USD470825S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD470825S1
USD470825S1 US29/159,531 US15953102F USD470825S US D470825 S1 USD470825 S1 US D470825S1 US 15953102 F US15953102 F US 15953102F US D470825 S USD470825 S US D470825S
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US
United States
Prior art keywords
semiconductor device
view
elevational view
sectional
taken along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/159,531
Inventor
Mitsutaka Iwasaki
Toru Iwagami
Hisashi Kawafuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IWASAKI, MITSUTAKA, IWAGAMI, TORU, KAWAFUJI, HISASHI
Application granted granted Critical
Publication of USD470825S1 publication Critical patent/USD470825S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front, bottom and right side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a left side elevational view thereof;
FIG. 9 is a cross-sectional view thereof, taken along line 9—9 of FIG. 5, with the internal system omitted;
FIG. 10 is a cross-sectional view thereof, taken along line 10—10 of FIG. 5, with the internal system omitted;
FIG. 11 is a front, top and right side perspective view of a second embodiment of the semiconductor device, showing our new design;
FIG. 12 is a front, bottom and right side perspective view thereof;
FIG. 13 is a front elevational view thereof;
FIG. 14 is a rear elevational view thereof;
FIG. 15 is a top plan view thereof;
FIG. 16 is a bottom plan view thereof;
FIG. 17 is a right side elevational view thereof;
FIG. 18 is a left side elevational view thereof;
FIG. 19 is a cross-sectional view thereof, taken along line 19—19 of FIG. 15, with the internal system omitted; and,
FIG. 20 is a cross-sectional view thereof, taken along line 20—20 of FIG. 15, with the internal system omitted.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/159,531 2001-12-28 2002-04-24 Semiconductor device Expired - Lifetime USD470825S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001-038795 2001-12-28
JP2001038795 2001-12-28
JP2001-038794 2001-12-28
JP2001038794 2001-12-28

Publications (1)

Publication Number Publication Date
USD470825S1 true USD470825S1 (en) 2003-02-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/159,531 Expired - Lifetime USD470825S1 (en) 2001-12-28 2002-04-24 Semiconductor device

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US (1) USD470825S1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1017533S1 (en) * 2022-01-28 2024-03-12 Mitsubishi Electric Corporation Semiconductor device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD978809S1 (en) 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1017533S1 (en) * 2022-01-28 2024-03-12 Mitsubishi Electric Corporation Semiconductor device

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