USD717255S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD717255S1
USD717255S1 US29/450,510 US201329450510F USD717255S US D717255 S1 USD717255 S1 US D717255S1 US 201329450510 F US201329450510 F US 201329450510F US D717255 S USD717255 S US D717255S
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US
United States
Prior art keywords
semiconductor device
view
ornamental design
perspective
taken along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/450,510
Inventor
Jae Hyun Lim
Jin Suk SON
Jin Su Kim
Jong Man KIM
Joon Hyung Cho
Kee Ju UM
Min Gyu Park
Kyu Hwan Oh
Chang Jae Heo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHO, JOON HYUNG, HEO, CHANG JAE, KIM, JIN SU, KIM, JONG MAN, LIM, JAE HYUN, OH, KYU HWAN, PARK, MIN GYU, SON, JIN SUK, UM, KEE JU
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Publication of USD717255S1 publication Critical patent/USD717255S1/en
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Description

FIG. 1 is a perspective view of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof, the right side view thereof being a mirror image;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a cross sectional view thereof taken along lines 7-7 of FIG. 2.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/450,510 2012-09-20 2013-03-18 Semiconductor device Active USD717255S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20120045471 2012-09-20
KR30-2012-0045471 2012-09-20

Publications (1)

Publication Number Publication Date
USD717255S1 true USD717255S1 (en) 2014-11-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/450,510 Active USD717255S1 (en) 2012-09-20 2013-03-18 Semiconductor device

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US (1) USD717255S1 (en)

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD819037S1 (en) * 2016-01-22 2018-05-29 Shenzhen Longsys Electronics Co., Ltd. SSD storage module
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD873226S1 (en) * 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD906271S1 (en) 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD954666S1 (en) * 2019-05-03 2022-06-14 Lumileds Holding B.V. Flexible circuit board
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD999747S1 (en) * 2020-07-31 2023-09-26 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1017533S1 (en) * 2022-01-28 2024-03-12 Mitsubishi Electric Corporation Semiconductor device
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1034494S1 (en) * 2020-07-31 2024-07-09 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device

Cited By (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD819037S1 (en) * 2016-01-22 2018-05-29 Shenzhen Longsys Electronics Co., Ltd. SSD storage module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD873226S1 (en) * 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD978809S1 (en) 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD954666S1 (en) * 2019-05-03 2022-06-14 Lumileds Holding B.V. Flexible circuit board
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD999747S1 (en) * 2020-07-31 2023-09-26 Rohm Co., Ltd. Semiconductor device
USD1034494S1 (en) * 2020-07-31 2024-07-09 Rohm Co., Ltd. Semiconductor device
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1017533S1 (en) * 2022-01-28 2024-03-12 Mitsubishi Electric Corporation Semiconductor device
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module

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