-08 | 2013-08-16 | Semiconductor device |
US29/503,992 Active USD769834S1 (en) | 2013-05-08 | 2014-10-01 | Semiconductor device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/503,992 Active USD769834S1 (en) | 2013-05-08 | 2014-10-01 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (2) | USD719537S1 (en) |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
USD732093S1 (en) * | 2014-03-19 | 2015-06-16 | Veeco Ald Inc. | Gas tube assembly |
USD732092S1 (en) * | 2014-03-19 | 2015-06-16 | Veeco Ald Inc. | Gas injection plate |
USD742338S1 (en) * | 2014-08-27 | 2015-11-03 | Apple Inc. | MLB module for electronic device |
USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
USD762597S1 (en) * | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
USD785577S1 (en) * | 2013-08-21 | 2017-05-02 | Mitsubishi Electric Corporation | Semiconductor device |
USD803663S1 (en) | 2014-11-20 | 2017-11-28 | Green Inova Lighting Technology Limited | Bracket |
USD858467S1 (en) * | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
USD864132S1 (en) * | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
USD864882S1 (en) * | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD864883S1 (en) * | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD865690S1 (en) * | 2017-09-27 | 2019-11-05 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD873226S1 (en) * | 2018-04-13 | 2020-01-21 | Rohm Co., Ltd. | Semiconductor module |
USD874412S1 (en) * | 2018-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
USD874411S1 (en) * | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
USD903611S1 (en) * | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
USD906271S1 (en) | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
USD942403S1 (en) | 2019-10-24 | 2022-02-01 | Wolfspeed, Inc. | Power module having pin fins |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD742581S1 (en) * | 2013-12-09 | 2015-11-03 | Kenall Manufacturing Company | Driver housing |
JP1551317S (en) * | 2015-09-30 | 2016-06-13 | ||
JP1551316S (en) * | 2015-09-30 | 2016-06-13 | ||
USD799439S1 (en) * | 2016-05-31 | 2017-10-10 | Rohm Co., Ltd. | Power converting semiconductor module |
JP1643024S (en) * | 2019-03-15 | 2019-10-07 |
Family Cites Families (59)
Publication number | Priority date | Publication date | Assignee | Title |
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US3762039A (en) | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US3846734A (en) | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
US4422703A (en) * | 1981-09-15 | 1983-12-27 | Thomas & Betts Corporation | Electrical connector for use with multi-pin arrays |
US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
JPS58206147A (en) * | 1982-05-26 | 1983-12-01 | Fujitsu Ltd | Module of semiconductor device |
US4677526A (en) * | 1984-03-01 | 1987-06-30 | Augat Inc. | Plastic pin grid array chip carrier |
US4595794A (en) * | 1984-03-19 | 1986-06-17 | At&T Bell Laboratories | Component mounting apparatus |
USD288922S (en) | 1984-04-19 | 1987-03-24 | Thomson Components-Mostek Corporation | Zero power random access memory package |
JPS60239043A (en) | 1984-05-14 | 1985-11-27 | Oki Electric Ind Co Ltd | Manufacture of package for semiconductor device |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
USD317300S (en) | 1987-07-04 | 1991-06-04 | Terutomi Hasegawa | Semi-conductor mounting substrate |
USD316848S (en) | 1987-07-04 | 1991-05-14 | Terutomi Hasegawa | Mounting substrate for semiconductors |
USD318271S (en) | 1987-07-04 | 1991-07-16 | Terutomi Hasegawa | Substrate for mounting semiconductors |
US4987474A (en) * | 1987-09-18 | 1991-01-22 | Hitachi, Ltd. | Semiconductor device and method of manufacturing the same |
US4994902A (en) * | 1988-11-30 | 1991-02-19 | Hitachi, Ltd. | Semiconductor devices and electronic system incorporating them |
USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
USD359028S (en) | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD357672S (en) | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD357462S (en) * | 1993-09-16 | 1995-04-18 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD360619S (en) | 1993-09-16 | 1995-07-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD357671S (en) | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD358806S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD364383S (en) * | 1994-05-11 | 1995-11-21 | Fuji Electric Co., Ltd. | Semi-conductor element with terminal casing |
USD364385S (en) * | 1994-05-11 | 1995-11-21 | Fuji Electric Co., Ltd. | Semi-conductor element with terminal casing |
USD364384S (en) * | 1994-05-23 | 1995-11-21 | Fuji Electric Co., Ltd. | Semi-conductor element with terminal casing |
USD401912S (en) * | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD394244S (en) | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD389808S (en) | 1996-01-09 | 1998-01-27 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD396450S (en) | 1996-12-24 | 1998-07-28 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD397092S (en) * | 1997-01-03 | 1998-08-18 | Fujitsu Limited | Integrated circuit package |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
EP0884781A3 (en) | 1997-06-12 | 1999-06-30 | Hitachi, Ltd. | Power semiconductor module |
USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD441726S1 (en) * | 1999-07-14 | 2001-05-08 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Semiconductor element |
USD441727S1 (en) * | 2000-10-04 | 2001-05-08 | Sony Corporation | Semiconductor element |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
JP2003077939A (en) | 2001-09-05 | 2003-03-14 | Mitsubishi Electric Corp | Semiconductor device and method of manufacturing same |
USD470825S1 (en) | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD476959S1 (en) | 2002-07-31 | 2003-07-08 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505399S1 (en) | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505400S1 (en) | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD548203S1 (en) | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD539761S1 (en) | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
JP5041798B2 (en) * | 2006-12-15 | 2012-10-03 | 三菱電機株式会社 | Semiconductor device |
USD587662S1 (en) | 2007-12-20 | 2009-03-03 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
USD589012S1 (en) | 2008-03-17 | 2009-03-24 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
USD606951S1 (en) | 2008-11-14 | 2009-12-29 | Fuji Electric Device Technology Co, Ltd. | Semiconductor device |
JP2010147116A (en) | 2008-12-17 | 2010-07-01 | Mitsubishi Electric Corp | Semiconductor device |
USD653634S1 (en) | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD653633S1 (en) | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD674760S1 (en) | 2011-04-01 | 2013-01-22 | Fuji Electric Co., Ltd. | Semiconductor device |
USD686174S1 (en) | 2011-08-12 | 2013-07-16 | Fuji Electric Co., Ltd | Semiconductor device |
USD704671S1 (en) | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD704670S1 (en) | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD705184S1 (en) | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
-
2013
- 2013-08-16 US US29/464,434 patent/USD719537S1/en active Active
-
2014
- 2014-10-01 US US29/503,992 patent/USD769834S1/en active Active
Cited By (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD874411S1 (en) * | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
USD805485S1 (en) | 2013-08-21 | 2017-12-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD785577S1 (en) * | 2013-08-21 | 2017-05-02 | Mitsubishi Electric Corporation | Semiconductor device |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
USD732093S1 (en) * | 2014-03-19 | 2015-06-16 | Veeco Ald Inc. | Gas tube assembly |
USD732092S1 (en) * | 2014-03-19 | 2015-06-16 | Veeco Ald Inc. | Gas injection plate |
USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
USD762597S1 (en) * | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
USD742338S1 (en) * | 2014-08-27 | 2015-11-03 | Apple Inc. | MLB module for electronic device |
USD803663S1 (en) | 2014-11-20 | 2017-11-28 | Green Inova Lighting Technology Limited | Bracket |
USD864132S1 (en) * | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
USD858467S1 (en) * | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
USD875058S1 (en) | 2017-01-05 | 2020-02-11 | Rohm Co., Ltd. | Power semiconductor module |
USD864882S1 (en) * | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD864883S1 (en) * | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD865690S1 (en) * | 2017-09-27 | 2019-11-05 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
USD873227S1 (en) | 2017-10-23 | 2020-01-21 | Mitsubishi Electric Corporation | Semiconductor device |
USD873226S1 (en) * | 2018-04-13 | 2020-01-21 | Rohm Co., Ltd. | Semiconductor module |
USD874412S1 (en) * | 2018-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
USD906271S1 (en) | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
USD978809S1 (en) | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
USD903611S1 (en) * | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
USD942403S1 (en) | 2019-10-24 | 2022-02-01 | Wolfspeed, Inc. | Power module having pin fins |
USD985517S1 (en) | 2019-10-24 | 2023-05-09 | Wolfspeed, Inc | Power module having pin fins |
Also Published As
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