USD796978S1 - Socket for electronic device testing apparatus - Google Patents
Socket for electronic device testing apparatus Download PDFInfo
- Publication number
- USD796978S1 USD796978S1 US29/560,253 US201629560253F USD796978S US D796978 S1 USD796978 S1 US D796978S1 US 201629560253 F US201629560253 F US 201629560253F US D796978 S USD796978 S US D796978S
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- US
- United States
- Prior art keywords
- socket
- electronic device
- view
- testing apparatus
- device testing
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Description
The bottom plan view, the front view, the rear view, the right side view, and the left side view of the second embodiment are the same as the bottom plan view, the front view, the rear view, the right side view, and the left side view of the first embodiment, respectively.
The present design is embodied in a socket to be installed in an electronic device testing apparatus that tests electrical characteristics of an electronic device such as a semiconductor integrated circuit. As shown in the reference cross-sectional view showing the usage state, when an electronic device is tested, the electronic device retained by an insert is pressed into the socket from above, and external connection terminals led out from the electronic device are brought into contact with terminals of the socket (the terminals are represented by a large number of circles in the top plan views) so that the electronic device and the electronic device testing apparatus are electrically connected with each other via the socket. In this state, the electronic device testing apparatus tests the electronic device. Eight recessed parts shown in FIG. 1 and FIG. 7 are disposed around the terminals to avoid interference of hook parts of the insert holding the electronic device with the socket, and eight recessed parts shown in FIG. 11 and FIG. 12 are also disposed around the terminals to avoid interference of hook parts of the insert holding the electronic device with the socket. When the electronic device is made to approach the socket, an image recognition process is used to align the electronic device with the socket in a high degree of accuracy. A black rectangular frame shown in FIG. 1 is used in the image recognition process, and a black rectangular frame shown in FIG. 11 is also used in the image recognition process.
The part represented by solid lines is a part of the claimed design. The dot-dash broken lines (the alternate long and short dash lines) represent only a border between the part of the claimed design and other part. The dashed broken lines (the broken lines) are for illustrative purposes only and form no part of the claimed design.
Claims (1)
- We claim the ornamental design for a socket for an electronic device testing apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2016-6402F JP1561023S (en) | 2016-03-24 | 2016-03-24 | |
JP2016-006402 | 2016-03-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD796978S1 true USD796978S1 (en) | 2017-09-12 |
Family
ID=57122013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/560,253 Active USD796978S1 (en) | 2016-03-24 | 2016-04-05 | Socket for electronic device testing apparatus |
Country Status (2)
Country | Link |
---|---|
US (1) | USD796978S1 (en) |
JP (1) | JP1561023S (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD836088S1 (en) * | 2016-08-16 | 2018-12-18 | Mitek Corp., Inc. | Sleek ceiling speaker |
USD893439S1 (en) * | 2018-05-07 | 2020-08-18 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
USD902164S1 (en) * | 2019-01-24 | 2020-11-17 | Toshiba Memory Corporation | Integrated circuit card |
USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
USD933618S1 (en) * | 2018-10-31 | 2021-10-19 | Asahi Kasei Microdevices Corporation | Semiconductor module |
USD967036S1 (en) * | 2019-09-26 | 2022-10-18 | Infineon Technologies Ag | Electrical contact |
USD978116S1 (en) * | 2020-06-30 | 2023-02-14 | Audio-Technica Corporation | Microphone |
USD1010620S1 (en) * | 2019-09-09 | 2024-01-09 | Murata Manufacturing Co., Ltd. | Module for RFID |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8911266B2 (en) * | 2010-06-01 | 2014-12-16 | 3M Innovative Properties Company | Contact holder |
US9039425B2 (en) * | 2013-01-21 | 2015-05-26 | Tyco Electronics Corporation | Electrical interconnect device |
-
2016
- 2016-03-24 JP JPD2016-6402F patent/JP1561023S/ja active Active
- 2016-04-05 US US29/560,253 patent/USD796978S1/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8911266B2 (en) * | 2010-06-01 | 2014-12-16 | 3M Innovative Properties Company | Contact holder |
US9039425B2 (en) * | 2013-01-21 | 2015-05-26 | Tyco Electronics Corporation | Electrical interconnect device |
Non-Patent Citations (5)
Title |
---|
Office Action issued in China Appl. No. 201630224369.0, dated Dec. 9, 2016 , along with an English translation thereof. |
Office Action issued in China Appl. No. 201630224369.0, dated Nov. 1, 2016 , along with an English translation thereof. |
Office Action issued in Korea Counterpart Patent Appl. No. 30-2016-0017017, dated Oct. 4, 2016 , along with an English translation thereof. |
Taiwanese Official Action in TW Appl. No. 103306664, Jul. 20, 2015. |
Taiwanese Official Action in TW Appl. No. 103306665, Jul. 20, 2015. |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD836088S1 (en) * | 2016-08-16 | 2018-12-18 | Mitek Corp., Inc. | Sleek ceiling speaker |
USD893439S1 (en) * | 2018-05-07 | 2020-08-18 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
USD933618S1 (en) * | 2018-10-31 | 2021-10-19 | Asahi Kasei Microdevices Corporation | Semiconductor module |
USD1046799S1 (en) | 2018-10-31 | 2024-10-15 | Asahi Kasei Microdevices Corporation | Semiconductor module |
USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
USD902164S1 (en) * | 2019-01-24 | 2020-11-17 | Toshiba Memory Corporation | Integrated circuit card |
USD1010620S1 (en) * | 2019-09-09 | 2024-01-09 | Murata Manufacturing Co., Ltd. | Module for RFID |
USD967036S1 (en) * | 2019-09-26 | 2022-10-18 | Infineon Technologies Ag | Electrical contact |
USD978116S1 (en) * | 2020-06-30 | 2023-02-14 | Audio-Technica Corporation | Microphone |
Also Published As
Publication number | Publication date |
---|---|
JP1561023S (en) | 2016-10-17 |
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