USD845921S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD845921S1
USD845921S1 US29/623,907 US201729623907F USD845921S US D845921 S1 USD845921 S1 US D845921S1 US 201729623907 F US201729623907 F US 201729623907F US D845921 S USD845921 S US D845921S
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US
United States
Prior art keywords
semiconductor device
view
design
ornamental design
dash
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/623,907
Inventor
Koshun SAITO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
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Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAITO, KOSHUN
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Publication of USD845921S1 publication Critical patent/USD845921S1/en
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Description

FIG. 1 is a perspective view of a semiconductor device showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a right-side view thereof, the left-side view being a mirror image of FIG. 6.
The broken lines illustrate portions of the semiconductor device and form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/623,907 2017-05-02 2017-10-27 Semiconductor device Active USD845921S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-009670 2017-01-23
JPD2017-9670F JP1592769S (en) 2017-05-02 2017-05-02

Publications (1)

Publication Number Publication Date
USD845921S1 true USD845921S1 (en) 2019-04-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/623,907 Active USD845921S1 (en) 2017-05-02 2017-10-27 Semiconductor device

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US (1) USD845921S1 (en)
JP (1) JP1592769S (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD952585S1 (en) * 2020-03-16 2022-05-24 Dynatron Corporation Vapor chamber
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module

Citations (22)

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Publication number Priority date Publication date Assignee Title
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US5949294A (en) * 1996-09-20 1999-09-07 Matsushita Electric Industrial Co., Ltd. Reference frequency source oscillator formed from first and second containers
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US5991162A (en) * 1997-06-27 1999-11-23 Nec Corporation High-frequency integrated circuit device and manufacture method thereof
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
US6355877B1 (en) * 1999-04-02 2002-03-12 Alps Electric Co Ltd Electronic device with excellent shielding and productivity
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD605930S1 (en) * 2009-06-01 2009-12-15 DisplayCraft, Inc. Small shelf bracket
USD632948S1 (en) * 2008-12-02 2011-02-22 Jesse D. Travis Support structure
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5949294A (en) * 1996-09-20 1999-09-07 Matsushita Electric Industrial Co., Ltd. Reference frequency source oscillator formed from first and second containers
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US5991162A (en) * 1997-06-27 1999-11-23 Nec Corporation High-frequency integrated circuit device and manufacture method thereof
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US6355877B1 (en) * 1999-04-02 2002-03-12 Alps Electric Co Ltd Electronic device with excellent shielding and productivity
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD632948S1 (en) * 2008-12-02 2011-02-22 Jesse D. Travis Support structure
USD605930S1 (en) * 2009-06-01 2009-12-15 DisplayCraft, Inc. Small shelf bracket
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Office Action issued for counterpart Japanese Design Application No. 2017-009670, dated Aug. 25, 2017, 6 pages including English translation.

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD952585S1 (en) * 2020-03-16 2022-05-24 Dynatron Corporation Vapor chamber
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module

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