USD719537S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD719537S1
USD719537S1 US29/464,434 US201329464434F USD719537S US D719537 S1 USD719537 S1 US D719537S1 US 201329464434 F US201329464434 F US 201329464434F US D719537 S USD719537 S US D719537S
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US
United States
Prior art keywords
semiconductor device
view
broken lines
elevational view
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/464,434
Inventor
Tatsuya Kawase
Noboru Miyamoto
Mikio Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISHIHARA, MIKIO, KAWASE, TATSUYA, MIYAMOTO, NOBORU
Priority to US29/503,992 priority Critical patent/USD769834S1/en
Application granted granted Critical
Publication of USD719537S1 publication Critical patent/USD719537S1/en
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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a rear, top and left side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is a perspective view shown in a used condition with a device shown in broken lines; and,
FIG. 10 is a front view shown in a used condition with a device shown in broken lines.
The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/464,434 2013-05-08 2013-08-16 Semiconductor device Active USD719537S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/503,992 USD769834S1 (en) 2013-05-08 2014-10-01 Semiconductor device

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2013-010104 2013-01-23
JP2013-010102 2013-05-08
JP2013010099 2013-05-08
JP2013-010099 2013-05-08
JP2013-010103 2013-05-08
JP2013-010101 2013-05-08
JP2013010100 2013-05-08
JP2013010102 2013-05-08
JP2013010103 2013-05-08
JP2013-010100 2013-05-08
JP2013010101 2013-05-08
JP2013010104 2013-05-08

Related Child Applications (1)

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US29/503,992 Division USD769834S1 (en) 2013-05-08 2014-10-01 Semiconductor device

Publications (1)

Publication Number Publication Date
USD719537S1 true USD719537S1 (en) 2014-12-16

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US29/464,434 Active USD719537S1 (en) 2013-05-08 2013-08-16 Semiconductor device
US29/503,992 Active USD769834S1 (en) 2013-05-08 2014-10-01 Semiconductor device

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Cited By (27)

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USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732093S1 (en) * 2014-03-19 2015-06-16 Veeco Ald Inc. Gas tube assembly
USD732092S1 (en) * 2014-03-19 2015-06-16 Veeco Ald Inc. Gas injection plate
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD803663S1 (en) 2014-11-20 2017-11-28 Green Inova Lighting Technology Limited Bracket
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD873226S1 (en) * 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD906271S1 (en) 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD942403S1 (en) 2019-10-24 2022-02-01 Wolfspeed, Inc. Power module having pin fins

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD742581S1 (en) * 2013-12-09 2015-11-03 Kenall Manufacturing Company Driver housing
JP1551317S (en) * 2015-09-30 2016-06-13
JP1551316S (en) * 2015-09-30 2016-06-13
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
JP1643024S (en) * 2019-03-15 2019-10-07

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762039A (en) 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3846734A (en) 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4422703A (en) * 1981-09-15 1983-12-27 Thomas & Betts Corporation Electrical connector for use with multi-pin arrays
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
JPS58206147A (en) * 1982-05-26 1983-12-01 Fujitsu Ltd Module of semiconductor device
US4677526A (en) * 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
US4595794A (en) * 1984-03-19 1986-06-17 At&T Bell Laboratories Component mounting apparatus
USD288922S (en) 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
JPS60239043A (en) 1984-05-14 1985-11-27 Oki Electric Ind Co Ltd Manufacture of package for semiconductor device
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
USD317300S (en) 1987-07-04 1991-06-04 Terutomi Hasegawa Semi-conductor mounting substrate
USD316848S (en) 1987-07-04 1991-05-14 Terutomi Hasegawa Mounting substrate for semiconductors
USD318271S (en) 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US4994902A (en) * 1988-11-30 1991-02-19 Hitachi, Ltd. Semiconductor devices and electronic system incorporating them
USD345731S (en) 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD357672S (en) 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357462S (en) * 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD360619S (en) 1993-09-16 1995-07-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357671S (en) 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD364383S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364385S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364384S (en) * 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD394244S (en) 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD389808S (en) 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396450S (en) 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
EP0884781A3 (en) 1997-06-12 1999-06-30 Hitachi, Ltd. Power semiconductor module
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
USD441727S1 (en) * 2000-10-04 2001-05-08 Sony Corporation Semiconductor element
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
JP2003077939A (en) 2001-09-05 2003-03-14 Mitsubishi Electric Corp Semiconductor device and method of manufacturing same
USD470825S1 (en) 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD476959S1 (en) 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD548203S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
JP5041798B2 (en) * 2006-12-15 2012-10-03 三菱電機株式会社 Semiconductor device
USD587662S1 (en) 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
JP2010147116A (en) 2008-12-17 2010-07-01 Mitsubishi Electric Corp Semiconductor device
USD653634S1 (en) 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD674760S1 (en) 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD686174S1 (en) 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD704671S1 (en) 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704670S1 (en) 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD705184S1 (en) 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module

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USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732093S1 (en) * 2014-03-19 2015-06-16 Veeco Ald Inc. Gas tube assembly
USD732092S1 (en) * 2014-03-19 2015-06-16 Veeco Ald Inc. Gas injection plate
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD803663S1 (en) 2014-11-20 2017-11-28 Green Inova Lighting Technology Limited Bracket
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD875058S1 (en) 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD873227S1 (en) 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD873226S1 (en) * 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD978809S1 (en) 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD942403S1 (en) 2019-10-24 2022-02-01 Wolfspeed, Inc. Power module having pin fins
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