USD877102S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

Info

Publication number
USD877102S1
USD877102S1 US29/642,232 US201829642232F USD877102S US D877102 S1 USD877102 S1 US D877102S1 US 201829642232 F US201829642232 F US 201829642232F US D877102 S USD877102 S US D877102S
Authority
US
United States
Prior art keywords
semiconductor module
view
semiconductor
module
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/642,232
Inventor
Yoshihiro KAMIYAMA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2017-29500F external-priority patent/JP1617051S/ja
Priority claimed from JP2017029499F external-priority patent/JP1646328S/ja
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Assigned to SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. reassignment SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS). Assignors: KAMIYAMA, YOSHIHIRO
Application granted granted Critical
Publication of USD877102S1 publication Critical patent/USD877102S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of a semiconductor module, showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a underside plan view thereof.
The broken lines in the Figures are for environmental purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module, as shown and described.
US29/642,232 2017-12-28 2018-03-28 Semiconductor module Active USD877102S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-29499 2017-12-28
JPD2017-29500F JP1617051S (en) 2017-12-28 2017-12-28
JP2017029499F JP1646328S (en) 2017-12-28 2017-12-28
JP2017-29500 2017-12-28

Publications (1)

Publication Number Publication Date
USD877102S1 true USD877102S1 (en) 2020-03-03

Family

ID=69629239

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/642,232 Active USD877102S1 (en) 2017-12-28 2018-03-28 Semiconductor module

Country Status (1)

Country Link
US (1) USD877102S1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD903613S1 (en) * 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD936025S1 (en) * 2018-12-26 2021-11-16 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD937791S1 (en) * 2018-12-26 2021-12-07 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD954666S1 (en) * 2019-05-03 2022-06-14 Lumileds Holding B.V. Flexible circuit board
USD962182S1 (en) * 2019-03-27 2022-08-30 Gudeng Precision Industrial Co., Ltd. Reticle pod connecting frame
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module

Citations (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
USD288922S (en) * 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
USD357462S (en) * 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US5410450A (en) * 1991-12-10 1995-04-25 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
US5646443A (en) * 1993-10-15 1997-07-08 Nec Corporation Semiconductor package
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
US8107255B2 (en) * 2007-09-27 2012-01-31 Sanyo Semiconductor Co., Ltd. Circuit device and method of manufacturing the same
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD712853S1 (en) * 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
JP1565636S (en) 2016-03-11 2016-12-19
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module

Patent Citations (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
USD288922S (en) * 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5410450A (en) * 1991-12-10 1995-04-25 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
USD357462S (en) * 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US5646443A (en) * 1993-10-15 1997-07-08 Nec Corporation Semiconductor package
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
US8107255B2 (en) * 2007-09-27 2012-01-31 Sanyo Semiconductor Co., Ltd. Circuit device and method of manufacturing the same
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD712853S1 (en) * 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD773412S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD773413S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
JP1565636S (en) 2016-03-11 2016-12-19
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Office action from Japanese Patent Design Application No. JP2017-029499 dated Sep. 14, 2018, and its English translation.

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD903613S1 (en) * 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD936025S1 (en) * 2018-12-26 2021-11-16 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD937791S1 (en) * 2018-12-26 2021-12-07 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD962182S1 (en) * 2019-03-27 2022-08-30 Gudeng Precision Industrial Co., Ltd. Reticle pod connecting frame
USD954666S1 (en) * 2019-05-03 2022-06-14 Lumileds Holding B.V. Flexible circuit board
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module

Similar Documents

Publication Publication Date Title
USD969639S1 (en) Tracking device
USD819469S1 (en) Tracking device
USD817198S1 (en) Tracking device
USD877102S1 (en) Semiconductor module
USD843887S1 (en) D-ring
USD848122S1 (en) Shoe
USD858467S1 (en) Power semiconductor module
USD823994S1 (en) Sink
USD879627S1 (en) Tracking device
USD835713S1 (en) Shredder
USD969635S1 (en) Tracking device
USD880320S1 (en) Tracking device
USD810036S1 (en) Semiconductor module
USD854160S1 (en) Lateral flow reader
USD820638S1 (en) Beverage filter
USD953254S1 (en) Battery module
USD859803S1 (en) Insole
USD792405S1 (en) Reader module
USD884452S1 (en) Multi-tool
USD884453S1 (en) Multi-tool
USD787223S1 (en) Multifunctional table board
USD841573S1 (en) Power module
USD826385S1 (en) Sink
USD871041S1 (en) Insole
USD850836S1 (en) Footrail

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY