USD906271S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD906271S1 USD906271S1 US29/666,024 US201829666024F USD906271S US D906271 S1 USD906271 S1 US D906271S1 US 201829666024 F US201829666024 F US 201829666024F US D906271 S USD906271 S US D906271S
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- US
- United States
- Prior art keywords
- semiconductor module
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- design
- taken along
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The even broken lines illustrate portions of the semiconductor module and form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.
Claims (1)
- The ornamental design for a semiconductor module, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/757,007 USD978809S1 (en) | 2018-04-13 | 2020-11-02 | Semiconductor module |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2018-8229F JP1615979S (en) | 2018-04-13 | 2018-04-13 | |
JP2018-008229 | 2018-04-13 | ||
JP2018-008227 | 2018-04-13 | ||
JPD2018-8227F JP1615884S (en) | 2018-04-13 | 2018-04-13 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/757,007 Division USD978809S1 (en) | 2018-04-13 | 2020-11-02 | Semiconductor module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD906271S1 true USD906271S1 (en) | 2020-12-29 |
Family
ID=74041451
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/666,024 Active USD906271S1 (en) | 2018-04-13 | 2018-10-09 | Semiconductor module |
US29/757,007 Active USD978809S1 (en) | 2018-04-13 | 2020-11-02 | Semiconductor module |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/757,007 Active USD978809S1 (en) | 2018-04-13 | 2020-11-02 | Semiconductor module |
Country Status (1)
Country | Link |
---|---|
US (2) | USD906271S1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
USD999747S1 (en) * | 2020-07-31 | 2023-09-26 | Rohm Co., Ltd. | Semiconductor device |
USD1021829S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
USD1021830S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
USD1022932S1 (en) * | 2021-03-16 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
USD1034494S1 (en) * | 2020-07-31 | 2024-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD1046800S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
USD1046801S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1716066S (en) * | 2021-09-01 | 2022-05-27 | fuse | |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
JP1711418S (en) * | 2021-10-13 | 2022-03-31 | Semiconductor element | |
USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
Citations (48)
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USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
USD357462S (en) * | 1993-09-16 | 1995-04-18 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD357671S (en) * | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
US5410450A (en) * | 1991-12-10 | 1995-04-25 | Fuji Electric Co., Ltd. | Internal wiring structure of a semiconductor device |
US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
USD394244S (en) | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD401912S (en) | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD448739S1 (en) | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
USD470825S1 (en) * | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505399S1 (en) | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD606951S1 (en) | 2008-11-14 | 2009-12-29 | Fuji Electric Device Technology Co, Ltd. | Semiconductor device |
US20100149774A1 (en) * | 2008-12-17 | 2010-06-17 | Mitsubishi Electric Corporation | Semiconductor device |
US20110044012A1 (en) * | 2006-12-15 | 2011-02-24 | Mitsubishi Electric Corporation | Semiconductor device |
US8107255B2 (en) * | 2007-09-27 | 2012-01-31 | Sanyo Semiconductor Co., Ltd. | Circuit device and method of manufacturing the same |
USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD705184S1 (en) | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD712853S1 (en) * | 2012-12-21 | 2014-09-09 | Fuji Electric Co., Ltd. | Semiconductor module |
USD717254S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717255S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719537S1 (en) | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
USD719926S1 (en) | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD721048S1 (en) * | 2013-06-17 | 2015-01-13 | Fuji Electric Co., Ltd. | Semiconductor module |
USD721340S1 (en) * | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
JP1551590S (en) | 2015-11-30 | 2016-06-13 | ||
USD766851S1 (en) * | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
USD767516S1 (en) * | 2015-02-04 | 2016-09-27 | Mitsubishi Electric Corporation | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
JP1565636S (en) | 2016-03-11 | 2016-12-19 | ||
JP1578687S (en) | 2016-11-08 | 2017-06-12 |
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US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
US4441119A (en) * | 1981-01-15 | 1984-04-03 | Mostek Corporation | Integrated circuit package |
USD288557S (en) * | 1984-09-10 | 1987-03-03 | Motorola, Inc. | Semiconductor housing |
KR880014671A (en) * | 1987-05-27 | 1988-12-24 | 미다 가쓰시게 | Resin Filled Semiconductor Device |
US5172213A (en) * | 1991-05-23 | 1992-12-15 | At&T Bell Laboratories | Molded circuit package having heat dissipating post |
US5434357A (en) * | 1991-12-23 | 1995-07-18 | Belcher; Donald K. | Reduced semiconductor size package |
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
USD359028S (en) * | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD358806S (en) * | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
JP3362530B2 (en) * | 1993-12-16 | 2003-01-07 | セイコーエプソン株式会社 | Resin-sealed semiconductor device and method of manufacturing the same |
US5486720A (en) * | 1994-05-26 | 1996-01-23 | Analog Devices, Inc. | EMF shielding of an integrated circuit package |
JPH09307051A (en) * | 1996-05-15 | 1997-11-28 | Toshiba Corp | Semiconductor device sealed by resin and method of manufacturing it |
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
USD396213S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396212S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
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JPH1146361A (en) | 1997-07-25 | 1999-02-16 | Mitsubishi Electric Corp | Image compression method and device, digital camera, portable information terminal, image expansion device and image transmission system |
JPH1145764A (en) | 1997-07-28 | 1999-02-16 | Hosiden Corp | Jack |
JPH1146362A (en) | 1997-07-28 | 1999-02-16 | Victor Co Of Japan Ltd | Video reproducing device |
US5959842A (en) * | 1998-05-14 | 1999-09-28 | Lucent Technologies Inc. | Surface mount power supply package and method of manufacture thereof |
USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
US6891276B1 (en) * | 2002-01-09 | 2005-05-10 | Bridge Semiconductor Corporation | Semiconductor package device |
JP4294405B2 (en) * | 2003-07-31 | 2009-07-15 | 株式会社ルネサステクノロジ | Semiconductor device |
JP1603175S (en) * | 2017-10-19 | 2018-05-07 | ||
JP1603359S (en) * | 2017-10-19 | 2018-05-07 | ||
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
-
2018
- 2018-10-09 US US29/666,024 patent/USD906271S1/en active Active
-
2020
- 2020-11-02 US US29/757,007 patent/USD978809S1/en active Active
Patent Citations (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3825876A (en) * | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US4391408A (en) * | 1980-09-05 | 1983-07-05 | Augat Inc. | Low insertion force connector |
USD288922S (en) * | 1984-04-19 | 1987-03-24 | Thomson Components-Mostek Corporation | Zero power random access memory package |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US5410450A (en) * | 1991-12-10 | 1995-04-25 | Fuji Electric Co., Ltd. | Internal wiring structure of a semiconductor device |
USD357462S (en) * | 1993-09-16 | 1995-04-18 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD357671S (en) * | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
USD401912S (en) | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD394244S (en) | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD448739S1 (en) | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD470825S1 (en) * | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505399S1 (en) | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
US20110044012A1 (en) * | 2006-12-15 | 2011-02-24 | Mitsubishi Electric Corporation | Semiconductor device |
US8107255B2 (en) * | 2007-09-27 | 2012-01-31 | Sanyo Semiconductor Co., Ltd. | Circuit device and method of manufacturing the same |
USD606951S1 (en) | 2008-11-14 | 2009-12-29 | Fuji Electric Device Technology Co, Ltd. | Semiconductor device |
US20100149774A1 (en) * | 2008-12-17 | 2010-06-17 | Mitsubishi Electric Corporation | Semiconductor device |
USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD717256S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717255S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719926S1 (en) | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD721340S1 (en) * | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD712853S1 (en) * | 2012-12-21 | 2014-09-09 | Fuji Electric Co., Ltd. | Semiconductor module |
USD719537S1 (en) | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
USD721048S1 (en) * | 2013-06-17 | 2015-01-13 | Fuji Electric Co., Ltd. | Semiconductor module |
USD705184S1 (en) | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
USD766851S1 (en) * | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
USD767516S1 (en) * | 2015-02-04 | 2016-09-27 | Mitsubishi Electric Corporation | Semiconductor device |
USD773412S1 (en) * | 2015-02-04 | 2016-12-06 | Mitsubishi Electric Corporation | Semiconductor device |
USD773413S1 (en) * | 2015-02-04 | 2016-12-06 | Mitsubishi Electric Corporation | Semiconductor device |
JP1551590S (en) | 2015-11-30 | 2016-06-13 | ||
JP1565636S (en) | 2016-03-11 | 2016-12-19 | ||
JP1578687S (en) | 2016-11-08 | 2017-06-12 | ||
USD810036S1 (en) * | 2016-11-08 | 2018-02-13 | Fuji Electric Co., Ltd. | Semiconductor module |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
USD999747S1 (en) * | 2020-07-31 | 2023-09-26 | Rohm Co., Ltd. | Semiconductor device |
USD1034494S1 (en) * | 2020-07-31 | 2024-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
USD1021829S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
USD1021830S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
USD1022932S1 (en) * | 2021-03-16 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
USD1046800S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
USD1046801S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
Also Published As
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