USD994624S1 - Power semiconductor module - Google Patents

Power semiconductor module Download PDF

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Publication number
USD994624S1
USD994624S1 US29/808,484 US202129808484F USD994624S US D994624 S1 USD994624 S1 US D994624S1 US 202129808484 F US202129808484 F US 202129808484F US D994624 S USD994624 S US D994624S
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United States
Prior art keywords
power semiconductor
semiconductor module
view
module
ornamental design
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US29/808,484
Inventor
Yuki Nakano
Kenji Yamamoto
Yasunori Kutsuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
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Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KUTSUMA, Yasunori, NAKANO, YUKI, YAMAMOTO, KENJI
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Publication of USD994624S1 publication Critical patent/USD994624S1/en
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Description

FIG. 1 is a front, top and right side perspective view of a power semiconductor module showing our new design;
FIG. 2 is a front view thereof, the rear view being an identical image of FIG. 2 ;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof; and,
FIG. 5 is a right side view thereof, the left side view being an identical image of FIG. 5 .

Claims (1)

    CLAIM
  1. The ornamental design for a power semiconductor module, as shown and described.
US29/808,484 2021-03-23 2021-09-20 Power semiconductor module Active USD994624S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021006002F JP1696315S (en) 2021-03-23 2021-03-23 Power semiconductor device
JP2021-006002D 2021-03-23

Publications (1)

Publication Number Publication Date
USD994624S1 true USD994624S1 (en) 2023-08-08

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US29/808,484 Active USD994624S1 (en) 2021-03-23 2021-09-20 Power semiconductor module

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JP (1) JP1696315S (en)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3352726A (en) * 1964-04-13 1967-11-14 Philco Ford Corp Method of fabricating planar semiconductor devices
US20080197471A1 (en) * 2007-02-16 2008-08-21 Matsushita Electric Industrial Co., Ltd. Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
USD664506S1 (en) * 2011-02-04 2012-07-31 Panasonic Corporation Electroluminescence module
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
US10262928B2 (en) * 2017-03-23 2019-04-16 Rohm Co., Ltd. Semiconductor device
US20190115465A1 (en) * 2017-10-12 2019-04-18 Hitachi, Ltd. Silicon carbide semiconductor device, power module, and power conversion device
JP1664282S (en) 2019-07-24 2020-07-27
US20210296226A1 (en) * 2017-03-08 2021-09-23 Mitsubishi Electric Corporation Semiconductor device, method for manufacturing the same, and semiconductor module
US11522058B2 (en) * 2020-09-11 2022-12-06 Kabushiki Kaisha Toshiba Semiconductor device with field plate electrode
US11538936B2 (en) * 2020-03-04 2022-12-27 Rohm Co., Ltd. Semiconductor device

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3352726A (en) * 1964-04-13 1967-11-14 Philco Ford Corp Method of fabricating planar semiconductor devices
US20080197471A1 (en) * 2007-02-16 2008-08-21 Matsushita Electric Industrial Co., Ltd. Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
USD664506S1 (en) * 2011-02-04 2012-07-31 Panasonic Corporation Electroluminescence module
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
US20210296226A1 (en) * 2017-03-08 2021-09-23 Mitsubishi Electric Corporation Semiconductor device, method for manufacturing the same, and semiconductor module
US10262928B2 (en) * 2017-03-23 2019-04-16 Rohm Co., Ltd. Semiconductor device
US20190115465A1 (en) * 2017-10-12 2019-04-18 Hitachi, Ltd. Silicon carbide semiconductor device, power module, and power conversion device
JP1664282S (en) 2019-07-24 2020-07-27
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
US11538936B2 (en) * 2020-03-04 2022-12-27 Rohm Co., Ltd. Semiconductor device
US11522058B2 (en) * 2020-09-11 2022-12-06 Kabushiki Kaisha Toshiba Semiconductor device with field plate electrode

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