USD903612S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD903612S1
USD903612S1 US29/705,163 US201929705163F USD903612S US D903612 S1 USD903612 S1 US D903612S1 US 201929705163 F US201929705163 F US 201929705163F US D903612 S USD903612 S US D903612S
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United States
Prior art keywords
semiconductor module
view
semiconductor
module
ornamental design
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US29/705,163
Inventor
Shin Soyano
Hiromichi GOHARA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
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Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GOHARA, HIROMICHI, SOYANO, SHIN
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FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view of the semiconductor module of FIG. 1;
FIG. 3 is a left side view of the semiconductor module of FIG. 1;
FIG. 4 is a right side view of the semiconductor module of FIG. 1;
FIG. 5 is a top view of the semiconductor module of FIG. 1;
FIG. 6 is a bottom view of the semiconductor module of FIG. 1;
FIG. 7 is a front, top and left side perspective view of the semiconductor module of FIG. 1;
FIG. 8 is a front, bottom and right side perspective view of the semiconductor module of FIG. 1;
FIG. 9 is a rear, top and left side perspective view of the semiconductor module of FIG. 1; and,
FIG. 10 is a rear, bottom and right side perspective view of the semiconductor module of FIG. 1.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module, as shown and described.
US29/705,163 2019-03-26 2019-09-10 Semiconductor module Active USD903612S1 (en)

Applications Claiming Priority (2)

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JP2019006409F JP1644633S (en) 2019-03-26 2019-03-26
JP2019-006409 2019-03-26

Publications (1)

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USD903612S1 true USD903612S1 (en) 2020-12-01

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US29/705,163 Active USD903612S1 (en) 2019-03-26 2019-09-10 Semiconductor module

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JP (1) JP1644633S (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD927437S1 (en) * 2019-08-29 2021-08-10 Rohm Co., Ltd. Power semiconductor module
USD934188S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD934189S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934190S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934822S1 (en) 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD942405S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD942404S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD976852S1 (en) * 2020-04-24 2023-01-31 Industrial Technology Research Institute Power module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD983759S1 (en) * 2019-05-31 2023-04-18 Fuji Electric Co., Ltd. Semiconductor module

Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US20040227231A1 (en) * 2003-05-16 2004-11-18 Ballard Power Systems Corporation Power module with voltage overshoot limiting
USD556686S1 (en) * 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
US9418975B1 (en) * 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
US20160276234A1 (en) * 2015-03-20 2016-09-22 Fuji Electric Co., Ltd. Semiconductor module and resin case
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module

Patent Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US20040227231A1 (en) * 2003-05-16 2004-11-18 Ballard Power Systems Corporation Power module with voltage overshoot limiting
USD556686S1 (en) * 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD773413S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD773412S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
US20160276234A1 (en) * 2015-03-20 2016-09-22 Fuji Electric Co., Ltd. Semiconductor module and resin case
US9418975B1 (en) * 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD942405S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD942404S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD983759S1 (en) * 2019-05-31 2023-04-18 Fuji Electric Co., Ltd. Semiconductor module
USD934189S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934822S1 (en) 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934190S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934188S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD927437S1 (en) * 2019-08-29 2021-08-10 Rohm Co., Ltd. Power semiconductor module
USD976852S1 (en) * 2020-04-24 2023-01-31 Industrial Technology Research Institute Power module

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