USD719537S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD719537S1
USD719537S1 US29/464,434 US201329464434F USD719537S US D719537 S1 USD719537 S1 US D719537S1 US 201329464434 F US201329464434 F US 201329464434F US D719537 S USD719537 S US D719537S
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US
United States
Prior art keywords
semiconductor
elevational
broken lines
ornamental
condition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/464,434
Inventor
Tatsuya Kawase
Noboru Miyamoto
Mikio Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2013-010104 priority Critical
Priority to JP2013-010102 priority
Priority to JP2013010101 priority
Priority to JP2013010104 priority
Priority to JP2013-010103 priority
Priority to JP2013010102 priority
Priority to JP2013-010100 priority
Priority to JP2013010103 priority
Priority to JP2013010100 priority
Priority to JP2013-010099 priority
Priority to JP2013010099 priority
Priority to JP2013-010101 priority
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISHIHARA, MIKIO, KAWASE, TATSUYA, MIYAMOTO, NOBORU
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Publication of USD719537S1 publication Critical patent/USD719537S1/en
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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a rear, top and left side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a perspective view shown in a used condition with a device shown in broken lines; and,

FIG. 10 is a front view shown in a used condition with a device shown in broken lines.

The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/464,434 2013-05-08 2013-08-16 Semiconductor device Active USD719537S1 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP2013-010104 2013-01-23
JP2013-010102 2013-01-23
JP2013-010103 2013-05-08
JP2013010102 2013-05-08
JP2013-010100 2013-05-08
JP2013010103 2013-05-08
JP2013010100 2013-05-08
JP2013-010099 2013-05-08
JP2013010099 2013-05-08
JP2013-010101 2013-05-08
JP2013010101 2013-05-08
JP2013010104 2013-05-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/503,992 USD769834S1 (en) 2013-05-08 2014-10-01 Semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/503,992 Division USD769834S1 (en) 2013-05-08 2014-10-01 Semiconductor device

Publications (1)

Publication Number Publication Date
USD719537S1 true USD719537S1 (en) 2014-12-16

Family

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Family Applications (2)

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US29/464,434 Active USD719537S1 (en) 2013-05-08 2013-08-16 Semiconductor device
US29/503,992 Active USD769834S1 (en) 2013-05-08 2014-10-01 Semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/503,992 Active USD769834S1 (en) 2013-05-08 2014-10-01 Semiconductor device

Country Status (1)

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US (2) USD719537S1 (en)

Cited By (23)

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USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732093S1 (en) * 2014-03-19 2015-06-16 Veeco Ald Inc. Gas tube assembly
USD732092S1 (en) * 2014-03-19 2015-06-16 Veeco Ald Inc. Gas injection plate
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD803663S1 (en) 2014-11-20 2017-11-28 Green Inova Lighting Technology Limited Bracket
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD873226S1 (en) * 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module

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USD742581S1 (en) * 2013-12-09 2015-11-03 Kenall Manufacturing Company Driver housing
JP1551316S (en) * 2015-09-30 2016-06-13
JP1551317S (en) * 2015-09-30 2016-06-13
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module

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Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732093S1 (en) * 2014-03-19 2015-06-16 Veeco Ald Inc. Gas tube assembly
USD732092S1 (en) * 2014-03-19 2015-06-16 Veeco Ald Inc. Gas injection plate
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD803663S1 (en) 2014-11-20 2017-11-28 Green Inova Lighting Technology Limited Bracket
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD875058S1 (en) 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD873227S1 (en) 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD873226S1 (en) * 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module

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