USD933618S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD933618S1
USD933618S1 US29/696,264 US201929696264F USD933618S US D933618 S1 USD933618 S1 US D933618S1 US 201929696264 F US201929696264 F US 201929696264F US D933618 S USD933618 S US D933618S
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US
United States
Prior art keywords
semiconductor module
view
semiconductor
module
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/696,264
Inventor
Osamu SHIRATA
Yusuke Hidaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei Microdevices Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2018-23985F external-priority patent/JP1641808S/ja
Priority claimed from JPD2018-23983F external-priority patent/JP1640409S/ja
Priority claimed from JPD2018-23984F external-priority patent/JP1640626S/ja
Application filed by Asahi Kasei Microdevices Corp filed Critical Asahi Kasei Microdevices Corp
Assigned to ASAHI KASEI MICRODEVICES CORPORATION reassignment ASAHI KASEI MICRODEVICES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIRATA, OSAMU, HIDAKA, YUSUKE
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Publication of USD933618S1 publication Critical patent/USD933618S1/en
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Description

FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view of the semiconductor module thereof;
FIG. 3 is a left view of the semiconductor module thereof;
FIG. 4 is a right view of the semiconductor module thereof;
FIG. 5 is a top side view of the semiconductor module thereof; and,
FIG. 6 is a bottom side view of the semiconductor module thereof.
The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, and the bottom view represents a shape of a three-dimensional shape.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module, as shown and described.
US29/696,264 2018-10-31 2019-06-26 Semiconductor module Active USD933618S1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JPD2018-23985F JP1641808S (en) 2018-10-31 2018-10-31
JPD2018-23983F JP1640409S (en) 2018-10-31 2018-10-31
JPD2018-23985 2018-10-31
JPD2018-23983 2018-10-31
JPD2018-23984F JP1640626S (en) 2018-10-31 2018-10-31
JPD2018-23984 2018-10-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/807,156 Division USD1046799S1 (en) 2018-10-31 2021-09-09 Semiconductor module

Publications (1)

Publication Number Publication Date
USD933618S1 true USD933618S1 (en) 2021-10-19

Family

ID=78069366

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/696,264 Active USD933618S1 (en) 2018-10-31 2019-06-26 Semiconductor module

Country Status (1)

Country Link
US (1) USD933618S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD973030S1 (en) * 2021-02-23 2022-12-20 Dong Woon Anatech Co., Ltd Semiconductor device
USD986840S1 (en) * 2020-05-13 2023-05-23 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD989013S1 (en) * 2021-06-18 2023-06-13 Dong Woon Anatech Co., Ltd Semiconductor device
USD1046799S1 (en) * 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module

Citations (24)

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JP2002076057A (en) 2000-08-31 2002-03-15 Hitachi Ltd Electronic device and manufacturing method therefor
USD523403S1 (en) * 2004-09-09 2006-06-20 Kabushiki Kaisha Toshiba Substrate for a semiconductor device
US20080061415A1 (en) 2006-09-11 2008-03-13 Matsushita Electric Industrial Co., Ltd. Semiconductor device, method for manufacturing semiconductor device, and electric equipment system
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD729250S1 (en) * 2013-07-30 2015-05-12 Samsung Electronics Co., Ltd. Semiconductor memory device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD796978S1 (en) * 2016-03-24 2017-09-12 Advantest Corporation Socket for electronic device testing apparatus
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
US10510626B2 (en) * 2015-07-06 2019-12-17 Infineon Technologies Ag Method for use in manufacturing a semiconductor device die
US10546825B2 (en) * 2017-05-24 2020-01-28 Advanced Semiconductor Engineering, Inc. Semiconductor package device
US10553559B2 (en) * 2015-10-28 2020-02-04 Mitsubishi Electric Corporation Power semiconductor device
US10557191B2 (en) * 2017-01-31 2020-02-11 Sakai Display Products Corporation Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device
US10600789B2 (en) * 2016-12-19 2020-03-24 Samsung Electronics Co., Ltd. Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device
US10600744B2 (en) * 2016-11-15 2020-03-24 Rohm Co., Ltd. Semiconductor device
US10605828B2 (en) * 2017-03-30 2020-03-31 Advanced Semiconductor Engineering, Inc. Device for attaching a semiconductor device to a circuit board
US10636703B2 (en) * 2010-05-10 2020-04-28 Magnachip Semiconductor, Ltd. Semiconductor device for preventing crack in pad region and fabricating method thereof
US10644115B2 (en) * 2018-02-28 2020-05-05 Flosfia Inc. Layered structure and semiconductor device including layered structure
US10651050B2 (en) * 2017-12-01 2020-05-12 Micron Technology, Inc. Semiconductor device packages and structures
US10672878B2 (en) * 2018-02-08 2020-06-02 Panasonic Intellectual Property Management Co., Ltd. Silicon carbide semiconductor device

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6492737B1 (en) 2000-08-31 2002-12-10 Hitachi, Ltd. Electronic device and a method of manufacturing the same
US20030102570A1 (en) 2000-08-31 2003-06-05 Hitachi, Ltd. Electronic device and a method of manufacturing the same
JP2002076057A (en) 2000-08-31 2002-03-15 Hitachi Ltd Electronic device and manufacturing method therefor
USD523403S1 (en) * 2004-09-09 2006-06-20 Kabushiki Kaisha Toshiba Substrate for a semiconductor device
US20080061415A1 (en) 2006-09-11 2008-03-13 Matsushita Electric Industrial Co., Ltd. Semiconductor device, method for manufacturing semiconductor device, and electric equipment system
JP2008066655A (en) 2006-09-11 2008-03-21 Matsushita Electric Ind Co Ltd Semiconductor device, manufacturing method of the semiconductor device, and electrical apparatus system
US10636703B2 (en) * 2010-05-10 2020-04-28 Magnachip Semiconductor, Ltd. Semiconductor device for preventing crack in pad region and fabricating method thereof
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD729250S1 (en) * 2013-07-30 2015-05-12 Samsung Electronics Co., Ltd. Semiconductor memory device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
US10510626B2 (en) * 2015-07-06 2019-12-17 Infineon Technologies Ag Method for use in manufacturing a semiconductor device die
US10553559B2 (en) * 2015-10-28 2020-02-04 Mitsubishi Electric Corporation Power semiconductor device
USD796978S1 (en) * 2016-03-24 2017-09-12 Advantest Corporation Socket for electronic device testing apparatus
US10600744B2 (en) * 2016-11-15 2020-03-24 Rohm Co., Ltd. Semiconductor device
US10600789B2 (en) * 2016-12-19 2020-03-24 Samsung Electronics Co., Ltd. Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device
US10557191B2 (en) * 2017-01-31 2020-02-11 Sakai Display Products Corporation Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device
US10605828B2 (en) * 2017-03-30 2020-03-31 Advanced Semiconductor Engineering, Inc. Device for attaching a semiconductor device to a circuit board
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
US10546825B2 (en) * 2017-05-24 2020-01-28 Advanced Semiconductor Engineering, Inc. Semiconductor package device
USD873227S1 (en) * 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
US10651050B2 (en) * 2017-12-01 2020-05-12 Micron Technology, Inc. Semiconductor device packages and structures
US10672878B2 (en) * 2018-02-08 2020-06-02 Panasonic Intellectual Property Management Co., Ltd. Silicon carbide semiconductor device
US10644115B2 (en) * 2018-02-28 2020-05-05 Flosfia Inc. Layered structure and semiconductor device including layered structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1046799S1 (en) * 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module
USD986840S1 (en) * 2020-05-13 2023-05-23 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD973030S1 (en) * 2021-02-23 2022-12-20 Dong Woon Anatech Co., Ltd Semiconductor device
USD989013S1 (en) * 2021-06-18 2023-06-13 Dong Woon Anatech Co., Ltd Semiconductor device

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