USD470825S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD470825S1 USD470825S1 US29/159,531 US15953102F USD470825S US D470825 S1 USD470825 S1 US D470825S1 US 15953102 F US15953102 F US 15953102F US D470825 S USD470825 S US D470825S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- sectional
- taken along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front, bottom and right side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a left side elevational view thereof;
FIG. 9 is a cross-sectional view thereof, taken along line 9—9 of FIG. 5, with the internal system omitted;
FIG. 10 is a cross-sectional view thereof, taken along line 10—10 of FIG. 5, with the internal system omitted;
FIG. 11 is a front, top and right side perspective view of a second embodiment of the semiconductor device, showing our new design;
FIG. 12 is a front, bottom and right side perspective view thereof;
FIG. 13 is a front elevational view thereof;
FIG. 14 is a rear elevational view thereof;
FIG. 15 is a top plan view thereof;
FIG. 16 is a bottom plan view thereof;
FIG. 17 is a right side elevational view thereof;
FIG. 18 is a left side elevational view thereof;
FIG. 19 is a cross-sectional view thereof, taken along line 19—19 of FIG. 15, with the internal system omitted; and,
FIG. 20 is a cross-sectional view thereof, taken along line 20—20 of FIG. 15, with the internal system omitted.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-038795 | 2001-12-28 | ||
JP2001038795 | 2001-12-28 | ||
JP2001-038794 | 2001-12-28 | ||
JP2001038794 | 2001-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD470825S1 true USD470825S1 (en) | 2003-02-25 |
Family
ID=26609470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/159,531 Expired - Lifetime USD470825S1 (en) | 2001-12-28 | 2002-04-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (1) | USD470825S1 (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
USD769834S1 (en) | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
USD913978S1 (en) * | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
USD1017533S1 (en) * | 2022-01-28 | 2024-03-12 | Mitsubishi Electric Corporation | Semiconductor device |
-
2002
- 2002-04-24 US US29/159,531 patent/USD470825S1/en not_active Expired - Lifetime
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
USD769834S1 (en) | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
USD978809S1 (en) | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
USD913978S1 (en) * | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
USD1017533S1 (en) * | 2022-01-28 | 2024-03-12 | Mitsubishi Electric Corporation | Semiconductor device |
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