USD796978S1 - Socket for electronic device testing apparatus - Google Patents

Socket for electronic device testing apparatus Download PDF

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Publication number
USD796978S1
USD796978S1 US29/560,253 US201629560253F USD796978S US D796978 S1 USD796978 S1 US D796978S1 US 201629560253 F US201629560253 F US 201629560253F US D796978 S USD796978 S US D796978S
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United States
Prior art keywords
socket
electronic device
view
testing apparatus
device testing
Prior art date
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US29/560,253
Inventor
Takashi Kawashima
Shintaro Takaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to ADVANTEST CORPORATION reassignment ADVANTEST CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAWASHIMA, TAKASHI, TAKAKI, SHINTARO
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Publication of USD796978S1 publication Critical patent/USD796978S1/en
Assigned to ADVANTEST CORPORATION reassignment ADVANTEST CORPORATION CHANGE OF ADDRESS Assignors: ADVANTEST CORPORATION
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Description

FIG. 1 is a top plan view of a socket for an electronic device testing apparatus according to a first embodiment of the present design.
FIG. 2 is a bottom plan view of the socket shown in FIG. 1.
FIG. 3 is a front view of the socket shown in FIG. 1.
FIG. 4 is a rear view of the socket shown in FIG. 1.
FIG. 5 is a right side view of the socket shown in FIG. 1.
FIG. 6 is a left side view of the socket shown in FIG. 1.
FIG. 7 is a perspective view, as viewed from above, of the socket shown in FIG. 1.
FIG. 8 is a reference top plan view of the socket shown in FIG. 1.
FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 8.
FIG. 10 is a reference cross-sectional view showing the usage state of the socket shown in FIG. 1.
FIG. 11 is a top plan view of a socket for an electronic device testing apparatus according to a second embodiment of the present design.
FIG. 12 is a perspective view, as viewed from above, of the socket shown in FIG. 11.
FIG. 13 is a reference top plan view of the socket shown in FIG. 11; and,
FIG. 14 is a cross-sectional view taken along line 14-14 of FIG. 13.
The bottom plan view, the front view, the rear view, the right side view, and the left side view of the second embodiment are the same as the bottom plan view, the front view, the rear view, the right side view, and the left side view of the first embodiment, respectively.
The present design is embodied in a socket to be installed in an electronic device testing apparatus that tests electrical characteristics of an electronic device such as a semiconductor integrated circuit. As shown in the reference cross-sectional view showing the usage state, when an electronic device is tested, the electronic device retained by an insert is pressed into the socket from above, and external connection terminals led out from the electronic device are brought into contact with terminals of the socket (the terminals are represented by a large number of circles in the top plan views) so that the electronic device and the electronic device testing apparatus are electrically connected with each other via the socket. In this state, the electronic device testing apparatus tests the electronic device. Eight recessed parts shown in FIG. 1 and FIG. 7 are disposed around the terminals to avoid interference of hook parts of the insert holding the electronic device with the socket, and eight recessed parts shown in FIG. 11 and FIG. 12 are also disposed around the terminals to avoid interference of hook parts of the insert holding the electronic device with the socket. When the electronic device is made to approach the socket, an image recognition process is used to align the electronic device with the socket in a high degree of accuracy. A black rectangular frame shown in FIG. 1 is used in the image recognition process, and a black rectangular frame shown in FIG. 11 is also used in the image recognition process.
The part represented by solid lines is a part of the claimed design. The dot-dash broken lines (the alternate long and short dash lines) represent only a border between the part of the claimed design and other part. The dashed broken lines (the broken lines) are for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a socket for an electronic device testing apparatus, as shown and described.
US29/560,253 2016-03-24 2016-04-05 Socket for electronic device testing apparatus Active USD796978S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2016-6402F JP1561023S (en) 2016-03-24 2016-03-24
JP2016-006402 2016-03-24

Publications (1)

Publication Number Publication Date
USD796978S1 true USD796978S1 (en) 2017-09-12

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US29/560,253 Active USD796978S1 (en) 2016-03-24 2016-04-05 Socket for electronic device testing apparatus

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US (1) USD796978S1 (en)
JP (1) JP1561023S (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD836088S1 (en) * 2016-08-16 2018-12-18 Mitek Corp., Inc. Sleek ceiling speaker
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD967036S1 (en) * 2019-09-26 2022-10-18 Infineon Technologies Ag Electrical contact
USD978116S1 (en) * 2020-06-30 2023-02-14 Audio-Technica Corporation Microphone
USD1010620S1 (en) * 2019-09-09 2024-01-09 Murata Manufacturing Co., Ltd. Module for RFID

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8911266B2 (en) * 2010-06-01 2014-12-16 3M Innovative Properties Company Contact holder
US9039425B2 (en) * 2013-01-21 2015-05-26 Tyco Electronics Corporation Electrical interconnect device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8911266B2 (en) * 2010-06-01 2014-12-16 3M Innovative Properties Company Contact holder
US9039425B2 (en) * 2013-01-21 2015-05-26 Tyco Electronics Corporation Electrical interconnect device

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Office Action issued in China Appl. No. 201630224369.0, dated Dec. 9, 2016 , along with an English translation thereof.
Office Action issued in China Appl. No. 201630224369.0, dated Nov. 1, 2016 , along with an English translation thereof.
Office Action issued in Korea Counterpart Patent Appl. No. 30-2016-0017017, dated Oct. 4, 2016 , along with an English translation thereof.
Taiwanese Official Action in TW Appl. No. 103306664, Jul. 20, 2015.
Taiwanese Official Action in TW Appl. No. 103306665, Jul. 20, 2015.

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD836088S1 (en) * 2016-08-16 2018-12-18 Mitek Corp., Inc. Sleek ceiling speaker
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD1046799S1 (en) 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD1010620S1 (en) * 2019-09-09 2024-01-09 Murata Manufacturing Co., Ltd. Module for RFID
USD967036S1 (en) * 2019-09-26 2022-10-18 Infineon Technologies Ag Electrical contact
USD978116S1 (en) * 2020-06-30 2023-02-14 Audio-Technica Corporation Microphone

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Publication number Publication date
JP1561023S (en) 2016-10-17

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