USD459317S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD459317S1
USD459317S1 US29/144,821 US14482101F USD459317S US D459317 S1 USD459317 S1 US D459317S1 US 14482101 F US14482101 F US 14482101F US D459317 S USD459317 S US D459317S
Authority
US
United States
Prior art keywords
semiconductor device
view
elevational view
side elevational
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/144,821
Inventor
Takakazu Fukumoto
Muneharu Tokunaga
Tetsuya Matsuura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUKUMOTO, TAKAKAZU, MATSUURA, TETSUYA, TOKUNAGA, MUNEHARU
Application granted granted Critical
Publication of USD459317S1 publication Critical patent/USD459317S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front, bottom and right side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view thereof; the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view thereof, taken along line 8—8 of FIG. 5, with the internal system omitted.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/144,821 2001-02-15 2001-07-12 Semiconductor device Expired - Lifetime USD459317S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-003333 2001-02-15
JP2001003333 2001-02-15

Publications (1)

Publication Number Publication Date
USD459317S1 true USD459317S1 (en) 2002-06-25

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ID=18871688

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/144,821 Expired - Lifetime USD459317S1 (en) 2001-02-15 2001-07-12 Semiconductor device

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US (1) USD459317S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6686654B2 (en) * 2001-08-31 2004-02-03 Micron Technology, Inc. Multiple chip stack structure and cooling system
US6975027B2 (en) 2001-08-30 2005-12-13 Micron Technology, Inc. Multi-chip electronic package and cooling system
US7465608B1 (en) 2001-08-17 2008-12-16 Micron Technology, Inc. Three-dimensional multichip module
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7465608B1 (en) 2001-08-17 2008-12-16 Micron Technology, Inc. Three-dimensional multichip module
US6975027B2 (en) 2001-08-30 2005-12-13 Micron Technology, Inc. Multi-chip electronic package and cooling system
US20060103015A1 (en) * 2001-08-30 2006-05-18 Farrar Paul A Multi-chip electronic package and cooling system
US7626252B2 (en) 2001-08-30 2009-12-01 Micron Technology, Inc. Multi-chip electronic package and cooling system
US6686654B2 (en) * 2001-08-31 2004-02-03 Micron Technology, Inc. Multiple chip stack structure and cooling system
US20040063248A1 (en) * 2001-08-31 2004-04-01 Farrar Paul A. Multiple chip stack structure and cooling system
US6861287B2 (en) 2001-08-31 2005-03-01 Micron Technology, Inc. Multiple chip stack structure and cooling system
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module

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