USD932452S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD932452S1
USD932452S1 US29/715,105 US201929715105F USD932452S US D932452 S1 USD932452 S1 US D932452S1 US 201929715105 F US201929715105 F US 201929715105F US D932452 S USD932452 S US D932452S
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United States
Prior art keywords
semiconductor device
view
ornamental design
semiconductor
perspective
Prior art date
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Active
Application number
US29/715,105
Inventor
James P. McBRIDE
James Richard Stanfield
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noco Co
Original Assignee
Noco Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US29/715,105 priority Critical patent/USD932452S1/en
Application filed by Noco Co filed Critical Noco Co
Priority to US17/756,556 priority patent/US20220399256A1/en
Priority to GB2207806.7A priority patent/GB2605306A/en
Priority to PCT/US2020/062417 priority patent/WO2021108706A1/en
Priority to JP2022531061A priority patent/JP7408804B2/en
Priority to CN202080081824.XA priority patent/CN114830439A/en
Priority to AU2020393921A priority patent/AU2020393921B2/en
Priority to CA3163239A priority patent/CA3163239A1/en
Priority to MX2022006313A priority patent/MX2022006313A/en
Assigned to THE NOCO COMPANY reassignment THE NOCO COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MCBRIDE, JAMES P., STANFIELD, JAMES RICHARD
Application granted granted Critical
Publication of USD932452S1 publication Critical patent/USD932452S1/en
Priority to AU2023204342A priority patent/AU2023204342A1/en
Priority to JP2023214360A priority patent/JP2024041768A/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a semiconductor device showing our new design;
FIG. 2 is a left side view thereof;
FIG. 3 is a right side view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a front view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/715,105 2019-11-27 2019-11-27 Semiconductor device Active USD932452S1 (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
US29/715,105 USD932452S1 (en) 2019-11-27 2019-11-27 Semiconductor device
MX2022006313A MX2022006313A (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms).
PCT/US2020/062417 WO2021108706A1 (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms)
JP2022531061A JP7408804B2 (en) 2019-11-27 2020-11-25 How to interface control pins (gate pins) of power semiconductor devices (MOSFETs) to printed circuit boards (PCBs) in semiconductor devices, printed circuit boards (PCBs), and battery management systems (BMS)
CN202080081824.XA CN114830439A (en) 2019-11-27 2020-11-25 Semiconductor device, Printed Circuit Board (PCB) and method for interfacing control pins (gate pins) of a power semiconductor device (MOSFET) to a Printed Circuit Board (PCB) in a Battery Management System (BMS)
AU2020393921A AU2020393921B2 (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB) in a battery management system (BMS)
US17/756,556 US20220399256A1 (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms)
GB2207806.7A GB2605306A (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed...
CA3163239A CA3163239A1 (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms)
AU2023204342A AU2023204342A1 (en) 2019-11-27 2023-07-06 Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB) in a battery management system (BMS)
JP2023214360A JP2024041768A (en) 2019-11-27 2023-12-20 How to interface control pins (gate pins) of power semiconductor devices (MOSFETs) to printed circuit boards (PCBs) in semiconductor devices, printed circuit boards (PCBs), and battery management systems (BMS)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/715,105 USD932452S1 (en) 2019-11-27 2019-11-27 Semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/715,103 Continuation-In-Part USD920264S1 (en) 2019-11-27 2019-11-27 Semiconductor device

Publications (1)

Publication Number Publication Date
USD932452S1 true USD932452S1 (en) 2021-10-05

Family

ID=77913668

Family Applications (1)

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US29/715,105 Active USD932452S1 (en) 2019-11-27 2019-11-27 Semiconductor device

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US (1) USD932452S1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1021772S1 (en) * 2020-12-11 2024-04-09 The Noco Company Battery charger

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USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
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USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
US20170133315A1 (en) * 2014-07-30 2017-05-11 Kyocera Corporation Electronic component housing package, and electronic device comprising same
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
DE102019128825A1 (en) * 2018-10-25 2020-04-30 Infineon Technologies Ag SEMICONDUCTOR HOUSING WITH LINE FRAME CONNECTION STRUCTURE
US10790245B2 (en) * 2016-06-27 2020-09-29 NGK Electronics Devices, Inc. High-frequency ceramic board and high-frequency semiconductor element package
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4951124A (en) * 1986-10-24 1990-08-21 Kabushiki Kaisha Toshiba Semiconductor device
US4807087A (en) * 1986-11-20 1989-02-21 Kabushiki Kaisha Toshiba Single-in-line type semiconductor device
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US6100580A (en) * 1988-09-20 2000-08-08 Hitachi, Ltd. Semiconductor device having all outer leads extending from one side of a resin member
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5563441A (en) * 1992-12-11 1996-10-08 Mitsubishi Denki Kabushiki Kaisha Lead frame assembly including a semiconductor device and a resistance wire
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD395638S (en) * 1997-01-30 1998-06-30 Sony Corporation Semiconductor package
USD395423S (en) * 1997-03-13 1998-06-23 Sony Corporation Semiconductor package
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6476481B2 (en) * 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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USD448740S1 (en) * 2000-11-30 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
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USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
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USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
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USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD1021772S1 (en) * 2020-12-11 2024-04-09 The Noco Company Battery charger
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device

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