USD1022932S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD1022932S1
USD1022932S1 US29/807,561 US202129807561F USD1022932S US D1022932 S1 USD1022932 S1 US D1022932S1 US 202129807561 F US202129807561 F US 202129807561F US D1022932 S USD1022932 S US D1022932S
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United States
Prior art keywords
semiconductor module
view
design
semiconductor
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
US29/807,561
Inventor
Yoshihisa Tsukamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021005348F external-priority patent/JP1703009S/en
Priority claimed from JP2021005344F external-priority patent/JP1703006S/en
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TSUKAMOTO, YOSHIHISA
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FIG. 1 is a front, top and right side perspective view of a first embodiment of a semiconductor module showing my new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side view thereof; and,
FIG. 8 is a left side view thereof.
The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module, as shown and described.
US29/807,561 2021-03-16 2021-09-13 Semiconductor module Active USD1022932S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021005348F JP1703009S (en) 2021-03-16 2021-03-16 semiconductor module
JP2021-005348D 2021-03-16
JP2021005344F JP1703006S (en) 2021-03-16 2021-03-16 semiconductor module
JP2021-005344D 2021-03-16

Publications (1)

Publication Number Publication Date
USD1022932S1 true USD1022932S1 (en) 2024-04-16

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ID=90624820

Family Applications (1)

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US29/807,561 Active USD1022932S1 (en) 2021-03-16 2021-09-13 Semiconductor module

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US (1) USD1022932S1 (en)

Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
JP1615979S (en) 2018-04-13 2018-10-15
JP1615884S (en) 2018-04-13 2018-10-15
JP1629924S (en) 2018-06-26 2019-04-22
JP1630154S (en) 2018-06-26 2019-04-22
US20190198431A1 (en) * 2017-12-22 2019-06-27 Mitsubishi Electric Corporation Semiconductor module using lead frame for power and control terminals and both having asymmetric or inhomogeneous configuration
JP1641098S (en) 2018-06-26 2019-09-09
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
JP1672265S (en) 2020-02-28 2020-11-09
JP1672224S (en) 2020-02-28 2020-11-09
JP1672225S (en) 2020-02-28 2020-11-09
JP1672263S (en) 2020-01-28 2020-11-09
JP1672218S (en) 2020-01-28 2020-11-09
JP1672264S (en) 2020-02-28 2020-11-09
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
JP1684232S (en) 2020-01-28 2021-04-26
JP1684149S (en) 2020-01-28 2021-04-26
JP1684230S (en) 2020-01-28 2021-04-26
JP1684231S (en) 2020-01-28 2021-04-26
JP1684233S (en) 2020-01-28 2021-04-26
US20220223568A1 (en) * 2019-05-27 2022-07-14 Rohm Co., Ltd. Semiconductor device
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
US20230109471A1 (en) * 2020-04-01 2023-04-06 Rohm Co., Ltd. Electronic device
US20230121777A1 (en) * 2020-04-01 2023-04-20 Rohm Co., Ltd. Electronic device
US20230163078A1 (en) * 2020-03-19 2023-05-25 Rohm Co., Ltd. Semiconductor device
US20230178461A1 (en) * 2020-04-17 2023-06-08 Rohm Co., Ltd. Semiconductor device
US20230207440A1 (en) * 2020-06-08 2023-06-29 Rohm Co., Ltd. Semiconductor device
USD993201S1 (en) * 2021-03-09 2023-07-25 Rohm Co., Ltd. Semiconductor module

Patent Citations (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
US20190198431A1 (en) * 2017-12-22 2019-06-27 Mitsubishi Electric Corporation Semiconductor module using lead frame for power and control terminals and both having asymmetric or inhomogeneous configuration
JP1615884S (en) 2018-04-13 2018-10-15
JP1615979S (en) 2018-04-13 2018-10-15
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
JP1629924S (en) 2018-06-26 2019-04-22
JP1630154S (en) 2018-06-26 2019-04-22
USD903613S1 (en) * 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
JP1641098S (en) 2018-06-26 2019-09-09
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
US20220223568A1 (en) * 2019-05-27 2022-07-14 Rohm Co., Ltd. Semiconductor device
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
JP1684231S (en) 2020-01-28 2021-04-26
JP1672218S (en) 2020-01-28 2020-11-09
JP1672263S (en) 2020-01-28 2020-11-09
JP1684232S (en) 2020-01-28 2021-04-26
JP1684149S (en) 2020-01-28 2021-04-26
JP1684230S (en) 2020-01-28 2021-04-26
JP1684233S (en) 2020-01-28 2021-04-26
JP1672264S (en) 2020-02-28 2020-11-09
JP1672265S (en) 2020-02-28 2020-11-09
JP1672224S (en) 2020-02-28 2020-11-09
JP1672225S (en) 2020-02-28 2020-11-09
US20230163078A1 (en) * 2020-03-19 2023-05-25 Rohm Co., Ltd. Semiconductor device
US20230109471A1 (en) * 2020-04-01 2023-04-06 Rohm Co., Ltd. Electronic device
US20230121777A1 (en) * 2020-04-01 2023-04-20 Rohm Co., Ltd. Electronic device
US20230178461A1 (en) * 2020-04-17 2023-06-08 Rohm Co., Ltd. Semiconductor device
US20230207440A1 (en) * 2020-06-08 2023-06-29 Rohm Co., Ltd. Semiconductor device
USD993201S1 (en) * 2021-03-09 2023-07-25 Rohm Co., Ltd. Semiconductor module

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,560, dated Aug. 22, 2023, 11 pages.
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,563, dated Aug. 23, 2023, 10 pages.
Notification to Make Rectification issued for Chinese Patent Application No. 202130611619.7, dated Jul. 24, 2023, 3 pages including English machine translation.
Restriction Requirement issued for U.S. Appl. No. 29/807,560, dated Mar. 6, 2023, 12 pages.
Restriction Requirement issued for U.S. Appl. No. 29/807,563, dated Mar. 7, 2023, 12 pages.

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