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1964-10-12 |
1967-09-05 |
Corning Glass Works |
Enclosed electronic device
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1969-07-14 |
1971-08-31 |
Pulse Eng Inc |
Delay line
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1973-02-06 |
1974-11-05 |
Amp Inc |
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1978-07-28 |
1981-06-16 |
Hitachi, Ltd. |
Semiconductor
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1978-07-28 |
1981-06-16 |
Hitachi, Ltd. |
Semiconductor
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1978-07-28 |
1981-07-07 |
Hitachi, Ltd. |
Semiconductor
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1978-08-25 |
1981-08-04 |
Hitachi, Ltd. |
Semiconductor
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1978-08-25 |
1981-09-29 |
Hitachi, Ltd. |
Semiconductor
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1978-08-25 |
1981-07-07 |
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Semiconductor
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1980-09-05 |
1983-07-05 |
Augat Inc. |
Low insertion force connector
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1981-01-15 |
1984-04-03 |
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Integrated circuit package
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1984-04-19 |
1987-03-24 |
Thomson Components-Mostek Corporation |
Zero power random access memory package
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1984-05-14 |
1985-11-27 |
Oki Electric Ind Co Ltd |
Manufacture of package for semiconductor device
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1984-09-10 |
1987-03-03 |
Motorola, Inc. |
Semiconductor housing
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1987-01-19 |
1991-06-18 |
Canon Kabushiki Kaisha |
Semiconductor element
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1987-05-27 |
1988-12-24 |
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Resin Filled Semiconductor Device
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1991-05-23 |
1992-12-15 |
At&T Bell Laboratories |
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1991-12-23 |
1995-07-18 |
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1992-09-28 |
1994-09-13 |
Sundstrand Corporation |
Power semiconductor integrated circuit package
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1992-12-03 |
1994-04-05 |
Motorola, Inc. |
Semiconductor package
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1993-09-02 |
1995-06-06 |
Sgs-Thomson Microelectronics, Inc. |
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1993-09-24 |
1995-05-30 |
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Socketed integrated circuit package
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1993-10-15 |
1996-08-07 |
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1993-12-16 |
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1996-01-23 |
Analog Devices, Inc. |
EMF shielding of an integrated circuit package
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1996-05-15 |
1997-11-28 |
Toshiba Corp |
Semiconductor device sealed by resin and method of manufacturing it
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1996-06-28 |
1998-08-25 |
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1996-09-09 |
1998-07-21 |
Fuji Electric Co., Ltd. |
Integrated circuit device
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1996-09-09 |
1998-07-21 |
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1996-09-09 |
1998-07-21 |
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Integrated circuit device
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1996-10-17 |
1998-08-11 |
Matsushita Electronics Corporation |
Semiconductor device
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1997-01-03 |
1998-08-18 |
Fujitsu Limited |
Integrated circuit package
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1997-04-16 |
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Matsushita Electronics Corporation |
Semiconductor device
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1999-09-01 |
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1999-11-20 |
2000-10-17 |
Samsung Electronics Co., Ltd. |
Semiconductor package
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2000-08-23 |
2001-06-26 |
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2001-05-23 |
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Semiconductor package
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2001-10-31 |
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Semiconductor chip package
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Semiconductor device package
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2021-10-05 |
The Noco Company |
Semiconductor device
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2021-10-26 |
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Power semiconductor package
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