USD472530S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD472530S1
USD472530S1 US29/156,527 US15652702F USD472530S US D472530 S1 USD472530 S1 US D472530S1 US 15652702 F US15652702 F US 15652702F US D472530 S USD472530 S US D472530S
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US
United States
Prior art keywords
semiconductor device
view
elevational view
ornamental design
side perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/156,527
Inventor
Mitsutaka Iwasaki
Toru Iwagami
Hisashi Kawafuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IWASAKI, MITSUTAKA, IWAGAMI, TORU, KAWAFUJI, HISASHI
Application granted granted Critical
Publication of USD472530S1 publication Critical patent/USD472530S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a left side elevational view thereof;
FIG. 8 is a right side elevational view thereof; and,
FIG. 9 is a cross-sectional view thereof, taken along line 9—9 of FIG. 3, with the internal system omitted.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/156,527 2001-11-30 2002-03-04 Semiconductor device Expired - Lifetime USD472530S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-035252 2001-11-30
JP2001035252 2001-11-30

Publications (1)

Publication Number Publication Date
USD472530S1 true USD472530S1 (en) 2003-04-01

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Family Applications (1)

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US29/156,527 Expired - Lifetime USD472530S1 (en) 2001-11-30 2002-03-04 Semiconductor device

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090233466A1 (en) * 2008-03-11 2009-09-17 Delta Electronics, Inc. Surface-mounted circuit board module and process for fabricating the same
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD1012049S1 (en) * 2021-03-19 2024-01-23 Rohm Co., Ltd. Semiconductor module
USD1012048S1 (en) * 2021-03-19 2024-01-23 Rohm Co., Ltd. Semiconductor module
USD1013648S1 (en) * 2021-03-19 2024-02-06 Rohm Co., Ltd. Semiconductor module
USD1013647S1 (en) * 2021-03-19 2024-02-06 Rohm Co., Ltd. Semiconductor module
USD1015283S1 (en) * 2021-03-19 2024-02-20 Rohm Co., Ltd. Semiconductor module
USD1015284S1 (en) * 2021-03-19 2024-02-20 Rohm Co., Ltd. Semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090233466A1 (en) * 2008-03-11 2009-09-17 Delta Electronics, Inc. Surface-mounted circuit board module and process for fabricating the same
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD1012049S1 (en) * 2021-03-19 2024-01-23 Rohm Co., Ltd. Semiconductor module
USD1012048S1 (en) * 2021-03-19 2024-01-23 Rohm Co., Ltd. Semiconductor module
USD1013648S1 (en) * 2021-03-19 2024-02-06 Rohm Co., Ltd. Semiconductor module
USD1013647S1 (en) * 2021-03-19 2024-02-06 Rohm Co., Ltd. Semiconductor module
USD1015283S1 (en) * 2021-03-19 2024-02-20 Rohm Co., Ltd. Semiconductor module
USD1015284S1 (en) * 2021-03-19 2024-02-20 Rohm Co., Ltd. Semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module

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