USD1015283S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD1015283S1
USD1015283S1 US29/807,875 US202129807875F USD1015283S US D1015283 S1 USD1015283 S1 US D1015283S1 US 202129807875 F US202129807875 F US 202129807875F US D1015283 S USD1015283 S US D1015283S
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US
United States
Prior art keywords
semiconductor module
view
sectional
cross
taken along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/807,875
Inventor
Yoshihisa Tsukamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TSUKAMOTO, YOSHIHISA
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FIG. 1 is a front, top and right side perspective view of a semiconductor module showing my new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front view thereof, the rear view being a mirror image of FIG. 3 ;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a left side view thereof;
FIG. 8 is a cross-sectional view taken along line 8-8 in FIG, 5 thereof;
FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 5 thereof;
FIG. 10 is a cross-sectional view taken along line 10-10 in FIG. 5 thereof; and,
FIG. 11 is a cross-sectional view taken along line 11-11 in FIG. 5 thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module, as shown and described.
US29/807,875 2021-03-19 2021-09-15 Semiconductor module Active USD1015283S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2021-5675F JP1695848S (en) 2021-03-19 2021-03-19
JP2021-005675D 2021-03-19

Publications (1)

Publication Number Publication Date
USD1015283S1 true USD1015283S1 (en) 2024-02-20

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Application Number Title Priority Date Filing Date
US29/807,875 Active USD1015283S1 (en) 2021-03-19 2021-09-15 Semiconductor module

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US (1) USD1015283S1 (en)
JP (1) JP1695848S (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US20160104654A1 (en) * 2013-09-10 2016-04-14 Mitsubishi Electric Corporation Semiconductor device and semiconductor module
JP1615885S (en) 2018-04-13 2018-10-15
JP1615883S (en) 2018-04-13 2018-10-15
JP1615980S (en) 2018-04-13 2018-10-15
JP1615981S (en) 2018-04-13 2018-10-15
US20190304946A1 (en) * 2016-12-16 2019-10-03 Abb Schweiz Ag Power semiconductor module with low gate path inductance
USD873226S1 (en) 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874411S1 (en) 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
US20220319975A1 (en) * 2019-07-02 2022-10-06 Rohm Co., Ltd. Semiconductor device
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
US20230037158A1 (en) * 2020-01-16 2023-02-02 Sumitomo Electric Industries, Ltd. Semiconductor module

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD874411S1 (en) 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
US20160104654A1 (en) * 2013-09-10 2016-04-14 Mitsubishi Electric Corporation Semiconductor device and semiconductor module
US20190304946A1 (en) * 2016-12-16 2019-10-03 Abb Schweiz Ag Power semiconductor module with low gate path inductance
JP1615980S (en) 2018-04-13 2018-10-15
JP1615981S (en) 2018-04-13 2018-10-15
JP1615883S (en) 2018-04-13 2018-10-15
USD873226S1 (en) 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
JP1615885S (en) 2018-04-13 2018-10-15
US20220319975A1 (en) * 2019-07-02 2022-10-06 Rohm Co., Ltd. Semiconductor device
US20230037158A1 (en) * 2020-01-16 2023-02-02 Sumitomo Electric Industries, Ltd. Semiconductor module
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,874, dated Mar. 6, 2023, 10 pages.
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,876, dated Mar. 13, 2023, 10 pages.
Ex parte Quayle Action issued for U.S. Appl. No. 29/808,052, dated Mar. 31, 2023, 11 pages.
Ex parte Quayle Action issued for U.S. Appl. No. 29/808,053, dated Mar. 8, 2023, 11 pages.
Ex parte Quayle Action issued for U.S. Appl. No. 29/808,055, dated Mar. 8, 2023, 11 pages.
Notification to Make Rectification issued for Chinese Patent Application No. 202130619661.3, dated Jul. 24, 2023, 3 pages including English machine translation.
Notification to Make Rectification issued for Chinese Patent Application No. 202130619752.7, dated Jul. 24, 2023, 3 pages including English machine translation.

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