USD906271S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD906271S1
USD906271S1 US29/666,024 US201829666024F USD906271S US D906271 S1 USD906271 S1 US D906271S1 US 201829666024 F US201829666024 F US 201829666024F US D906271 S USD906271 S US D906271S
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United States
Prior art keywords
semiconductor module
view
design
taken along
sectional
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Application number
US29/666,024
Inventor
Takumi Kanda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2018-8229F external-priority patent/JP1615979S/ja
Priority claimed from JPD2018-8227F external-priority patent/JP1615884S/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KANDA, TAKUMI, HAYASHIGUCHI, Masashi
Priority to US29/757,007 priority Critical patent/USD978809S1/en
Application granted granted Critical
Publication of USD906271S1 publication Critical patent/USD906271S1/en
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FIG. 1 is a front, top and right side perspective view of a semiconductor module showing our new design;
FIG. 2 is a rear, bottom, and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side view, the left side view being identical to FIG. 7;
FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 5; and,
FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 5.
The even broken lines illustrate portions of the semiconductor module and form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module, as shown and described.
US29/666,024 2018-04-13 2018-10-09 Semiconductor module Active USD906271S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/757,007 USD978809S1 (en) 2018-04-13 2020-11-02 Semiconductor module

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPD2018-8229F JP1615979S (en) 2018-04-13 2018-04-13
JP2018-008229 2018-04-13
JP2018-008227 2018-04-13
JPD2018-8227F JP1615884S (en) 2018-04-13 2018-04-13

Related Child Applications (1)

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US29/757,007 Division USD978809S1 (en) 2018-04-13 2020-11-02 Semiconductor module

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USD906271S1 true USD906271S1 (en) 2020-12-29

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US29/666,024 Active USD906271S1 (en) 2018-04-13 2018-10-09 Semiconductor module
US29/757,007 Active USD978809S1 (en) 2018-04-13 2020-11-02 Semiconductor module

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US29/757,007 Active USD978809S1 (en) 2018-04-13 2020-11-02 Semiconductor module

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD999747S1 (en) * 2020-07-31 2023-09-26 Rohm Co., Ltd. Semiconductor device
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1034494S1 (en) * 2020-07-31 2024-07-09 Rohm Co., Ltd. Semiconductor device
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device

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JP1716066S (en) * 2021-09-01 2022-05-27 fuse
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
JP1711418S (en) * 2021-10-13 2022-03-31 Semiconductor element
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD999747S1 (en) * 2020-07-31 2023-09-26 Rohm Co., Ltd. Semiconductor device
USD1034494S1 (en) * 2020-07-31 2024-07-09 Rohm Co., Ltd. Semiconductor device
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device

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