USD472528S1 - Semiconductor chip package - Google Patents

Semiconductor chip package Download PDF

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Publication number
USD472528S1
USD472528S1 US29/151,069 US15106901F USD472528S US D472528 S1 USD472528 S1 US D472528S1 US 15106901 F US15106901 F US 15106901F US D472528 S USD472528 S US D472528S
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US
United States
Prior art keywords
semiconductor chip
chip package
package
ornamental design
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/151,069
Inventor
Yehja Mohammed Kasem
Frank Kuo
Eddy Tjhia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay Siliconix Inc
Original Assignee
Siliconix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconix Inc filed Critical Siliconix Inc
Priority to US29/151,069 priority Critical patent/USD472528S1/en
Assigned to SILICONIX INCORPORATED reassignment SILICONIX INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KASEM, YEHJA MOHAMMED, KUO, FRANK, TJHIA, EDDY
Application granted granted Critical
Publication of USD472528S1 publication Critical patent/USD472528S1/en
Assigned to JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT reassignment JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT SECURITY AGREEMENT Assignors: SILICONIX INCORPORATED, VISHAY DALE ELECTRONICS, INC., VISHAY INTERTECHNOLOGY, INC., VISHAY SPRAGUE, INC.
Anticipated expiration legal-status Critical
Assigned to JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT reassignment JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DALE ELECTRONICS, INC., SILICONIX INCORPORATED, SPRAGUE ELECTRIC COMPANY, VISHAY DALE ELECTRONICS, INC., VISHAY DALE ELECTRONICS, LLC, VISHAY EFI, INC., VISHAY GENERAL SEMICONDUCTOR, INC., VISHAY INTERTECHNOLOGY, INC., VISHAY SPRAGUE, INC., VISHAY-DALE, INC., VISHAY-SILICONIX, VISHAY-SILICONIX, INC.
Assigned to VISHAY INTERTECHNOLOGY, INC., VISHAY SPRAGUE, INC., SPRAGUE ELECTRIC COMPANY, VISHAY TECHNO COMPONENTS, LLC, VISHAY VITRAMON, INC., VISHAY EFI, INC., DALE ELECTRONICS, INC., VISHAY DALE ELECTRONICS, INC., SILICONIX INCORPORATED reassignment VISHAY INTERTECHNOLOGY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

FIG. 1 is a perspective view from the left side and above the semiconductor chip package;
FIG. 2 is a perspective view from the left side and below the semiconductor chip package;
FIG. 3 is an elevational view from the left side of the semiconductor chip package;
FIG. 4 is an elevational view from the right side of the semiconductor chip package;
FIG. 5 is an elevational view from the back side of the semiconductor chip package;
FIG. 6 is an elevational view from the front side of the semiconductor chip package;
FIG. 7 is a top view of the semiconductor chip package; and,
FIG. 8 is a bottom view of the semiconductor chip package.

Claims (1)

  1. The ornamental design for a semiconductor chip package, as shown and described.
US29/151,069 2001-10-31 2001-10-31 Semiconductor chip package Expired - Lifetime USD472528S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/151,069 USD472528S1 (en) 2001-10-31 2001-10-31 Semiconductor chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/151,069 USD472528S1 (en) 2001-10-31 2001-10-31 Semiconductor chip package

Publications (1)

Publication Number Publication Date
USD472528S1 true USD472528S1 (en) 2003-04-01

Family

ID=22537194

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/151,069 Expired - Lifetime USD472528S1 (en) 2001-10-31 2001-10-31 Semiconductor chip package

Country Status (1)

Country Link
US (1) USD472528S1 (en)

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7166496B1 (en) 2005-08-17 2007-01-23 Ciclon Semiconductor Device Corp. Method of making a packaged semiconductor device
US20070085204A1 (en) * 2005-10-19 2007-04-19 Cicion Semiconductor Device Corp. Chip scale power LDMOS device
US20070215939A1 (en) * 2006-03-14 2007-09-20 Shuming Xu Quasi-vertical LDMOS device having closed cell layout
US20080036078A1 (en) * 2006-08-14 2008-02-14 Ciclon Semiconductor Device Corp. Wirebond-less semiconductor package
US7608919B1 (en) 2003-09-04 2009-10-27 University Of Notre Dame Du Lac Interconnect packaging systems
US20100176508A1 (en) * 2009-01-12 2010-07-15 Ciclon Semiconductor Device Corp. Semiconductor device package and method of assembly thereof
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD839244S1 (en) * 2016-04-29 2019-01-29 Laird Technologies, Inc. Antenna housing
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

Cited By (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8021965B1 (en) 2003-09-04 2011-09-20 University Of Norte Dame Du Lac Inter-chip communication
US10410989B2 (en) 2003-09-04 2019-09-10 University Of Notre Dame Du Lac Inter-chip alignment
US7608919B1 (en) 2003-09-04 2009-10-27 University Of Notre Dame Du Lac Interconnect packaging systems
US7612443B1 (en) 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
US8623700B1 (en) 2003-09-04 2014-01-07 University Of Notre Dame Du Lac Inter-chip communication
US20070040254A1 (en) * 2005-08-17 2007-02-22 Lopez Osvaldo J Semiconductor die package
US7504733B2 (en) 2005-08-17 2009-03-17 Ciclon Semiconductor Device Corp. Semiconductor die package
US7166496B1 (en) 2005-08-17 2007-01-23 Ciclon Semiconductor Device Corp. Method of making a packaged semiconductor device
US20070085204A1 (en) * 2005-10-19 2007-04-19 Cicion Semiconductor Device Corp. Chip scale power LDMOS device
US7560808B2 (en) 2005-10-19 2009-07-14 Texas Instruments Incorporated Chip scale power LDMOS device
US20070215939A1 (en) * 2006-03-14 2007-09-20 Shuming Xu Quasi-vertical LDMOS device having closed cell layout
US7446375B2 (en) 2006-03-14 2008-11-04 Ciclon Semiconductor Device Corp. Quasi-vertical LDMOS device having closed cell layout
US20110095411A1 (en) * 2006-08-14 2011-04-28 Texas Instruments Incorporated Wirebond-less Semiconductor Package
US8304903B2 (en) 2006-08-14 2012-11-06 Texas Instruments Incorporated Wirebond-less semiconductor package
US20080036078A1 (en) * 2006-08-14 2008-02-14 Ciclon Semiconductor Device Corp. Wirebond-less semiconductor package
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US20100176508A1 (en) * 2009-01-12 2010-07-15 Ciclon Semiconductor Device Corp. Semiconductor device package and method of assembly thereof
US8049312B2 (en) 2009-01-12 2011-11-01 Texas Instruments Incorporated Semiconductor device package and method of assembly thereof
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD767571S1 (en) 2014-09-16 2016-09-27 Daishinku Corporation Piezoelectric vibration device
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD839244S1 (en) * 2016-04-29 2019-01-29 Laird Technologies, Inc. Antenna housing
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD911298S1 (en) 2017-02-17 2021-02-23 Stat Peel Ag Chip
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

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