USD259560S - Semiconductor - Google Patents
Semiconductor Download PDFInfo
- Publication number
- USD259560S USD259560S US06/006,200 US620079F USD259560S US D259560 S USD259560 S US D259560S US 620079 F US620079 F US 620079F US D259560 S USD259560 S US D259560S
- Authority
- US
- United States
- Prior art keywords
- semiconductor
- view
- front perspective
- new design
- another embodiment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a right side, top and front perspective view of a semiconductor showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 6 is a bottom view thereof;
FIG. 7 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 8 is a bottom view thereof;
FIG. 9 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 10 is a bottom view thereof;
FIG. 11 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 12 is a bottom view thereof.
Claims (1)
- The ornamental design for a semiconductor, as shown and described.
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3169178 | 1978-07-28 | ||
JP3169778 | 1978-07-28 | ||
JP3169078 | 1978-07-28 | ||
JP53-31698 | 1978-07-28 | ||
JP3168978 | 1978-07-28 | ||
JP53-31697 | 1978-07-28 | ||
JP53-31689 | 1978-07-28 | ||
JP53-31690 | 1978-07-28 | ||
JP53-31691 | 1978-07-28 | ||
JP3169878 | 1978-07-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD259560S true USD259560S (en) | 1981-06-16 |
Family
ID=69782970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/006,200 Expired - Lifetime USD259560S (en) | 1978-07-28 | 1979-01-24 | Semiconductor |
Country Status (1)
Country | Link |
---|---|
US (1) | USD259560S (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
-
1979
- 1979-01-24 US US06/006,200 patent/USD259560S/en not_active Expired - Lifetime
Non-Patent Citations (4)
Title |
---|
Electronics, 10-13-1977, p. 9, Semiconductor. |
Electronics, 10-27-1977, p. 9, Integrated Circuit Package, (square). |
Electronics, 11-24-1977, p. 145, Integrated Circuit Housing (bottom right). |
Electronics, 3-17-1977, front cover-LSI Package (top right). |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD864135S1 (en) | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD969762S1 (en) | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
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