USD952585S1 - Vapor chamber - Google Patents

Vapor chamber Download PDF

Info

Publication number
USD952585S1
USD952585S1 US29/728,037 US202029728037F USD952585S US D952585 S1 USD952585 S1 US D952585S1 US 202029728037 F US202029728037 F US 202029728037F US D952585 S USD952585 S US D952585S
Authority
US
United States
Prior art keywords
vapor chamber
view
vapor
chamber
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/728,037
Inventor
Tai-Chi Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DYNATRON Corp
Original Assignee
DYNATRON Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DYNATRON Corp filed Critical DYNATRON Corp
Priority to US29/728,037 priority Critical patent/USD952585S1/en
Assigned to DYNATRON CORPORATION reassignment DYNATRON CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, TAI-CHI
Application granted granted Critical
Publication of USD952585S1 publication Critical patent/USD952585S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a perspective view of the vapor chamber showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is another perspective view thereof for showing the use situation; and,
FIG. 9 is another perspective view thereof for showing the use situation.
The broken lines illustrate unclaimed features that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for the vapor chamber, as shown and described.
US29/728,037 2020-03-16 2020-03-16 Vapor chamber Active USD952585S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/728,037 USD952585S1 (en) 2020-03-16 2020-03-16 Vapor chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/728,037 USD952585S1 (en) 2020-03-16 2020-03-16 Vapor chamber

Publications (1)

Publication Number Publication Date
USD952585S1 true USD952585S1 (en) 2022-05-24

Family

ID=81655969

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/728,037 Active USD952585S1 (en) 2020-03-16 2020-03-16 Vapor chamber

Country Status (1)

Country Link
US (1) USD952585S1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160091259A1 (en) * 2014-09-26 2016-03-31 Asia Vital Components Co., Ltd. Vapor chamber structure
US20160276927A1 (en) * 2015-03-16 2016-09-22 Cree, Inc. High speed, efficient sic power module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD892754S1 (en) * 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD909979S1 (en) * 2017-11-28 2021-02-09 Tai-Sol Electronics Co., Ltd. Vapor chamber
US20210199385A1 (en) * 2019-12-27 2021-07-01 Asia Vital Components (China) Co., Ltd. Vapor chamber having sealing structure
US20220057145A1 (en) * 2020-08-20 2022-02-24 Huang-Chieh Metal Composite Material Tech. Co., Ltd. Vapor chamber

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160091259A1 (en) * 2014-09-26 2016-03-31 Asia Vital Components Co., Ltd. Vapor chamber structure
US20160276927A1 (en) * 2015-03-16 2016-09-22 Cree, Inc. High speed, efficient sic power module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD909979S1 (en) * 2017-11-28 2021-02-09 Tai-Sol Electronics Co., Ltd. Vapor chamber
USD892754S1 (en) * 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
US20210199385A1 (en) * 2019-12-27 2021-07-01 Asia Vital Components (China) Co., Ltd. Vapor chamber having sealing structure
US20220057145A1 (en) * 2020-08-20 2022-02-24 Huang-Chieh Metal Composite Material Tech. Co., Ltd. Vapor chamber

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Amazon, "Dynatron A31 AMD EPYC . . . ", First on sale Feb. 20, 2018. (https://www.amazon.com/Dynatron-A31-Heatsink-Aluminum-Exhausting/dp/B079YJ8KKV) (Year: 2018). *
Amazon, "Dynatron N8 Cooper Lake, Ice Lake LGA 4189 2U Passive CPU Cooler" First for sale Oct. 29, 2020. (https://www.amazon.com/Dynatron-Cooper-Lake-Passive-Cooler/dp/B08M6JBJTB) (Year: 2020). *

Similar Documents

Publication Publication Date Title
USD959800S1 (en) Shoe
USD928466S1 (en) Shoe
USD916681S1 (en) Headset
USD920333S1 (en) Mouse
USD950203S1 (en) Slipper
USD951135S1 (en) Planter
USD957797S1 (en) Shoe
USD948475S1 (en) Earphone
USD918458S1 (en) Chandelier
USD929585S1 (en) Endoscope
USD948474S1 (en) Earphone
USD978371S1 (en) Sterilizer
USD982882S1 (en) Footwear
USD861147S1 (en) Vaporizer
USD940495S1 (en) Bakeware
USD976360S1 (en) Filter
USD950705S1 (en) Nebulizer
USD944342S1 (en) Kettlebell
USD960956S1 (en) Dashcam
USD932589S1 (en) Filter
USD948476S1 (en) Earphone
USD932587S1 (en) Filter
USD968335S1 (en) Socket
USD936603S1 (en) Connector
USD936602S1 (en) Connector

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY