USD1021831S1 - Power semiconductor module - Google Patents
Power semiconductor module Download PDFInfo
- Publication number
- USD1021831S1 USD1021831S1 US29/808,480 US202129808480F USD1021831S US D1021831 S1 USD1021831 S1 US D1021831S1 US 202129808480 F US202129808480 F US 202129808480F US D1021831 S USD1021831 S US D1021831S
- Authority
- US
- United States
- Prior art keywords
- power semiconductor
- semiconductor module
- view
- module
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
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Description
Claims (1)
- The ornamental design for a power semiconductor module, as shown and described.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021005998F JP1696403S (en) | 2021-03-23 | 2021-03-23 | Power semiconductor device |
JP2021-005999D | 2021-03-23 | ||
JP2021-005998D | 2021-03-23 | ||
JP2021005999F JP1696313S (en) | 2021-03-23 | 2021-03-23 | Power semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1021831S1 true USD1021831S1 (en) | 2024-04-09 |
Family
ID=90566750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/808,480 Active USD1021831S1 (en) | 2021-03-23 | 2021-09-20 | Power semiconductor module |
Country Status (1)
Country | Link |
---|---|
US (1) | USD1021831S1 (en) |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3352726A (en) * | 1964-04-13 | 1967-11-14 | Philco Ford Corp | Method of fabricating planar semiconductor devices |
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD470463S1 (en) * | 2001-11-30 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD472530S1 (en) * | 2001-11-30 | 2003-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US20080197471A1 (en) * | 2007-02-16 | 2008-08-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method |
USD642996S1 (en) * | 2010-04-09 | 2011-08-09 | Panasonic Electric Works Co., Ltd. | Electroluminescence apparatus |
USD664506S1 (en) * | 2011-02-04 | 2012-07-31 | Panasonic Corporation | Electroluminescence module |
USD692843S1 (en) * | 2012-05-02 | 2013-11-05 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
US20160104654A1 (en) * | 2013-09-10 | 2016-04-14 | Mitsubishi Electric Corporation | Semiconductor device and semiconductor module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
US10262928B2 (en) * | 2017-03-23 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
US20190115465A1 (en) * | 2017-10-12 | 2019-04-18 | Hitachi, Ltd. | Silicon carbide semiconductor device, power module, and power conversion device |
US20190304946A1 (en) * | 2016-12-16 | 2019-10-03 | Abb Schweiz Ag | Power semiconductor module with low gate path inductance |
JP1664282S (en) | 2019-07-24 | 2020-07-27 | ||
US20210296226A1 (en) * | 2017-03-08 | 2021-09-23 | Mitsubishi Electric Corporation | Semiconductor device, method for manufacturing the same, and semiconductor module |
US20220319975A1 (en) * | 2019-07-02 | 2022-10-06 | Rohm Co., Ltd. | Semiconductor device |
US11522058B2 (en) * | 2020-09-11 | 2022-12-06 | Kabushiki Kaisha Toshiba | Semiconductor device with field plate electrode |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
US11538936B2 (en) * | 2020-03-04 | 2022-12-27 | Rohm Co., Ltd. | Semiconductor device |
US20230037158A1 (en) * | 2020-01-16 | 2023-02-02 | Sumitomo Electric Industries, Ltd. | Semiconductor module |
-
2021
- 2021-09-20 US US29/808,480 patent/USD1021831S1/en active Active
Patent Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3352726A (en) * | 1964-04-13 | 1967-11-14 | Philco Ford Corp | Method of fabricating planar semiconductor devices |
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD470463S1 (en) * | 2001-11-30 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD472530S1 (en) * | 2001-11-30 | 2003-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US20080197471A1 (en) * | 2007-02-16 | 2008-08-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method |
USD642996S1 (en) * | 2010-04-09 | 2011-08-09 | Panasonic Electric Works Co., Ltd. | Electroluminescence apparatus |
USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD664506S1 (en) * | 2011-02-04 | 2012-07-31 | Panasonic Corporation | Electroluminescence module |
USD692843S1 (en) * | 2012-05-02 | 2013-11-05 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
US20160104654A1 (en) * | 2013-09-10 | 2016-04-14 | Mitsubishi Electric Corporation | Semiconductor device and semiconductor module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
US20190304946A1 (en) * | 2016-12-16 | 2019-10-03 | Abb Schweiz Ag | Power semiconductor module with low gate path inductance |
US20210296226A1 (en) * | 2017-03-08 | 2021-09-23 | Mitsubishi Electric Corporation | Semiconductor device, method for manufacturing the same, and semiconductor module |
US10262928B2 (en) * | 2017-03-23 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
US20190115465A1 (en) * | 2017-10-12 | 2019-04-18 | Hitachi, Ltd. | Silicon carbide semiconductor device, power module, and power conversion device |
US20220319975A1 (en) * | 2019-07-02 | 2022-10-06 | Rohm Co., Ltd. | Semiconductor device |
JP1664282S (en) | 2019-07-24 | 2020-07-27 | ||
USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
US20230037158A1 (en) * | 2020-01-16 | 2023-02-02 | Sumitomo Electric Industries, Ltd. | Semiconductor module |
US11538936B2 (en) * | 2020-03-04 | 2022-12-27 | Rohm Co., Ltd. | Semiconductor device |
US11522058B2 (en) * | 2020-09-11 | 2022-12-06 | Kabushiki Kaisha Toshiba | Semiconductor device with field plate electrode |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
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