USD475355S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD475355S1
USD475355S1 US29167131 US16713102F USD475355S US D475355 S1 USD475355 S1 US D475355S1 US 29167131 US29167131 US 29167131 US 16713102 F US16713102 F US 16713102F US D475355 S USD475355 S US D475355S
Authority
US
Grant status
Grant
Patent type
Design
Prior art keywords
semiconductor device
view
elevational view
shown
described
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29167131
Inventor
Tetsuji Hori
Takayuki Yoshihira
Yuuji Hiyama
Gentaro Ookura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

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Description

FIG. 1 is a front perspective view of a semiconductor device, showing our new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;

FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;

FIG. 5 is a front elevational view thereof; and,

FIG. 6 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29167131 2002-03-11 2002-09-10 Semiconductor device Expired - Lifetime USD475355S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002-006217 2002-01-15
JP2002006217 2002-03-11

Publications (1)

Publication Number Publication Date
USD475355S1 true USD475355S1 (en) 2003-06-03

Family

ID=19191199

Family Applications (1)

Application Number Title Priority Date Filing Date
US29167131 Expired - Lifetime USD475355S1 (en) 2002-03-11 2002-09-10 Semiconductor device

Country Status (1)

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US (1) USD475355S1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE45712E1 (en) * 2013-03-18 2015-10-06 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45741E1 (en) * 2013-03-18 2015-10-13 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD743399S1 (en) * 2014-05-30 2015-11-17 Emc Corporation Flash module
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Catalog of a Chip Size Package (VMN4).
Extract of Nihon Kogyo Shimbun (Newspaper) showing a Chip-Type Transistor Package (E-CSP).

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USRE45712E1 (en) * 2013-03-18 2015-10-06 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45741E1 (en) * 2013-03-18 2015-10-13 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD743399S1 (en) * 2014-05-30 2015-11-17 Emc Corporation Flash module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package

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