USD902164S1 - Integrated circuit card - Google Patents
Integrated circuit card Download PDFInfo
- Publication number
- USD902164S1 USD902164S1 US29/696,414 US201929696414F USD902164S US D902164 S1 USD902164 S1 US D902164S1 US 201929696414 F US201929696414 F US 201929696414F US D902164 S USD902164 S US D902164S
- Authority
- US
- United States
- Prior art keywords
- integrated circuit
- circuit card
- view
- elevational view
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for an integrated circuit card, as shown and described.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019001319 | 2019-01-24 | ||
JP2019-001319 | 2019-01-24 | ||
JP2019-005080 | 2019-03-12 | ||
JP2019005080 | 2019-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD902164S1 true USD902164S1 (en) | 2020-11-17 |
Family
ID=73158713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/696,414 Active USD902164S1 (en) | 2019-01-24 | 2019-06-27 | Integrated circuit card |
Country Status (1)
Country | Link |
---|---|
US (1) | USD902164S1 (en) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD920265S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD920266S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD928162S1 (en) * | 2016-01-19 | 2021-08-17 | Sony Corporation | Memory card |
USD930601S1 (en) * | 2019-04-26 | 2021-09-14 | The Noco Company | Circuit board |
USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD934868S1 (en) * | 2018-02-28 | 2021-11-02 | Sony Corporation | Memory card |
USD937232S1 (en) | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD938374S1 (en) * | 2019-09-09 | 2021-12-14 | The Noco Company | Circuit board |
USD944219S1 (en) * | 2019-09-09 | 2022-02-22 | The Noco Company | Circuit board |
USD947800S1 (en) * | 2018-07-23 | 2022-04-05 | CACI, Inc.—Federal | Integrated module |
USD949117S1 (en) * | 2019-09-09 | 2022-04-19 | The Noco Company | Circuit board |
USD954006S1 (en) * | 2020-11-03 | 2022-06-07 | Linxens Holding | Microcircuit for smart card |
USD956707S1 (en) * | 2019-09-26 | 2022-07-05 | Lapis Semiconductor Co., Ltd. | Circuit board |
USD958762S1 (en) * | 2019-09-09 | 2022-07-26 | The Noco Company | Circuit board |
USD980810S1 (en) * | 2020-02-27 | 2023-03-14 | Kioxia Corporation | Integrated circuit card |
USD1009777S1 (en) | 2019-09-09 | 2024-01-02 | The Noco Company | Battery |
USD1009815S1 (en) | 2021-01-22 | 2024-01-02 | The Noco Company | Circuit board |
USD1010591S1 (en) | 2021-01-22 | 2024-01-09 | The Noco Company | Circuit board |
USD1012872S1 (en) | 2021-01-22 | 2024-01-30 | The Noco Company | Circuit board |
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USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
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US10557191B2 (en) * | 2017-01-31 | 2020-02-11 | Sakai Display Products Corporation | Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device |
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US10600789B2 (en) * | 2016-12-19 | 2020-03-24 | Samsung Electronics Co., Ltd. | Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device |
US10605828B2 (en) * | 2017-03-30 | 2020-03-31 | Advanced Semiconductor Engineering, Inc. | Device for attaching a semiconductor device to a circuit board |
US10636703B2 (en) * | 2010-05-10 | 2020-04-28 | Magnachip Semiconductor, Ltd. | Semiconductor device for preventing crack in pad region and fabricating method thereof |
US10644115B2 (en) * | 2018-02-28 | 2020-05-05 | Flosfia Inc. | Layered structure and semiconductor device including layered structure |
US10651050B2 (en) * | 2017-12-01 | 2020-05-12 | Micron Technology, Inc. | Semiconductor device packages and structures |
US10672878B2 (en) * | 2018-02-08 | 2020-06-02 | Panasonic Intellectual Property Management Co., Ltd. | Silicon carbide semiconductor device |
-
2019
- 2019-06-27 US US29/696,414 patent/USD902164S1/en active Active
Patent Citations (36)
Publication number | Priority date | Publication date | Assignee | Title |
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CN302873810S (en) | 2014-07-09 | |||
USD523403S1 (en) * | 2004-09-09 | 2006-06-20 | Kabushiki Kaisha Toshiba | Substrate for a semiconductor device |
USD552098S1 (en) | 2005-05-24 | 2007-10-02 | Renesas Technology Corporation | Memory card |
USD588597S1 (en) | 2007-12-17 | 2009-03-17 | Panasonic Corporation | IC memory card |
USD588598S1 (en) | 2008-04-01 | 2009-03-17 | Panasonic Corporation | IC memory card |
USD588599S1 (en) | 2008-04-01 | 2009-03-17 | Panasonic Corporation | IC memory card |
US10636703B2 (en) * | 2010-05-10 | 2020-04-28 | Magnachip Semiconductor, Ltd. | Semiconductor device for preventing crack in pad region and fabricating method thereof |
USD639812S1 (en) | 2010-05-17 | 2011-06-14 | Panasonic Corporation | Memory card |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD681640S1 (en) | 2010-12-03 | 2013-05-07 | Sony Computer Entertainment Inc. | Storage medium |
USD674760S1 (en) * | 2011-04-01 | 2013-01-22 | Fuji Electric Co., Ltd. | Semiconductor device |
CN302268439S (en) | 2011-11-29 | 2013-01-02 | 三星电子株式会社 | Storage card |
CN302254659S (en) | 2011-11-29 | 2012-12-26 | 三星电子株式会社 | Storage card |
CN302254658S (en) | 2011-11-29 | 2012-12-26 | 三星电子株式会社 | Storage card |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
USD729250S1 (en) * | 2013-07-30 | 2015-05-12 | Samsung Electronics Co., Ltd. | Semiconductor memory device |
USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
US10510626B2 (en) * | 2015-07-06 | 2019-12-17 | Infineon Technologies Ag | Method for use in manufacturing a semiconductor device die |
US10553559B2 (en) * | 2015-10-28 | 2020-02-04 | Mitsubishi Electric Corporation | Power semiconductor device |
USD814473S1 (en) | 2016-01-19 | 2018-04-03 | Sony Corporation | Memory card |
USD796978S1 (en) * | 2016-03-24 | 2017-09-12 | Advantest Corporation | Socket for electronic device testing apparatus |
US10600744B2 (en) * | 2016-11-15 | 2020-03-24 | Rohm Co., Ltd. | Semiconductor device |
US10600789B2 (en) * | 2016-12-19 | 2020-03-24 | Samsung Electronics Co., Ltd. | Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device |
US10557191B2 (en) * | 2017-01-31 | 2020-02-11 | Sakai Display Products Corporation | Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device |
US10605828B2 (en) * | 2017-03-30 | 2020-03-31 | Advanced Semiconductor Engineering, Inc. | Device for attaching a semiconductor device to a circuit board |
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
US10546825B2 (en) * | 2017-05-24 | 2020-01-28 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device |
USD873227S1 (en) * | 2017-10-23 | 2020-01-21 | Mitsubishi Electric Corporation | Semiconductor device |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
US10651050B2 (en) * | 2017-12-01 | 2020-05-12 | Micron Technology, Inc. | Semiconductor device packages and structures |
US10672878B2 (en) * | 2018-02-08 | 2020-06-02 | Panasonic Intellectual Property Management Co., Ltd. | Silicon carbide semiconductor device |
US10644115B2 (en) * | 2018-02-28 | 2020-05-05 | Flosfia Inc. | Layered structure and semiconductor device including layered structure |
JP1621567S (en) | 2018-06-13 | 2019-01-07 |
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD928162S1 (en) * | 2016-01-19 | 2021-08-17 | Sony Corporation | Memory card |
USD934868S1 (en) * | 2018-02-28 | 2021-11-02 | Sony Corporation | Memory card |
USD947800S1 (en) * | 2018-07-23 | 2022-04-05 | CACI, Inc.—Federal | Integrated module |
US11747775B2 (en) | 2018-07-23 | 2023-09-05 | CACI, Inc.—Federal | Integrated tamper detection system and methods |
US11662698B2 (en) | 2018-07-23 | 2023-05-30 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using machine learning models |
US11333677B2 (en) | 2018-07-23 | 2022-05-17 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using heuristic models |
USD1009778S1 (en) | 2019-04-26 | 2024-01-02 | The Noco Company | Battery |
USD930601S1 (en) * | 2019-04-26 | 2021-09-14 | The Noco Company | Circuit board |
USD1003822S1 (en) | 2019-04-26 | 2023-11-07 | The Noco Company | Battery |
USD1003842S1 (en) * | 2019-04-26 | 2023-11-07 | The Noco Company | Circuit board |
USD937793S1 (en) * | 2019-04-26 | 2021-12-07 | The Noco Company | Circuit board |
USD937792S1 (en) * | 2019-04-26 | 2021-12-07 | The Noco Company | Circuit board |
USD989014S1 (en) * | 2019-09-09 | 2023-06-13 | The Noco Company | Circuit board |
USD938374S1 (en) * | 2019-09-09 | 2021-12-14 | The Noco Company | Circuit board |
USD949117S1 (en) * | 2019-09-09 | 2022-04-19 | The Noco Company | Circuit board |
USD1009777S1 (en) | 2019-09-09 | 2024-01-02 | The Noco Company | Battery |
USD1001753S1 (en) | 2019-09-09 | 2023-10-17 | The Noco Company | Circuit board |
USD958762S1 (en) * | 2019-09-09 | 2022-07-26 | The Noco Company | Circuit board |
USD944219S1 (en) * | 2019-09-09 | 2022-02-22 | The Noco Company | Circuit board |
USD956707S1 (en) * | 2019-09-26 | 2022-07-05 | Lapis Semiconductor Co., Ltd. | Circuit board |
USD920265S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD920266S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD937232S1 (en) | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD937233S1 (en) | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD938925S1 (en) * | 2019-10-24 | 2021-12-21 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD980810S1 (en) * | 2020-02-27 | 2023-03-14 | Kioxia Corporation | Integrated circuit card |
USD954006S1 (en) * | 2020-11-03 | 2022-06-07 | Linxens Holding | Microcircuit for smart card |
USD1009815S1 (en) | 2021-01-22 | 2024-01-02 | The Noco Company | Circuit board |
USD1010591S1 (en) | 2021-01-22 | 2024-01-09 | The Noco Company | Circuit board |
USD1012872S1 (en) | 2021-01-22 | 2024-01-30 | The Noco Company | Circuit board |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |