USD475982S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD475982S1
USD475982S1 US29/167,095 US16709502F USD475982S US D475982 S1 USD475982 S1 US D475982S1 US 16709502 F US16709502 F US 16709502F US D475982 S USD475982 S US D475982S
Authority
US
United States
Prior art keywords
semiconductor device
view
elevational view
mirror image
side elevational
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/167,095
Inventor
Tetsuji Hori
Takayuki Yoshihira
Yuuji Hiyama
Gentaro Ookura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIYAMA, YUUJI, HORI, TETSUJI, OOKURA, GENTARO, YOSHIHIRA, TAKAYUKI
Application granted granted Critical
Publication of USD475982S1 publication Critical patent/USD475982S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front perspective view of a semiconductor device, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a front perspective view of a second embodiment of a semiconductor device, showing our new design;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 10 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 11 is a front elevational view thereof; and,
FIG. 12 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/167,095 2002-03-11 2002-09-10 Semiconductor device Expired - Lifetime USD475982S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002006216 2002-03-11
JP2002-006215 2002-03-11
JP2002-006216 2002-03-11
JP2002006215 2002-03-11

Publications (1)

Publication Number Publication Date
USD475982S1 true USD475982S1 (en) 2003-06-17

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ID=26625523

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/167,095 Expired - Lifetime USD475982S1 (en) 2002-03-11 2002-09-10 Semiconductor device

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US (1) USD475982S1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD706733S1 (en) * 2013-09-16 2014-06-10 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45712E1 (en) * 2013-03-18 2015-10-06 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45741E1 (en) * 2013-03-18 2015-10-13 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD976215S1 (en) * 2021-01-18 2023-01-24 Dexerials Corporation Fuse
USD976216S1 (en) * 2021-01-18 2023-01-24 Dexerials Corporation Fuse
USD981966S1 (en) * 2021-01-18 2023-03-28 Dexerials Corporation Fuse
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Catalog of a chip size package (VMN4).
Extract of Nihon Kogyo Shimbun (Newspaper) showing a chip-type Transistor package (E-CSP).

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD839220S1 (en) 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USRE45712E1 (en) * 2013-03-18 2015-10-06 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45741E1 (en) * 2013-03-18 2015-10-13 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD706733S1 (en) * 2013-09-16 2014-06-10 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD976215S1 (en) * 2021-01-18 2023-01-24 Dexerials Corporation Fuse
USD976216S1 (en) * 2021-01-18 2023-01-24 Dexerials Corporation Fuse
USD981966S1 (en) * 2021-01-18 2023-03-28 Dexerials Corporation Fuse
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device

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