USD475982S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD475982S1 USD475982S1 US29/167,095 US16709502F USD475982S US D475982 S1 USD475982 S1 US D475982S1 US 16709502 F US16709502 F US 16709502F US D475982 S USD475982 S US D475982S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- mirror image
- side elevational
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front perspective view of a semiconductor device, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a front perspective view of a second embodiment of a semiconductor device, showing our new design;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 10 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 11 is a front elevational view thereof; and,
FIG. 12 is a rear elevational view thereof.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-006215 | 2002-03-11 | ||
JP2002-006216 | 2002-03-11 | ||
JP2002006216 | 2002-03-11 | ||
JP2002006215 | 2002-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD475982S1 true USD475982S1 (en) | 2003-06-17 |
Family
ID=26625523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/167,095 Expired - Lifetime USD475982S1 (en) | 2002-03-11 | 2002-09-10 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (1) | USD475982S1 (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD706733S1 (en) * | 2013-09-16 | 2014-06-10 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
USD707193S1 (en) * | 2013-09-16 | 2014-06-17 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
USRE45712E1 (en) * | 2013-03-18 | 2015-10-06 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
USRE45741E1 (en) * | 2013-03-18 | 2015-10-13 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
USD769832S1 (en) * | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
USD976215S1 (en) * | 2021-01-18 | 2023-01-24 | Dexerials Corporation | Fuse |
USD976216S1 (en) * | 2021-01-18 | 2023-01-24 | Dexerials Corporation | Fuse |
USD981966S1 (en) * | 2021-01-18 | 2023-03-28 | Dexerials Corporation | Fuse |
USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
-
2002
- 2002-09-10 US US29/167,095 patent/USD475982S1/en not_active Expired - Lifetime
Non-Patent Citations (2)
Title |
---|
Catalog of a chip size package (VMN4). |
Extract of Nihon Kogyo Shimbun (Newspaper) showing a chip-type Transistor package (E-CSP). |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD769832S1 (en) * | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
USD839220S1 (en) | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
USRE45712E1 (en) * | 2013-03-18 | 2015-10-06 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
USRE45741E1 (en) * | 2013-03-18 | 2015-10-13 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
USD706733S1 (en) * | 2013-09-16 | 2014-06-10 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
USD707193S1 (en) * | 2013-09-16 | 2014-06-17 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD969762S1 (en) | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
USD976215S1 (en) * | 2021-01-18 | 2023-01-24 | Dexerials Corporation | Fuse |
USD976216S1 (en) * | 2021-01-18 | 2023-01-24 | Dexerials Corporation | Fuse |
USD981966S1 (en) * | 2021-01-18 | 2023-03-28 | Dexerials Corporation | Fuse |
USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
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