USD951215S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD951215S1 USD951215S1 US29/734,432 US202029734432F USD951215S US D951215 S1 USD951215 S1 US D951215S1 US 202029734432 F US202029734432 F US 202029734432F US D951215 S USD951215 S US D951215S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- ornamental design
- semiconductor
- top plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
Claims (1)
- We claim the ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR30-2019-0060011 | 2019-12-11 | ||
KR20190060011 | 2019-12-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD951215S1 true USD951215S1 (en) | 2022-05-10 |
Family
ID=81392224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/734,432 Active USD951215S1 (en) | 2019-12-11 | 2020-05-12 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (1) | USD951215S1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1001753S1 (en) * | 2019-09-09 | 2023-10-17 | The Noco Company | Circuit board |
Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4949158A (en) * | 1987-07-24 | 1990-08-14 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
USD319045S (en) * | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
USD319814S (en) * | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
US5994772A (en) * | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
USD427159S (en) * | 1997-06-27 | 2000-06-27 | Sony Corporation | Semiconductor element |
US6307269B1 (en) * | 1997-07-11 | 2001-10-23 | Hitachi, Ltd. | Semiconductor device with chip size package |
US6836002B2 (en) * | 2000-03-09 | 2004-12-28 | Sharp Kabushiki Kaisha | Semiconductor device |
US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
US20060043544A1 (en) * | 2004-08-31 | 2006-03-02 | Sharp Kabushiki Kaisha | Semiconductor device, semiconductor module, and manufacturing method of semiconductor device |
US20060097374A1 (en) * | 2004-11-10 | 2006-05-11 | Yoshimi Egawa | Multi chip package |
USD540272S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
USD598380S1 (en) * | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
USD754083S1 (en) * | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
JP1581768S (en) | 2016-08-02 | 2017-07-24 | ||
JP1588481S (en) | 2017-04-26 | 2017-10-16 | ||
JP1588125S (en) | 2017-04-26 | 2017-10-16 | ||
US20180122939A1 (en) * | 2015-07-01 | 2018-05-03 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
JP1632597S (en) | 2018-09-28 | 2019-05-27 | ||
JP1632160S (en) | 2018-09-28 | 2019-05-27 | ||
JP1640664S (en) | 2018-06-19 | 2019-09-09 | ||
JP1641049S (en) | 2018-06-19 | 2019-09-09 | ||
JP1641048S (en) | 2018-06-19 | 2019-09-09 | ||
USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
-
2020
- 2020-05-12 US US29/734,432 patent/USD951215S1/en active Active
Patent Citations (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4949158A (en) * | 1987-07-24 | 1990-08-14 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
USD319045S (en) * | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
USD319814S (en) * | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
US5994772A (en) * | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
USD427159S (en) * | 1997-06-27 | 2000-06-27 | Sony Corporation | Semiconductor element |
US6307269B1 (en) * | 1997-07-11 | 2001-10-23 | Hitachi, Ltd. | Semiconductor device with chip size package |
US6836002B2 (en) * | 2000-03-09 | 2004-12-28 | Sharp Kabushiki Kaisha | Semiconductor device |
US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
US20060043544A1 (en) * | 2004-08-31 | 2006-03-02 | Sharp Kabushiki Kaisha | Semiconductor device, semiconductor module, and manufacturing method of semiconductor device |
US20060097374A1 (en) * | 2004-11-10 | 2006-05-11 | Yoshimi Egawa | Multi chip package |
USD540272S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
USD598380S1 (en) * | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
USD754083S1 (en) * | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
USD775093S1 (en) * | 2013-10-17 | 2016-12-27 | Vlt, Inc. | Electric terminal |
US20180122939A1 (en) * | 2015-07-01 | 2018-05-03 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
JP1581768S (en) | 2016-08-02 | 2017-07-24 | ||
USD813182S1 (en) | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
JP1588481S (en) | 2017-04-26 | 2017-10-16 | ||
JP1588125S (en) | 2017-04-26 | 2017-10-16 | ||
JP1641049S (en) | 2018-06-19 | 2019-09-09 | ||
JP1640664S (en) | 2018-06-19 | 2019-09-09 | ||
JP1641048S (en) | 2018-06-19 | 2019-09-09 | ||
JP1632160S (en) | 2018-09-28 | 2019-05-27 | ||
JP1632597S (en) | 2018-09-28 | 2019-05-27 | ||
USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD937233S1 (en) * | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1001753S1 (en) * | 2019-09-09 | 2023-10-17 | The Noco Company | Circuit board |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |