USD933618S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD933618S1 USD933618S1 US29/696,264 US201929696264F USD933618S US D933618 S1 USD933618 S1 US D933618S1 US 201929696264 F US201929696264 F US 201929696264F US D933618 S USD933618 S US D933618S
- Authority
- US
- United States
- Prior art keywords
- semiconductor module
- view
- semiconductor
- module
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, and the bottom view represents a shape of a three-dimensional shape.
Claims (1)
- The ornamental design for a semiconductor module, as shown and described.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2018-23985F JP1641808S (en) | 2018-10-31 | 2018-10-31 | |
JPD2018-23983F JP1640409S (en) | 2018-10-31 | 2018-10-31 | |
JPD2018-23985 | 2018-10-31 | ||
JPD2018-23983 | 2018-10-31 | ||
JPD2018-23984F JP1640626S (en) | 2018-10-31 | 2018-10-31 | |
JPD2018-23984 | 2018-10-31 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/807,156 Division USD1046799S1 (en) | 2018-10-31 | 2021-09-09 | Semiconductor module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD933618S1 true USD933618S1 (en) | 2021-10-19 |
Family
ID=78069366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/696,264 Active USD933618S1 (en) | 2018-10-31 | 2019-06-26 | Semiconductor module |
Country Status (1)
Country | Link |
---|---|
US (1) | USD933618S1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD973030S1 (en) * | 2021-02-23 | 2022-12-20 | Dong Woon Anatech Co., Ltd | Semiconductor device |
USD986840S1 (en) * | 2020-05-13 | 2023-05-23 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
USD989013S1 (en) * | 2021-06-18 | 2023-06-13 | Dong Woon Anatech Co., Ltd | Semiconductor device |
USD1046799S1 (en) * | 2018-10-31 | 2024-10-15 | Asahi Kasei Microdevices Corporation | Semiconductor module |
Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002076057A (en) | 2000-08-31 | 2002-03-15 | Hitachi Ltd | Electronic device and manufacturing method therefor |
USD523403S1 (en) * | 2004-09-09 | 2006-06-20 | Kabushiki Kaisha Toshiba | Substrate for a semiconductor device |
US20080061415A1 (en) | 2006-09-11 | 2008-03-13 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device, method for manufacturing semiconductor device, and electric equipment system |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD674760S1 (en) * | 2011-04-01 | 2013-01-22 | Fuji Electric Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD729250S1 (en) * | 2013-07-30 | 2015-05-12 | Samsung Electronics Co., Ltd. | Semiconductor memory device |
USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
USD796978S1 (en) * | 2016-03-24 | 2017-09-12 | Advantest Corporation | Socket for electronic device testing apparatus |
USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
US10510626B2 (en) * | 2015-07-06 | 2019-12-17 | Infineon Technologies Ag | Method for use in manufacturing a semiconductor device die |
US10546825B2 (en) * | 2017-05-24 | 2020-01-28 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device |
US10553559B2 (en) * | 2015-10-28 | 2020-02-04 | Mitsubishi Electric Corporation | Power semiconductor device |
US10557191B2 (en) * | 2017-01-31 | 2020-02-11 | Sakai Display Products Corporation | Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device |
US10600789B2 (en) * | 2016-12-19 | 2020-03-24 | Samsung Electronics Co., Ltd. | Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device |
US10600744B2 (en) * | 2016-11-15 | 2020-03-24 | Rohm Co., Ltd. | Semiconductor device |
US10605828B2 (en) * | 2017-03-30 | 2020-03-31 | Advanced Semiconductor Engineering, Inc. | Device for attaching a semiconductor device to a circuit board |
US10636703B2 (en) * | 2010-05-10 | 2020-04-28 | Magnachip Semiconductor, Ltd. | Semiconductor device for preventing crack in pad region and fabricating method thereof |
US10644115B2 (en) * | 2018-02-28 | 2020-05-05 | Flosfia Inc. | Layered structure and semiconductor device including layered structure |
US10651050B2 (en) * | 2017-12-01 | 2020-05-12 | Micron Technology, Inc. | Semiconductor device packages and structures |
US10672878B2 (en) * | 2018-02-08 | 2020-06-02 | Panasonic Intellectual Property Management Co., Ltd. | Silicon carbide semiconductor device |
-
2019
- 2019-06-26 US US29/696,264 patent/USD933618S1/en active Active
Patent Citations (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6492737B1 (en) | 2000-08-31 | 2002-12-10 | Hitachi, Ltd. | Electronic device and a method of manufacturing the same |
US20030102570A1 (en) | 2000-08-31 | 2003-06-05 | Hitachi, Ltd. | Electronic device and a method of manufacturing the same |
JP2002076057A (en) | 2000-08-31 | 2002-03-15 | Hitachi Ltd | Electronic device and manufacturing method therefor |
USD523403S1 (en) * | 2004-09-09 | 2006-06-20 | Kabushiki Kaisha Toshiba | Substrate for a semiconductor device |
US20080061415A1 (en) | 2006-09-11 | 2008-03-13 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device, method for manufacturing semiconductor device, and electric equipment system |
JP2008066655A (en) | 2006-09-11 | 2008-03-21 | Matsushita Electric Ind Co Ltd | Semiconductor device, manufacturing method of the semiconductor device, and electrical apparatus system |
US10636703B2 (en) * | 2010-05-10 | 2020-04-28 | Magnachip Semiconductor, Ltd. | Semiconductor device for preventing crack in pad region and fabricating method thereof |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD674760S1 (en) * | 2011-04-01 | 2013-01-22 | Fuji Electric Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
USD729250S1 (en) * | 2013-07-30 | 2015-05-12 | Samsung Electronics Co., Ltd. | Semiconductor memory device |
USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
US10510626B2 (en) * | 2015-07-06 | 2019-12-17 | Infineon Technologies Ag | Method for use in manufacturing a semiconductor device die |
US10553559B2 (en) * | 2015-10-28 | 2020-02-04 | Mitsubishi Electric Corporation | Power semiconductor device |
USD796978S1 (en) * | 2016-03-24 | 2017-09-12 | Advantest Corporation | Socket for electronic device testing apparatus |
US10600744B2 (en) * | 2016-11-15 | 2020-03-24 | Rohm Co., Ltd. | Semiconductor device |
US10600789B2 (en) * | 2016-12-19 | 2020-03-24 | Samsung Electronics Co., Ltd. | Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device |
US10557191B2 (en) * | 2017-01-31 | 2020-02-11 | Sakai Display Products Corporation | Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device |
US10605828B2 (en) * | 2017-03-30 | 2020-03-31 | Advanced Semiconductor Engineering, Inc. | Device for attaching a semiconductor device to a circuit board |
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
US10546825B2 (en) * | 2017-05-24 | 2020-01-28 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device |
USD873227S1 (en) * | 2017-10-23 | 2020-01-21 | Mitsubishi Electric Corporation | Semiconductor device |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
US10651050B2 (en) * | 2017-12-01 | 2020-05-12 | Micron Technology, Inc. | Semiconductor device packages and structures |
US10672878B2 (en) * | 2018-02-08 | 2020-06-02 | Panasonic Intellectual Property Management Co., Ltd. | Silicon carbide semiconductor device |
US10644115B2 (en) * | 2018-02-28 | 2020-05-05 | Flosfia Inc. | Layered structure and semiconductor device including layered structure |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1046799S1 (en) * | 2018-10-31 | 2024-10-15 | Asahi Kasei Microdevices Corporation | Semiconductor module |
USD986840S1 (en) * | 2020-05-13 | 2023-05-23 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
USD973030S1 (en) * | 2021-02-23 | 2022-12-20 | Dong Woon Anatech Co., Ltd | Semiconductor device |
USD989013S1 (en) * | 2021-06-18 | 2023-06-13 | Dong Woon Anatech Co., Ltd | Semiconductor device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FEPP | Fee payment procedure |
Free format text: PETITION RELATED TO MAINTENANCE FEES GRANTED (ORIGINAL EVENT CODE: PTGR); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |