USD969762S1 - Power semiconductor package - Google Patents
Power semiconductor package Download PDFInfo
- Publication number
- USD969762S1 USD969762S1 US29/811,014 US202129811014F USD969762S US D969762 S1 USD969762 S1 US D969762S1 US 202129811014 F US202129811014 F US 202129811014F US D969762 S USD969762 S US D969762S
- Authority
- US
- United States
- Prior art keywords
- semiconductor package
- power semiconductor
- view
- ornamental design
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
Claims (1)
- The ornamental design for a power semiconductor package, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/811,014 USD969762S1 (en) | 2020-04-06 | 2021-10-11 | Power semiconductor package |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/730,568 USD937231S1 (en) | 2020-04-06 | 2020-04-06 | Power semiconductor package |
US29/811,014 USD969762S1 (en) | 2020-04-06 | 2021-10-11 | Power semiconductor package |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/730,568 Division USD937231S1 (en) | 2020-04-06 | 2020-04-06 | Power semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
USD969762S1 true USD969762S1 (en) | 2022-11-15 |
Family
ID=78703986
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/730,568 Active USD937231S1 (en) | 2020-04-06 | 2020-04-06 | Power semiconductor package |
US29/811,014 Active USD969762S1 (en) | 2020-04-06 | 2021-10-11 | Power semiconductor package |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/730,568 Active USD937231S1 (en) | 2020-04-06 | 2020-04-06 | Power semiconductor package |
Country Status (2)
Country | Link |
---|---|
US (2) | USD937231S1 (en) |
TW (2) | TWD220287S (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
Citations (76)
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US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
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USD259559S (en) | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259560S (en) | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259782S (en) | 1978-07-28 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD259783S (en) | 1978-08-25 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD260091S (en) | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
USD260986S (en) | 1978-08-25 | 1981-09-29 | Hitachi, Ltd. | Semiconductor |
US4391408A (en) * | 1980-09-05 | 1983-07-05 | Augat Inc. | Low insertion force connector |
US4441119A (en) * | 1981-01-15 | 1984-04-03 | Mostek Corporation | Integrated circuit package |
USD288557S (en) * | 1984-09-10 | 1987-03-03 | Motorola, Inc. | Semiconductor housing |
USD288922S (en) * | 1984-04-19 | 1987-03-24 | Thomson Components-Mostek Corporation | Zero power random access memory package |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
US4951122A (en) * | 1987-05-27 | 1990-08-21 | Hitachi, Ltd. | Resin-encapsulated semiconductor device |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US5172213A (en) * | 1991-05-23 | 1992-12-15 | At&T Bell Laboratories | Molded circuit package having heat dissipating post |
USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
USD358806S (en) * | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD359028S (en) * | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
US5434357A (en) * | 1991-12-23 | 1995-07-18 | Belcher; Donald K. | Reduced semiconductor size package |
US5486720A (en) * | 1994-05-26 | 1996-01-23 | Analog Devices, Inc. | EMF shielding of an integrated circuit package |
US5594282A (en) * | 1993-12-16 | 1997-01-14 | Seiko Epson Corporation | Resin sealing type semiconductor device and method of making the same |
US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
USD396211S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396213S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396212S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396846S (en) | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD396847S (en) | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD397092S (en) | 1997-01-03 | 1998-08-18 | Fujitsu Limited | Integrated circuit package |
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
US5910681A (en) * | 1996-05-15 | 1999-06-08 | Kabushiki Kaisha Toshiba | Resin sealed semiconductor device |
US5959842A (en) * | 1998-05-14 | 1999-09-28 | Lucent Technologies Inc. | Surface mount power supply package and method of manufacture thereof |
USD421421S (en) | 1998-11-19 | 2000-03-07 | Honda Tsushin Kogyo Co., Ltd. | Connector receptacle for IC card |
USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
US6093957A (en) | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
USD432097S (en) | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
US6238953B1 (en) | 1999-01-12 | 2001-05-29 | Sony Corporation | Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
USD444132S1 (en) | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
USD466485S1 (en) | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
USD466873S1 (en) | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD472528S1 (en) | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
US6555899B1 (en) | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
USD475028S1 (en) | 2002-03-11 | 2003-05-27 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475355S1 (en) | 2002-03-11 | 2003-06-03 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475982S1 (en) | 2002-03-11 | 2003-06-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD476962S1 (en) | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
US6716670B1 (en) * | 2002-01-09 | 2004-04-06 | Bridge Semiconductor Corporation | Method of forming a three-dimensional stacked semiconductor package device |
USD489338S1 (en) | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
USD504874S1 (en) | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
USD508682S1 (en) | 2004-02-23 | 2005-08-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD510728S1 (en) | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
US20170133315A1 (en) | 2014-07-30 | 2017-05-11 | Kyocera Corporation | Electronic component housing package, and electronic device comprising same |
USD796459S1 (en) | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD824866S1 (en) | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
USD832228S1 (en) | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832227S1 (en) | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD874411S1 (en) | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
US10600744B2 (en) | 2016-11-15 | 2020-03-24 | Rohm Co., Ltd. | Semiconductor device |
USD900759S1 (en) | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
USD902877S1 (en) | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
-
2020
- 2020-04-06 US US29/730,568 patent/USD937231S1/en active Active
- 2020-09-21 TW TW110304008F patent/TWD220287S/en unknown
- 2020-09-21 TW TW109305308F patent/TWD220260S/en unknown
-
2021
- 2021-10-11 US US29/811,014 patent/USD969762S1/en active Active
Patent Citations (77)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3340347A (en) | 1964-10-12 | 1967-09-05 | Corning Glass Works | Enclosed electronic device |
US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
USD259559S (en) | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259560S (en) | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259782S (en) | 1978-07-28 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD260986S (en) | 1978-08-25 | 1981-09-29 | Hitachi, Ltd. | Semiconductor |
USD260091S (en) | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
USD259783S (en) | 1978-08-25 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
US4391408A (en) * | 1980-09-05 | 1983-07-05 | Augat Inc. | Low insertion force connector |
US4441119A (en) * | 1981-01-15 | 1984-04-03 | Mostek Corporation | Integrated circuit package |
USD288922S (en) * | 1984-04-19 | 1987-03-24 | Thomson Components-Mostek Corporation | Zero power random access memory package |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
USD288557S (en) * | 1984-09-10 | 1987-03-03 | Motorola, Inc. | Semiconductor housing |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US4951122A (en) * | 1987-05-27 | 1990-08-21 | Hitachi, Ltd. | Resin-encapsulated semiconductor device |
US5172213A (en) * | 1991-05-23 | 1992-12-15 | At&T Bell Laboratories | Molded circuit package having heat dissipating post |
US5434357A (en) * | 1991-12-23 | 1995-07-18 | Belcher; Donald K. | Reduced semiconductor size package |
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
USD359028S (en) * | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD358806S (en) * | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
US5594282A (en) * | 1993-12-16 | 1997-01-14 | Seiko Epson Corporation | Resin sealing type semiconductor device and method of making the same |
US5486720A (en) * | 1994-05-26 | 1996-01-23 | Analog Devices, Inc. | EMF shielding of an integrated circuit package |
US5910681A (en) * | 1996-05-15 | 1999-06-08 | Kabushiki Kaisha Toshiba | Resin sealed semiconductor device |
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
USD396211S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396213S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396212S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396847S (en) | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD397092S (en) | 1997-01-03 | 1998-08-18 | Fujitsu Limited | Integrated circuit package |
USD396846S (en) | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US6093957A (en) | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
US5959842A (en) * | 1998-05-14 | 1999-09-28 | Lucent Technologies Inc. | Surface mount power supply package and method of manufacture thereof |
USD421421S (en) | 1998-11-19 | 2000-03-07 | Honda Tsushin Kogyo Co., Ltd. | Connector receptacle for IC card |
US6238953B1 (en) | 1999-01-12 | 2001-05-29 | Sony Corporation | Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
US6555899B1 (en) | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
USD432097S (en) | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
USD444132S1 (en) | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
USD466485S1 (en) | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD466873S1 (en) | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
USD472528S1 (en) | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
US6716670B1 (en) * | 2002-01-09 | 2004-04-06 | Bridge Semiconductor Corporation | Method of forming a three-dimensional stacked semiconductor package device |
USD475028S1 (en) | 2002-03-11 | 2003-05-27 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475355S1 (en) | 2002-03-11 | 2003-06-03 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475982S1 (en) | 2002-03-11 | 2003-06-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD476962S1 (en) | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD489338S1 (en) | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
USD508682S1 (en) | 2004-02-23 | 2005-08-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD504874S1 (en) | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
USD510728S1 (en) | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
USD874411S1 (en) | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
US20170133315A1 (en) | 2014-07-30 | 2017-05-11 | Kyocera Corporation | Electronic component housing package, and electronic device comprising same |
USD796459S1 (en) | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD824866S1 (en) | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
USD832228S1 (en) | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832227S1 (en) | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
US10600744B2 (en) | 2016-11-15 | 2020-03-24 | Rohm Co., Ltd. | Semiconductor device |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD864135S1 (en) * | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
USD902877S1 (en) | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
USD900759S1 (en) | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
Non-Patent Citations (13)
Title |
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Cree, Inc., "C2M1000170J: Silicon Carbide Power MOSFET, C2M MOSFET Technology, N-Channel Enhancement Mode," Dec. 2017, 10 pages. |
Cree, Inc., "C3M0065090J: Silicon Carbide Power MOSFET, C3M MOSFET Technology, N-Channel Enahnancement Mode," Jun. 2019, 10 pages. |
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Examination Report for Taiwanese Patent Application No. 109305308, dated May 4, 2021, 6 pages. |
Examination Report for Taiwanese Patent Application No. 109305308, dated Oct. 29, 2021,4 pages. |
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Notice of Allowance for Taiwanese Patent Application No. 109305308, dated Mar. 30, 2022, 3 pages. |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
TWD220260S (en) | 2022-08-01 |
TWD220287S (en) | 2022-08-01 |
USD937231S1 (en) | 2021-11-30 |
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