USD951215S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD951215S1
USD951215S1 US29/734,432 US202029734432F USD951215S US D951215 S1 USD951215 S1 US D951215S1 US 202029734432 F US202029734432 F US 202029734432F US D951215 S USD951215 S US D951215S
Authority
US
United States
Prior art keywords
semiconductor device
view
ornamental design
semiconductor
top plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/734,432
Inventor
Takeshi Imamura
Kazuma Yoshida
Ryosuke Okawa
Toshikazu Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nuvoton Technology Corp Japan
Original Assignee
Panasonic Semiconductor Solutions Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Semiconductor Solutions Co Ltd filed Critical Panasonic Semiconductor Solutions Co Ltd
Assigned to PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD. reassignment PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IMAI, Toshikazu, OKAWA, Ryosuke, IMAMURA, TAKESHI, YOSHIDA, KAZUMA
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Publication of USD951215S1 publication Critical patent/USD951215S1/en
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Description

FIG. 1 is a front perspective view of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a semiconductor device, as shown and described.
US29/734,432 2019-12-11 2020-05-12 Semiconductor device Active USD951215S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2019-0060011 2019-12-11
KR20190060011 2019-12-11

Publications (1)

Publication Number Publication Date
USD951215S1 true USD951215S1 (en) 2022-05-10

Family

ID=81392224

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/734,432 Active USD951215S1 (en) 2019-12-11 2020-05-12 Semiconductor device

Country Status (1)

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US (1) USD951215S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1001753S1 (en) * 2019-09-09 2023-10-17 The Noco Company Circuit board

Citations (26)

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Publication number Priority date Publication date Assignee Title
US4949158A (en) * 1987-07-24 1990-08-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD318461S (en) * 1988-04-13 1991-07-23 Ibiden Co., Ltd. Semi-conductor mounting substrate
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
USD319814S (en) * 1988-04-13 1991-09-10 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
US5994772A (en) * 1996-12-19 1999-11-30 Lg Semicon Co., Ltd. Semiconductor package
USD427159S (en) * 1997-06-27 2000-06-27 Sony Corporation Semiconductor element
US6307269B1 (en) * 1997-07-11 2001-10-23 Hitachi, Ltd. Semiconductor device with chip size package
US6836002B2 (en) * 2000-03-09 2004-12-28 Sharp Kabushiki Kaisha Semiconductor device
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
US20060043544A1 (en) * 2004-08-31 2006-03-02 Sharp Kabushiki Kaisha Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
US20060097374A1 (en) * 2004-11-10 2006-05-11 Yoshimi Egawa Multi chip package
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
JP1581768S (en) 2016-08-02 2017-07-24
JP1588481S (en) 2017-04-26 2017-10-16
JP1588125S (en) 2017-04-26 2017-10-16
US20180122939A1 (en) * 2015-07-01 2018-05-03 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
JP1632597S (en) 2018-09-28 2019-05-27
JP1632160S (en) 2018-09-28 2019-05-27
JP1640664S (en) 2018-06-19 2019-09-09
JP1641049S (en) 2018-06-19 2019-09-09
JP1641048S (en) 2018-06-19 2019-09-09
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949158A (en) * 1987-07-24 1990-08-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD318461S (en) * 1988-04-13 1991-07-23 Ibiden Co., Ltd. Semi-conductor mounting substrate
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
USD319814S (en) * 1988-04-13 1991-09-10 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
US5994772A (en) * 1996-12-19 1999-11-30 Lg Semicon Co., Ltd. Semiconductor package
USD427159S (en) * 1997-06-27 2000-06-27 Sony Corporation Semiconductor element
US6307269B1 (en) * 1997-07-11 2001-10-23 Hitachi, Ltd. Semiconductor device with chip size package
US6836002B2 (en) * 2000-03-09 2004-12-28 Sharp Kabushiki Kaisha Semiconductor device
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
US20060043544A1 (en) * 2004-08-31 2006-03-02 Sharp Kabushiki Kaisha Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
US20060097374A1 (en) * 2004-11-10 2006-05-11 Yoshimi Egawa Multi chip package
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD775093S1 (en) * 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
US20180122939A1 (en) * 2015-07-01 2018-05-03 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
JP1581768S (en) 2016-08-02 2017-07-24
USD813182S1 (en) 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
JP1588481S (en) 2017-04-26 2017-10-16
JP1588125S (en) 2017-04-26 2017-10-16
JP1641049S (en) 2018-06-19 2019-09-09
JP1640664S (en) 2018-06-19 2019-09-09
JP1641048S (en) 2018-06-19 2019-09-09
JP1632160S (en) 2018-09-28 2019-05-27
JP1632597S (en) 2018-09-28 2019-05-27
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937233S1 (en) * 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1001753S1 (en) * 2019-09-09 2023-10-17 The Noco Company Circuit board

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