USD1021831S1 - Power semiconductor module - Google Patents

Power semiconductor module Download PDF

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Publication number
USD1021831S1
USD1021831S1 US29/808,480 US202129808480F USD1021831S US D1021831 S1 USD1021831 S1 US D1021831S1 US 202129808480 F US202129808480 F US 202129808480F US D1021831 S USD1021831 S US D1021831S
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US
United States
Prior art keywords
power semiconductor
semiconductor module
view
module
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/808,480
Inventor
Yuki Nakano
Kenji Yamamoto
Yasunori Kutsuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021005998F external-priority patent/JP1696403S/en
Priority claimed from JP2021005999F external-priority patent/JP1696313S/en
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KUTSUMA, Yasunori, NAKANO, YUKI, YAMAMOTO, KENJI
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Publication of USD1021831S1 publication Critical patent/USD1021831S1/en
Active legal-status Critical Current
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Description

FIG. 1 is a front, top and right side perspective view of a first embodiment of a power semiconductor module showing our new design;
FIG. 2 is a front view thereof, the rear view being an identical image of FIG. 2 ;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof; and,
FIG. 5 is a right side view thereof, the left side view being an identical image of FIG. 5 .

Claims (1)

    CLAIM
  1. The ornamental design for a power semiconductor module, as shown and described.
US29/808,480 2021-03-23 2021-09-20 Power semiconductor module Active USD1021831S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021005998F JP1696403S (en) 2021-03-23 2021-03-23 Power semiconductor device
JP2021-005999D 2021-03-23
JP2021-005998D 2021-03-23
JP2021005999F JP1696313S (en) 2021-03-23 2021-03-23 Power semiconductor device

Publications (1)

Publication Number Publication Date
USD1021831S1 true USD1021831S1 (en) 2024-04-09

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ID=90566750

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/808,480 Active USD1021831S1 (en) 2021-03-23 2021-09-20 Power semiconductor module

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US (1) USD1021831S1 (en)

Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3352726A (en) * 1964-04-13 1967-11-14 Philco Ford Corp Method of fabricating planar semiconductor devices
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US20080197471A1 (en) * 2007-02-16 2008-08-21 Matsushita Electric Industrial Co., Ltd. Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
USD664506S1 (en) * 2011-02-04 2012-07-31 Panasonic Corporation Electroluminescence module
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
US20160104654A1 (en) * 2013-09-10 2016-04-14 Mitsubishi Electric Corporation Semiconductor device and semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
US10262928B2 (en) * 2017-03-23 2019-04-16 Rohm Co., Ltd. Semiconductor device
US20190115465A1 (en) * 2017-10-12 2019-04-18 Hitachi, Ltd. Silicon carbide semiconductor device, power module, and power conversion device
US20190304946A1 (en) * 2016-12-16 2019-10-03 Abb Schweiz Ag Power semiconductor module with low gate path inductance
JP1664282S (en) 2019-07-24 2020-07-27
US20210296226A1 (en) * 2017-03-08 2021-09-23 Mitsubishi Electric Corporation Semiconductor device, method for manufacturing the same, and semiconductor module
US20220319975A1 (en) * 2019-07-02 2022-10-06 Rohm Co., Ltd. Semiconductor device
US11522058B2 (en) * 2020-09-11 2022-12-06 Kabushiki Kaisha Toshiba Semiconductor device with field plate electrode
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
US11538936B2 (en) * 2020-03-04 2022-12-27 Rohm Co., Ltd. Semiconductor device
US20230037158A1 (en) * 2020-01-16 2023-02-02 Sumitomo Electric Industries, Ltd. Semiconductor module

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3352726A (en) * 1964-04-13 1967-11-14 Philco Ford Corp Method of fabricating planar semiconductor devices
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US20080197471A1 (en) * 2007-02-16 2008-08-21 Matsushita Electric Industrial Co., Ltd. Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
USD664506S1 (en) * 2011-02-04 2012-07-31 Panasonic Corporation Electroluminescence module
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
US20160104654A1 (en) * 2013-09-10 2016-04-14 Mitsubishi Electric Corporation Semiconductor device and semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
US20190304946A1 (en) * 2016-12-16 2019-10-03 Abb Schweiz Ag Power semiconductor module with low gate path inductance
US20210296226A1 (en) * 2017-03-08 2021-09-23 Mitsubishi Electric Corporation Semiconductor device, method for manufacturing the same, and semiconductor module
US10262928B2 (en) * 2017-03-23 2019-04-16 Rohm Co., Ltd. Semiconductor device
US20190115465A1 (en) * 2017-10-12 2019-04-18 Hitachi, Ltd. Silicon carbide semiconductor device, power module, and power conversion device
US20220319975A1 (en) * 2019-07-02 2022-10-06 Rohm Co., Ltd. Semiconductor device
JP1664282S (en) 2019-07-24 2020-07-27
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
US20230037158A1 (en) * 2020-01-16 2023-02-02 Sumitomo Electric Industries, Ltd. Semiconductor module
US11538936B2 (en) * 2020-03-04 2022-12-27 Rohm Co., Ltd. Semiconductor device
US11522058B2 (en) * 2020-09-11 2022-12-06 Kabushiki Kaisha Toshiba Semiconductor device with field plate electrode
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device

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