USD877102S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD877102S1 USD877102S1 US29/642,232 US201829642232F USD877102S US D877102 S1 USD877102 S1 US D877102S1 US 201829642232 F US201829642232 F US 201829642232F US D877102 S USD877102 S US D877102S
- Authority
- US
- United States
- Prior art keywords
- semiconductor module
- view
- semiconductor
- module
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines in the Figures are for environmental purposes only and form no part of the claimed design.
Claims (1)
- The ornamental design for a semiconductor module, as shown and described.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017029499F JP1646328S (en) | 2017-12-28 | 2017-12-28 | |
JP2017-29500 | 2017-12-28 | ||
JP2017-29499 | 2017-12-28 | ||
JPD2017-29500F JP1617051S (en) | 2017-12-28 | 2017-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD877102S1 true USD877102S1 (en) | 2020-03-03 |
Family
ID=69629239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/642,232 Active USD877102S1 (en) | 2017-12-28 | 2018-03-28 | Semiconductor module |
Country Status (1)
Country | Link |
---|---|
US (1) | USD877102S1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD903613S1 (en) * | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
USD936025S1 (en) * | 2018-12-26 | 2021-11-16 | Lg Chem, Ltd. | Flexible printed circuit board for battery module |
USD937791S1 (en) * | 2018-12-26 | 2021-12-07 | Lg Chem, Ltd. | Flexible printed circuit board for battery module |
USD954666S1 (en) * | 2019-05-03 | 2022-06-14 | Lumileds Holding B.V. | Flexible circuit board |
USD962182S1 (en) * | 2019-03-27 | 2022-08-30 | Gudeng Precision Industrial Co., Ltd. | Reticle pod connecting frame |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
Citations (45)
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US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US3825876A (en) * | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
US4391408A (en) * | 1980-09-05 | 1983-07-05 | Augat Inc. | Low insertion force connector |
USD288922S (en) * | 1984-04-19 | 1987-03-24 | Thomson Components-Mostek Corporation | Zero power random access memory package |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
USD357462S (en) * | 1993-09-16 | 1995-04-18 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
US5410450A (en) * | 1991-12-10 | 1995-04-25 | Fuji Electric Co., Ltd. | Internal wiring structure of a semiconductor device |
USD357671S (en) * | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD401912S (en) * | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD448739S1 (en) * | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
USD470825S1 (en) * | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
US20100149774A1 (en) * | 2008-12-17 | 2010-06-17 | Mitsubishi Electric Corporation | Semiconductor device |
US20110044012A1 (en) * | 2006-12-15 | 2011-02-24 | Mitsubishi Electric Corporation | Semiconductor device |
US8107255B2 (en) * | 2007-09-27 | 2012-01-31 | Sanyo Semiconductor Co., Ltd. | Circuit device and method of manufacturing the same |
USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD705184S1 (en) * | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD712853S1 (en) * | 2012-12-21 | 2014-09-09 | Fuji Electric Co., Ltd. | Semiconductor module |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD721048S1 (en) * | 2013-06-17 | 2015-01-13 | Fuji Electric Co., Ltd. | Semiconductor module |
USD721340S1 (en) * | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD766851S1 (en) * | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
USD767516S1 (en) * | 2015-02-04 | 2016-09-27 | Mitsubishi Electric Corporation | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
JP1565636S (en) | 2016-03-11 | 2016-12-19 | ||
USD810036S1 (en) * | 2016-11-08 | 2018-02-13 | Fuji Electric Co., Ltd. | Semiconductor module |
-
2018
- 2018-03-28 US US29/642,232 patent/USD877102S1/en active Active
Patent Citations (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3825876A (en) * | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US4391408A (en) * | 1980-09-05 | 1983-07-05 | Augat Inc. | Low insertion force connector |
USD288922S (en) * | 1984-04-19 | 1987-03-24 | Thomson Components-Mostek Corporation | Zero power random access memory package |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US5410450A (en) * | 1991-12-10 | 1995-04-25 | Fuji Electric Co., Ltd. | Internal wiring structure of a semiconductor device |
USD357462S (en) * | 1993-09-16 | 1995-04-18 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD357671S (en) * | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD401912S (en) * | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD448739S1 (en) * | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD470825S1 (en) * | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
US20110044012A1 (en) * | 2006-12-15 | 2011-02-24 | Mitsubishi Electric Corporation | Semiconductor device |
US8107255B2 (en) * | 2007-09-27 | 2012-01-31 | Sanyo Semiconductor Co., Ltd. | Circuit device and method of manufacturing the same |
US20100149774A1 (en) * | 2008-12-17 | 2010-06-17 | Mitsubishi Electric Corporation | Semiconductor device |
USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD721340S1 (en) * | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD712853S1 (en) * | 2012-12-21 | 2014-09-09 | Fuji Electric Co., Ltd. | Semiconductor module |
USD721048S1 (en) * | 2013-06-17 | 2015-01-13 | Fuji Electric Co., Ltd. | Semiconductor module |
USD705184S1 (en) * | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
USD766851S1 (en) * | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
USD767516S1 (en) * | 2015-02-04 | 2016-09-27 | Mitsubishi Electric Corporation | Semiconductor device |
USD773413S1 (en) * | 2015-02-04 | 2016-12-06 | Mitsubishi Electric Corporation | Semiconductor device |
USD773412S1 (en) * | 2015-02-04 | 2016-12-06 | Mitsubishi Electric Corporation | Semiconductor device |
JP1565636S (en) | 2016-03-11 | 2016-12-19 | ||
USD810036S1 (en) * | 2016-11-08 | 2018-02-13 | Fuji Electric Co., Ltd. | Semiconductor module |
Non-Patent Citations (1)
Title |
---|
Office action from Japanese Patent Design Application No. JP2017-029499 dated Sep. 14, 2018, and its English translation. |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD903613S1 (en) * | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
USD936025S1 (en) * | 2018-12-26 | 2021-11-16 | Lg Chem, Ltd. | Flexible printed circuit board for battery module |
USD937791S1 (en) * | 2018-12-26 | 2021-12-07 | Lg Chem, Ltd. | Flexible printed circuit board for battery module |
USD962182S1 (en) * | 2019-03-27 | 2022-08-30 | Gudeng Precision Industrial Co., Ltd. | Reticle pod connecting frame |
USD954666S1 (en) * | 2019-05-03 | 2022-06-14 | Lumileds Holding B.V. | Flexible circuit board |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
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Legal Events
Date | Code | Title | Description |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |