USD460744S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD460744S1
USD460744S1 US29/144,678 US14467801F USD460744S US D460744 S1 USD460744 S1 US D460744S1 US 14467801 F US14467801 F US 14467801F US D460744 S USD460744 S US D460744S
Authority
US
United States
Prior art keywords
semiconductor device
view
elevational view
side elevational
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/144,678
Inventor
Takakazu Fukumoto
Muneharu Tokunaga
Tetsuya Matsuura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHI reassignment MITSUBISHI DENKI KABUSHIKI KAISHI ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUKUMOTO, TAKAKAZU, MATSUURA, TETSUYA, TOKUNAGA, MUNEHARU
Application granted granted Critical
Publication of USD460744S1 publication Critical patent/USD460744S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front, bottom and right side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view thereof; the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view thereof, taken along line 8—8 of FIG. 5, with the internal system omitted.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/144,678 2001-02-15 2001-07-10 Semiconductor device Expired - Lifetime USD460744S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001003332 2001-02-15
JP2001-003332 2001-02-15

Publications (1)

Publication Number Publication Date
USD460744S1 true USD460744S1 (en) 2002-07-23

Family

ID=18871686

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/144,678 Expired - Lifetime USD460744S1 (en) 2001-02-15 2001-07-10 Semiconductor device

Country Status (1)

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US (1) USD460744S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module

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