USD260091S - Semiconductor - Google Patents
Semiconductor Download PDFInfo
- Publication number
- USD260091S USD260091S US06/015,216 US1521679F USD260091S US D260091 S USD260091 S US D260091S US 1521679 F US1521679 F US 1521679F US D260091 S USD260091 S US D260091S
- Authority
- US
- United States
- Prior art keywords
- semiconductor
- view
- front perspective
- new design
- another embodiment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a right side, top and front perspective view of a semiconductor showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 6 is a bottom view thereof;
FIG. 7 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 8 is a bottom view thereof;
FIG. 9 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 10 is a bottom view thereof.
Claims (1)
- The ornamental design for a semiconductor, as shown and described.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3573878 | 1978-08-25 | ||
JP53-35723 | 1978-08-25 | ||
JP3572378 | 1978-08-25 | ||
JP53-35730 | 1978-08-25 | ||
JP3573478 | 1978-08-25 | ||
JP3573078 | 1978-08-25 | ||
JP53-35738 | 1978-08-25 | ||
JP53-35734 | 1978-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD260091S true USD260091S (en) | 1981-08-04 |
Family
ID=69802856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/015,216 Expired - Lifetime USD260091S (en) | 1978-08-25 | 1979-02-26 | Semiconductor |
Country Status (1)
Country | Link |
---|---|
US (1) | USD260091S (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
-
1979
- 1979-02-26 US US06/015,216 patent/USD260091S/en not_active Expired - Lifetime
Non-Patent Citations (4)
Title |
---|
Electronics, 10-13-1977, p. 9, Semiconductor. |
Electronics, 10-27-1977, p. 9, Integrated Circuit Package (square). |
Electronics, 11-24-1977, p. 145, Integrated Circuit Package (bottom right). |
Electronics, 3-17-1977, Front Cover, LSI Package (top right). |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD864135S1 (en) | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD969762S1 (en) | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
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