USD887998S1 - Chip - Google Patents

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Publication number
USD887998S1
USD887998S1 US29/614,262 US201729614262F USD887998S US D887998 S1 USD887998 S1 US D887998S1 US 201729614262 F US201729614262 F US 201729614262F US D887998 S USD887998 S US D887998S
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US
United States
Prior art keywords
chip
view
ornamental design
design
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/614,262
Inventor
Krzysztof Krasnopolski
David Schmid
Fatma Burcu Celikkol Zijlstra
Joanna Alicja Borek-Donten
Ruedi Bieri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stat Peel AG
Original Assignee
Stat Peel AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stat Peel AG filed Critical Stat Peel AG
Assigned to STAT PEEL AG reassignment STAT PEEL AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHMID, DAVID, KRASNOPOLSKI, KRZYSZTOF, Borek-Donten, Joanna Alicja, CELIKKOL ZIJLSTRA, FATMA BURCU, BIERI, Ruedi
Priority to US29/733,401 priority Critical patent/USD911298S1/en
Application granted granted Critical
Publication of USD887998S1 publication Critical patent/USD887998S1/en
Active legal-status Critical Current
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FIG. 1 is a perspective view of a chip showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is bottom view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a right side view thereof.
The broken lines depict environmental subject matter only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a chip, as shown and described.
US29/614,262 2017-02-17 2017-08-17 Chip Active USD887998S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/733,401 USD911298S1 (en) 2017-02-17 2020-05-01 Chip

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
XHDM096233 2017-02-17
WODM/096232 2017-02-17
XHDM096232 2017-02-17
WODM/096233 2017-02-17

Related Child Applications (1)

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US29/733,401 Division USD911298S1 (en) 2017-02-17 2020-05-01 Chip

Publications (1)

Publication Number Publication Date
USD887998S1 true USD887998S1 (en) 2020-06-23

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US29/614,262 Active USD887998S1 (en) 2017-02-17 2017-08-17 Chip
US29/733,401 Active USD911298S1 (en) 2017-02-17 2020-05-01 Chip

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US29/733,401 Active USD911298S1 (en) 2017-02-17 2020-05-01 Chip

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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD911298S1 (en) * 2017-02-17 2021-02-23 Stat Peel Ag Chip
USD932051S1 (en) * 2019-08-30 2021-09-28 Kyocera Corporation Analysis chip for biochemical testing machine
USD934190S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934189S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934188S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD934822S1 (en) * 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD936025S1 (en) * 2018-12-26 2021-11-16 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD937791S1 (en) * 2018-12-26 2021-12-07 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD941786S1 (en) * 2019-11-22 2022-01-25 T-Worx Holdings, LLC Circuit board
USD941788S1 (en) * 2020-03-06 2022-01-25 Norman R. Byrne Circuit board
USD947800S1 (en) * 2018-07-23 2022-04-05 CACI, Inc.—Federal Integrated module
USD952181S1 (en) * 2019-08-30 2022-05-17 Kyocera Corporation Analysis chip for biochemical testing machine
USD962182S1 (en) * 2019-03-27 2022-08-30 Gudeng Precision Industrial Co., Ltd. Reticle pod connecting frame
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD972746S1 (en) * 2020-08-21 2022-12-13 Kyocera Corporation Analysis chip for biochemical inspection machine
USD975314S1 (en) * 2020-08-21 2023-01-10 Kyocera Corporation Analysis chip for biochemical inspection machine
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD988537S1 (en) * 2020-08-21 2023-06-06 Kyocera Corporation Analysis chip for biochemical inspection machine
USD990703S1 (en) * 2020-08-21 2023-06-27 Kyocera Corporation Analysis chip for biochemical inspection machine
USD993444S1 (en) * 2020-08-21 2023-07-25 Kyocera Corporation Analysis chip for biochemical inspection machine

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1640260S (en) * 2018-11-19 2019-09-02
JP1662551S (en) * 2019-09-06 2020-06-29

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USD456367S1 (en) * 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US7525200B2 (en) * 2003-12-24 2009-04-28 Seiko Epson Corporation Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
US20090230537A1 (en) * 2008-03-12 2009-09-17 Yong Liu Semiconductor die package including embedded flip chip
USD675582S1 (en) * 2011-06-27 2013-02-05 Uninet Imaging, Inc. Chip assembly
USD711842S1 (en) * 2011-08-04 2014-08-26 Swisscom Ag Electronic chip card
USD715234S1 (en) * 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
USD727861S1 (en) * 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
USD736212S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card

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US6040622A (en) * 1998-06-11 2000-03-21 Sandisk Corporation Semiconductor package using terminals formed on a conductive layer of a circuit board
US7830666B2 (en) * 2000-01-06 2010-11-09 Super Talent Electronics, Inc. Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
US7247932B1 (en) * 2000-05-19 2007-07-24 Megica Corporation Chip package with capacitor
US6613606B1 (en) * 2001-09-17 2003-09-02 Magic Corporation Structure of high performance combo chip and processing method
US20050013106A1 (en) * 2003-07-17 2005-01-20 Takiar Hem P. Peripheral card with hidden test pins
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JP5198379B2 (en) * 2009-07-23 2013-05-15 株式会社東芝 Semiconductor memory card
EP2465040A1 (en) * 2009-08-14 2012-06-20 SanDisk IL Ltd. Dual interface card with backward and forward compatibility
USD720354S1 (en) * 2011-11-22 2014-12-30 Kabushiki Kaisha Toshiba Module with built-in integrated circuits for use with IC card
TWM450884U (en) * 2012-10-11 2013-04-11 Carry Technology Co Ltd Memory card adapter device
USD728577S1 (en) * 2014-07-01 2015-05-05 Google Inc. Mobile device module
USD730906S1 (en) * 2014-07-01 2015-06-02 Google Inc. Mobile device module
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD864968S1 (en) * 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD773467S1 (en) * 2015-11-12 2016-12-06 Samsung Electronics Co., Ltd. Memory card
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD310514S (en) * 1987-04-23 1990-09-11 Digital Equipment Corporation Chip cartridge
USD365092S (en) * 1993-08-12 1995-12-12 Siemens Aktiengesellschaft Chipcard module
US6211572B1 (en) * 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US6201296B1 (en) * 1996-09-23 2001-03-13 Siemens Aktiengesellschaft Semiconductor chip with protection against analyzing
USD406822S (en) * 1997-03-06 1999-03-16 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
US6307269B1 (en) * 1997-07-11 2001-10-23 Hitachi, Ltd. Semiconductor device with chip size package
USD430024S (en) * 1998-11-04 2000-08-29 Affymetrix, Inc. Chip packaging device
US6297561B1 (en) * 1999-05-26 2001-10-02 United Microelectronics Corp. Semiconductor chip
USD456367S1 (en) * 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US7525200B2 (en) * 2003-12-24 2009-04-28 Seiko Epson Corporation Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
US20090230537A1 (en) * 2008-03-12 2009-09-17 Yong Liu Semiconductor die package including embedded flip chip
USD675582S1 (en) * 2011-06-27 2013-02-05 Uninet Imaging, Inc. Chip assembly
USD711842S1 (en) * 2011-08-04 2014-08-26 Swisscom Ag Electronic chip card
USD715234S1 (en) * 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
USD727861S1 (en) * 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
USD736212S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD911298S1 (en) * 2017-02-17 2021-02-23 Stat Peel Ag Chip
USD947800S1 (en) * 2018-07-23 2022-04-05 CACI, Inc.—Federal Integrated module
US11747775B2 (en) 2018-07-23 2023-09-05 CACI, Inc.—Federal Integrated tamper detection system and methods
US11662698B2 (en) 2018-07-23 2023-05-30 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using machine learning models
US11333677B2 (en) 2018-07-23 2022-05-17 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using heuristic models
USD936025S1 (en) * 2018-12-26 2021-11-16 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD937791S1 (en) * 2018-12-26 2021-12-07 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD962182S1 (en) * 2019-03-27 2022-08-30 Gudeng Precision Industrial Co., Ltd. Reticle pod connecting frame
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD934190S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934822S1 (en) * 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934188S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD934189S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD952181S1 (en) * 2019-08-30 2022-05-17 Kyocera Corporation Analysis chip for biochemical testing machine
USD932051S1 (en) * 2019-08-30 2021-09-28 Kyocera Corporation Analysis chip for biochemical testing machine
USD941786S1 (en) * 2019-11-22 2022-01-25 T-Worx Holdings, LLC Circuit board
USD968344S1 (en) 2019-11-22 2022-11-01 T-Worx Holdings, LLC Circuit board
USD941788S1 (en) * 2020-03-06 2022-01-25 Norman R. Byrne Circuit board
USD975314S1 (en) * 2020-08-21 2023-01-10 Kyocera Corporation Analysis chip for biochemical inspection machine
USD988537S1 (en) * 2020-08-21 2023-06-06 Kyocera Corporation Analysis chip for biochemical inspection machine
USD990703S1 (en) * 2020-08-21 2023-06-27 Kyocera Corporation Analysis chip for biochemical inspection machine
USD993444S1 (en) * 2020-08-21 2023-07-25 Kyocera Corporation Analysis chip for biochemical inspection machine
USD972746S1 (en) * 2020-08-21 2022-12-13 Kyocera Corporation Analysis chip for biochemical inspection machine

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