USD459317S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD459317S1 USD459317S1 US29/144,821 US14482101F USD459317S US D459317 S1 USD459317 S1 US D459317S1 US 14482101 F US14482101 F US 14482101F US D459317 S USD459317 S US D459317S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- side elevational
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front, bottom and right side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view thereof; the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view thereof, taken along line 8—8 of FIG. 5, with the internal system omitted.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-003333 | 2001-02-15 | ||
JP2001003333 | 2001-02-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD459317S1 true USD459317S1 (en) | 2002-06-25 |
Family
ID=18871688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/144,821 Expired - Lifetime USD459317S1 (en) | 2001-02-15 | 2001-07-12 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (1) | USD459317S1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6686654B2 (en) * | 2001-08-31 | 2004-02-03 | Micron Technology, Inc. | Multiple chip stack structure and cooling system |
US6975027B2 (en) | 2001-08-30 | 2005-12-13 | Micron Technology, Inc. | Multi-chip electronic package and cooling system |
US7465608B1 (en) | 2001-08-17 | 2008-12-16 | Micron Technology, Inc. | Three-dimensional multichip module |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
-
2001
- 2001-07-12 US US29/144,821 patent/USD459317S1/en not_active Expired - Lifetime
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7465608B1 (en) | 2001-08-17 | 2008-12-16 | Micron Technology, Inc. | Three-dimensional multichip module |
US6975027B2 (en) | 2001-08-30 | 2005-12-13 | Micron Technology, Inc. | Multi-chip electronic package and cooling system |
US20060103015A1 (en) * | 2001-08-30 | 2006-05-18 | Farrar Paul A | Multi-chip electronic package and cooling system |
US7626252B2 (en) | 2001-08-30 | 2009-12-01 | Micron Technology, Inc. | Multi-chip electronic package and cooling system |
US6686654B2 (en) * | 2001-08-31 | 2004-02-03 | Micron Technology, Inc. | Multiple chip stack structure and cooling system |
US20040063248A1 (en) * | 2001-08-31 | 2004-04-01 | Farrar Paul A. | Multiple chip stack structure and cooling system |
US6861287B2 (en) | 2001-08-31 | 2005-03-01 | Micron Technology, Inc. | Multiple chip stack structure and cooling system |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
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