USD1022932S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD1022932S1 USD1022932S1 US29/807,561 US202129807561F USD1022932S US D1022932 S1 USD1022932 S1 US D1022932S1 US 202129807561 F US202129807561 F US 202129807561F US D1022932 S USD1022932 S US D1022932S
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- US
- United States
- Prior art keywords
- semiconductor module
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- design
- semiconductor
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims description 4
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Description
The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.
Claims (1)
- The ornamental design for a semiconductor module, as shown and described.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021005348F JP1703009S (en) | 2021-03-16 | 2021-03-16 | semiconductor module |
JP2021-005348D | 2021-03-16 | ||
JP2021005344F JP1703006S (en) | 2021-03-16 | 2021-03-16 | semiconductor module |
JP2021-005344D | 2021-03-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1022932S1 true USD1022932S1 (en) | 2024-04-16 |
Family
ID=90624820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/807,561 Active USD1022932S1 (en) | 2021-03-16 | 2021-09-13 | Semiconductor module |
Country Status (1)
Country | Link |
---|---|
US (1) | USD1022932S1 (en) |
Citations (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
JP1615979S (en) | 2018-04-13 | 2018-10-15 | ||
JP1615884S (en) | 2018-04-13 | 2018-10-15 | ||
JP1629924S (en) | 2018-06-26 | 2019-04-22 | ||
JP1630154S (en) | 2018-06-26 | 2019-04-22 | ||
US20190198431A1 (en) * | 2017-12-22 | 2019-06-27 | Mitsubishi Electric Corporation | Semiconductor module using lead frame for power and control terminals and both having asymmetric or inhomogeneous configuration |
JP1641098S (en) | 2018-06-26 | 2019-09-09 | ||
USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
JP1672265S (en) | 2020-02-28 | 2020-11-09 | ||
JP1672224S (en) | 2020-02-28 | 2020-11-09 | ||
JP1672225S (en) | 2020-02-28 | 2020-11-09 | ||
JP1672263S (en) | 2020-01-28 | 2020-11-09 | ||
JP1672218S (en) | 2020-01-28 | 2020-11-09 | ||
JP1672264S (en) | 2020-02-28 | 2020-11-09 | ||
USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
JP1684232S (en) | 2020-01-28 | 2021-04-26 | ||
JP1684149S (en) | 2020-01-28 | 2021-04-26 | ||
JP1684230S (en) | 2020-01-28 | 2021-04-26 | ||
JP1684231S (en) | 2020-01-28 | 2021-04-26 | ||
JP1684233S (en) | 2020-01-28 | 2021-04-26 | ||
US20220223568A1 (en) * | 2019-05-27 | 2022-07-14 | Rohm Co., Ltd. | Semiconductor device |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
US20230109471A1 (en) * | 2020-04-01 | 2023-04-06 | Rohm Co., Ltd. | Electronic device |
US20230121777A1 (en) * | 2020-04-01 | 2023-04-20 | Rohm Co., Ltd. | Electronic device |
US20230163078A1 (en) * | 2020-03-19 | 2023-05-25 | Rohm Co., Ltd. | Semiconductor device |
US20230178461A1 (en) * | 2020-04-17 | 2023-06-08 | Rohm Co., Ltd. | Semiconductor device |
US20230207440A1 (en) * | 2020-06-08 | 2023-06-29 | Rohm Co., Ltd. | Semiconductor device |
USD993201S1 (en) * | 2021-03-09 | 2023-07-25 | Rohm Co., Ltd. | Semiconductor module |
-
2021
- 2021-09-13 US US29/807,561 patent/USD1022932S1/en active Active
Patent Citations (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
US20190198431A1 (en) * | 2017-12-22 | 2019-06-27 | Mitsubishi Electric Corporation | Semiconductor module using lead frame for power and control terminals and both having asymmetric or inhomogeneous configuration |
JP1615884S (en) | 2018-04-13 | 2018-10-15 | ||
JP1615979S (en) | 2018-04-13 | 2018-10-15 | ||
USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
JP1629924S (en) | 2018-06-26 | 2019-04-22 | ||
JP1630154S (en) | 2018-06-26 | 2019-04-22 | ||
USD903613S1 (en) * | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
JP1641098S (en) | 2018-06-26 | 2019-09-09 | ||
USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
US20220223568A1 (en) * | 2019-05-27 | 2022-07-14 | Rohm Co., Ltd. | Semiconductor device |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
JP1684231S (en) | 2020-01-28 | 2021-04-26 | ||
JP1672218S (en) | 2020-01-28 | 2020-11-09 | ||
JP1672263S (en) | 2020-01-28 | 2020-11-09 | ||
JP1684232S (en) | 2020-01-28 | 2021-04-26 | ||
JP1684149S (en) | 2020-01-28 | 2021-04-26 | ||
JP1684230S (en) | 2020-01-28 | 2021-04-26 | ||
JP1684233S (en) | 2020-01-28 | 2021-04-26 | ||
JP1672264S (en) | 2020-02-28 | 2020-11-09 | ||
JP1672265S (en) | 2020-02-28 | 2020-11-09 | ||
JP1672224S (en) | 2020-02-28 | 2020-11-09 | ||
JP1672225S (en) | 2020-02-28 | 2020-11-09 | ||
US20230163078A1 (en) * | 2020-03-19 | 2023-05-25 | Rohm Co., Ltd. | Semiconductor device |
US20230109471A1 (en) * | 2020-04-01 | 2023-04-06 | Rohm Co., Ltd. | Electronic device |
US20230121777A1 (en) * | 2020-04-01 | 2023-04-20 | Rohm Co., Ltd. | Electronic device |
US20230178461A1 (en) * | 2020-04-17 | 2023-06-08 | Rohm Co., Ltd. | Semiconductor device |
US20230207440A1 (en) * | 2020-06-08 | 2023-06-29 | Rohm Co., Ltd. | Semiconductor device |
USD993201S1 (en) * | 2021-03-09 | 2023-07-25 | Rohm Co., Ltd. | Semiconductor module |
Non-Patent Citations (5)
Title |
---|
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,560, dated Aug. 22, 2023, 11 pages. |
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,563, dated Aug. 23, 2023, 10 pages. |
Notification to Make Rectification issued for Chinese Patent Application No. 202130611619.7, dated Jul. 24, 2023, 3 pages including English machine translation. |
Restriction Requirement issued for U.S. Appl. No. 29/807,560, dated Mar. 6, 2023, 12 pages. |
Restriction Requirement issued for U.S. Appl. No. 29/807,563, dated Mar. 7, 2023, 12 pages. |
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