USD489338S1 - Packaged semiconductor device - Google Patents
Packaged semiconductor device Download PDFInfo
- Publication number
- USD489338S1 USD489338S1 US29/187,122 US18712203F USD489338S US D489338 S1 USD489338 S1 US D489338S1 US 18712203 F US18712203 F US 18712203F US D489338 S USD489338 S US D489338S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- packaged semiconductor
- packaged
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
FIG. 1 is a perspective view from the back right side and above the packaged semiconductor device;
FIG. 2 is a perspective view from the front left side and above the packaged semiconductor device;
FIG. 3 is a perspective view from the front left side and below the packaged semiconductor device;
FIG. 4 is a top view of the packaged semiconductor device;
FIG. 5 is a bottom view of the packaged semiconductor device;
FIG. 6 is an elevational view from the left side of the packaged semiconductor device;
FIG. 7 is an elevational view from the right side of the packaged semiconductor device;
FIG. 8 is an elevational view from the back side of the packaged semiconductor device; and,
FIG. 9 is an elevational view from the front side of the packaged semiconductor device.
Claims (1)
- We claim the ornamental design for a packaged semiconductor device, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/187,122 USD489338S1 (en) | 2003-07-28 | 2003-07-28 | Packaged semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/187,122 USD489338S1 (en) | 2003-07-28 | 2003-07-28 | Packaged semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
USD489338S1 true USD489338S1 (en) | 2004-05-04 |
Family
ID=32174399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/187,122 Expired - Lifetime USD489338S1 (en) | 2003-07-28 | 2003-07-28 | Packaged semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (1) | USD489338S1 (en) |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD741261S1 (en) | 2011-12-28 | 2015-10-20 | Toko, Inc. | Inductor |
USD752000S1 (en) | 2013-03-07 | 2016-03-22 | Vlt, Inc. | Semiconductor device |
USD758329S1 (en) * | 2013-08-06 | 2016-06-07 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD760230S1 (en) * | 2014-09-16 | 2016-06-28 | Daishinku Corporation | Piezoelectric vibration device |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD839244S1 (en) * | 2016-04-29 | 2019-01-29 | Laird Technologies, Inc. | Antenna housing |
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
USD920265S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD920266S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD1009814S1 (en) * | 2020-04-01 | 2024-01-02 | Xiamen San'an Optoelectronics Technology Co., Ltd. | LED chip |
USD1022930S1 (en) * | 2020-03-30 | 2024-04-16 | Quanzhou San'an Semiconductor Technology Co., Ltd. | LED chip |
-
2003
- 2003-07-28 US US29/187,122 patent/USD489338S1/en not_active Expired - Lifetime
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD741261S1 (en) | 2011-12-28 | 2015-10-20 | Toko, Inc. | Inductor |
USD752000S1 (en) | 2013-03-07 | 2016-03-22 | Vlt, Inc. | Semiconductor device |
US9269661B1 (en) | 2013-03-07 | 2016-02-23 | Vlt, Inc. | Low resistance power switching device |
US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD758329S1 (en) * | 2013-08-06 | 2016-06-07 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
USD760230S1 (en) * | 2014-09-16 | 2016-06-28 | Daishinku Corporation | Piezoelectric vibration device |
USD767571S1 (en) | 2014-09-16 | 2016-09-27 | Daishinku Corporation | Piezoelectric vibration device |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD839244S1 (en) * | 2016-04-29 | 2019-01-29 | Laird Technologies, Inc. | Antenna housing |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
USD920265S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD920266S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD1022930S1 (en) * | 2020-03-30 | 2024-04-16 | Quanzhou San'an Semiconductor Technology Co., Ltd. | LED chip |
USD1009814S1 (en) * | 2020-04-01 | 2024-01-02 | Xiamen San'an Optoelectronics Technology Co., Ltd. | LED chip |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD969762S1 (en) | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
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