GB2605306A - Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed... - Google Patents

Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed... Download PDF

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Publication number
GB2605306A
GB2605306A GB2207806.7A GB202207806A GB2605306A GB 2605306 A GB2605306 A GB 2605306A GB 202207806 A GB202207806 A GB 202207806A GB 2605306 A GB2605306 A GB 2605306A
Authority
GB
United Kingdom
Prior art keywords
gate pin
bms
management system
battery management
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB2207806.7A
Other versions
GB202207806D0 (en
Inventor
P Mcbride James
Richard Stanfield James
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noco Co
Original Assignee
Noco Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US29/715,105 external-priority patent/USD932452S1/en
Priority claimed from US29/715,103 external-priority patent/USD920264S1/en
Application filed by Noco Co filed Critical Noco Co
Publication of GB202207806D0 publication Critical patent/GB202207806D0/en
Publication of GB2605306A publication Critical patent/GB2605306A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M2010/4271—Battery management systems including electronic circuits, e.g. control of current or voltage to keep battery in healthy state, cell balancing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10492—Electrically connected to another device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H05K2201/10772—Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

A MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device including a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).

Claims (16)

1. A MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device comprising: a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).
2. The device according to claim 1 , wherein the gate pin is a straight gate pin.
3. The device according to claim 1 , wherein the power pins have a fully bent configuration and the gate pin has a partially bent configuration.
4. The device according to claim 1 , wherein a lower surface of the tips of the power pins are located in a same plane as a lower surface of the semiconductor body.
5. The device according to claim 1 , wherein the gate pin is connected to a trace of the printed circuit board (PCB) for connecting the gate pin to a circuit of the battery management system (BMS).
6. The device according to claim 5, wherein the gate pin is connected to the trace of the printed circuit board by a connector wire.
7. The device according to claim 1 , wherein the gate pin is connected to a gate printed circuit board connected to the printed circuit board (PCB) for connecting the gate pin to a circuit of the battery management system (BMS).
8. A printed circuit board (PCB) device for use with a battery management system (BMS) of a lithium ion battery, comprising; a printed circuit board having spaced apart copper plates; and a plurality of MOSFETs bridging the copper plates, the MOSFETs each comprising: a semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly and connected to one of the spaced apart copper plates; a gate pin extending outwardly from at least one side of the semiconductor body, the gate pin connected to a circuit of the battery management system (BMS), wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart cooper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).
9. The device according to claim 8, wherein the gate pin is a straight gate pin.
10. The device according to claim 8, wherein the gate pin is a partially bent gate pin.
11. A method of connecting a MOSFET to a printed circuit board (PCB) of a battery management system (BMS), the method comprising: locating a tip of a gate pin of the MOSFET at a raised or elevated position relative to tips of power pins of the MOSFET; installing the MOSFET bridging a pair of spaced apart copper plates located on a printed circuit board (PCB) of the battery management system (BMS) with the tips of the power pins connected to one of the spaced apart copper plates and a metal connector of the MOSFET connected to the other of the spaced apart copper plates; and electrically connecting the raised or elevated tip of the gate pin to a circuit of the battery management system (BMS).
12. The method according to claim 11 , wherein the power pins of the MOSFET are bent, and the gate pin of the MOSFET is a straight gate pin with a raised or elevated tip.
13. The method according to claim 11 , wherein the power pins of the MOSFET are bent, and the gate pin of the MOSFET is a partially bent gate pin with a raised or elevated tip.
14. The method according to claim 11, wherein the gate pin is electrically connected to the circuit of the battery management system (BMS) with a connecting wire.
15. The method according to claim 11 , wherein the gate pin is electrically connected to the circuit of the battery management system (BMS) with a gate printed circuit board (PCB).
16. The method according to claim 11 , wherein a connection of the gate pin with the circuit of the battery management system (BMS) is mechanically stabilized by providing a resilient material between the connection of the gate pin and the surface of the printed circuit board (PCB).
GB2207806.7A 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed... Pending GB2605306A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962941275P 2019-11-27 2019-11-27
US29/715,105 USD932452S1 (en) 2019-11-27 2019-11-27 Semiconductor device
US29/715,103 USD920264S1 (en) 2019-11-27 2019-11-27 Semiconductor device
PCT/US2020/062417 WO2021108706A1 (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms)

Publications (2)

Publication Number Publication Date
GB202207806D0 GB202207806D0 (en) 2022-07-13
GB2605306A true GB2605306A (en) 2022-09-28

Family

ID=76129990

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2207806.7A Pending GB2605306A (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed...

Country Status (7)

Country Link
JP (2) JP7408804B2 (en)
CN (1) CN114830439A (en)
AU (2) AU2020393921B2 (en)
CA (1) CA3163239A1 (en)
GB (1) GB2605306A (en)
MX (1) MX2022006313A (en)
WO (1) WO2021108706A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846823A (en) * 1971-08-05 1974-11-05 Lucerne Products Inc Semiconductor assembly
US7540788B2 (en) * 2007-01-05 2009-06-02 Apple Inc. Backward compatible connector system
US7812464B2 (en) * 1999-02-17 2010-10-12 Renesas Electronics Corporation Semiconductor device and a method of manufacturing for high output MOSFET
US20110108963A1 (en) * 2007-10-15 2011-05-12 Power Integrations, Inc. Package for a power semiconductor device
US20140354238A1 (en) * 2013-06-01 2014-12-04 Fairchild Semiconductor Corporation System for Battery Management and Protection
US9440601B2 (en) * 2013-09-06 2016-09-13 Johnson Controls Technology Company System for providing voltage measurements of battery cells to a PCB within a battery module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234442A (en) 2002-02-06 2003-08-22 Hitachi Ltd Semiconductor device and method of manufacturing the same
JP2010087032A (en) 2008-09-29 2010-04-15 Tdk-Lambda Corp Electronic apparatus
FR3052013B1 (en) 2016-05-25 2019-06-28 Aptiv Technologies Limited POWER SWITCHING MODULE
DE212018000086U1 (en) 2017-03-28 2019-06-17 Rohm Co., Ltd. Semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846823A (en) * 1971-08-05 1974-11-05 Lucerne Products Inc Semiconductor assembly
US7812464B2 (en) * 1999-02-17 2010-10-12 Renesas Electronics Corporation Semiconductor device and a method of manufacturing for high output MOSFET
US7540788B2 (en) * 2007-01-05 2009-06-02 Apple Inc. Backward compatible connector system
US20110108963A1 (en) * 2007-10-15 2011-05-12 Power Integrations, Inc. Package for a power semiconductor device
US20140354238A1 (en) * 2013-06-01 2014-12-04 Fairchild Semiconductor Corporation System for Battery Management and Protection
US9440601B2 (en) * 2013-09-06 2016-09-13 Johnson Controls Technology Company System for providing voltage measurements of battery cells to a PCB within a battery module

Also Published As

Publication number Publication date
AU2020393921B2 (en) 2023-04-06
AU2020393921A1 (en) 2022-06-09
AU2023204342A1 (en) 2023-07-27
JP2023503634A (en) 2023-01-31
JP7408804B2 (en) 2024-01-05
WO2021108706A1 (en) 2021-06-03
MX2022006313A (en) 2022-06-22
CA3163239A1 (en) 2021-06-03
GB202207806D0 (en) 2022-07-13
JP2024041768A (en) 2024-03-27
CN114830439A (en) 2022-07-29

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