USD1015283S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD1015283S1 USD1015283S1 US29/807,875 US202129807875F USD1015283S US D1015283 S1 USD1015283 S1 US D1015283S1 US 202129807875 F US202129807875 F US 202129807875F US D1015283 S USD1015283 S US D1015283S
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- US
- United States
- Prior art keywords
- semiconductor module
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims description 3
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Description
Claims (1)
- The ornamental design for a semiconductor module, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2021-5675F JP1695848S (en) | 2021-03-19 | 2021-03-19 | |
JP2021-005675D | 2021-03-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1015283S1 true USD1015283S1 (en) | 2024-02-20 |
Family
ID=77847396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/807,875 Active USD1015283S1 (en) | 2021-03-19 | 2021-09-15 | Semiconductor module |
Country Status (2)
Country | Link |
---|---|
US (1) | USD1015283S1 (en) |
JP (1) | JP1695848S (en) |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD470463S1 (en) * | 2001-11-30 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD472530S1 (en) * | 2001-11-30 | 2003-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US20160104654A1 (en) * | 2013-09-10 | 2016-04-14 | Mitsubishi Electric Corporation | Semiconductor device and semiconductor module |
JP1615885S (en) | 2018-04-13 | 2018-10-15 | ||
JP1615883S (en) | 2018-04-13 | 2018-10-15 | ||
JP1615980S (en) | 2018-04-13 | 2018-10-15 | ||
JP1615981S (en) | 2018-04-13 | 2018-10-15 | ||
US20190304946A1 (en) * | 2016-12-16 | 2019-10-03 | Abb Schweiz Ag | Power semiconductor module with low gate path inductance |
USD873226S1 (en) | 2018-04-13 | 2020-01-21 | Rohm Co., Ltd. | Semiconductor module |
USD874411S1 (en) | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
US20220319975A1 (en) * | 2019-07-02 | 2022-10-06 | Rohm Co., Ltd. | Semiconductor device |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
US20230037158A1 (en) * | 2020-01-16 | 2023-02-02 | Sumitomo Electric Industries, Ltd. | Semiconductor module |
-
2021
- 2021-03-19 JP JPD2021-5675F patent/JP1695848S/ja active Active
- 2021-09-15 US US29/807,875 patent/USD1015283S1/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD470463S1 (en) * | 2001-11-30 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD472530S1 (en) * | 2001-11-30 | 2003-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD874411S1 (en) | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
US20160104654A1 (en) * | 2013-09-10 | 2016-04-14 | Mitsubishi Electric Corporation | Semiconductor device and semiconductor module |
US20190304946A1 (en) * | 2016-12-16 | 2019-10-03 | Abb Schweiz Ag | Power semiconductor module with low gate path inductance |
JP1615980S (en) | 2018-04-13 | 2018-10-15 | ||
JP1615981S (en) | 2018-04-13 | 2018-10-15 | ||
JP1615883S (en) | 2018-04-13 | 2018-10-15 | ||
USD873226S1 (en) | 2018-04-13 | 2020-01-21 | Rohm Co., Ltd. | Semiconductor module |
JP1615885S (en) | 2018-04-13 | 2018-10-15 | ||
US20220319975A1 (en) * | 2019-07-02 | 2022-10-06 | Rohm Co., Ltd. | Semiconductor device |
US20230037158A1 (en) * | 2020-01-16 | 2023-02-02 | Sumitomo Electric Industries, Ltd. | Semiconductor module |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
Non-Patent Citations (7)
Title |
---|
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,874, dated Mar. 6, 2023, 10 pages. |
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,876, dated Mar. 13, 2023, 10 pages. |
Ex parte Quayle Action issued for U.S. Appl. No. 29/808,052, dated Mar. 31, 2023, 11 pages. |
Ex parte Quayle Action issued for U.S. Appl. No. 29/808,053, dated Mar. 8, 2023, 11 pages. |
Ex parte Quayle Action issued for U.S. Appl. No. 29/808,055, dated Mar. 8, 2023, 11 pages. |
Notification to Make Rectification issued for Chinese Patent Application No. 202130619661.3, dated Jul. 24, 2023, 3 pages including English machine translation. |
Notification to Make Rectification issued for Chinese Patent Application No. 202130619752.7, dated Jul. 24, 2023, 3 pages including English machine translation. |
Also Published As
Publication number | Publication date |
---|---|
JP1695848S (en) | 2021-09-27 |
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Legal Events
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