JP1644633S - - Google Patents

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Publication number
JP1644633S
JP1644633S JP2019006409F JP2019006409F JP1644633S JP 1644633 S JP1644633 S JP 1644633S JP 2019006409 F JP2019006409 F JP 2019006409F JP 2019006409 F JP2019006409 F JP 2019006409F JP 1644633 S JP1644633 S JP 1644633S
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JP
Japan
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JP2019006409F
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Priority to JP2019006409F priority Critical patent/JP1644633S/ja
Priority to US29/705,163 priority patent/USD903612S1/en
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Publication of JP1644633S publication Critical patent/JP1644633S/ja
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JP2019006409F 2019-03-26 2019-03-26 Active JP1644633S (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019006409F JP1644633S (ja) 2019-03-26 2019-03-26
US29/705,163 USD903612S1 (en) 2019-03-26 2019-09-10 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019006409F JP1644633S (ja) 2019-03-26 2019-03-26

Publications (1)

Publication Number Publication Date
JP1644633S true JP1644633S (ja) 2019-11-05

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ID=68382742

Family Applications (1)

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JP2019006409F Active JP1644633S (ja) 2019-03-26 2019-03-26

Country Status (2)

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US (1) USD903612S1 (ja)
JP (1) JP1644633S (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1650295S (ja) * 2019-01-11 2020-01-20 半導体モジュール
JP1649258S (ja) * 2019-01-11 2022-12-21 半導体モジュール
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
JP1656709S (ja) * 2019-05-31 2020-04-06
JP1659677S (ja) 2019-08-29 2020-05-18
JP1659674S (ja) 2019-08-29 2020-05-18
JP1659716S (ja) 2019-08-29 2020-05-18
JP1659676S (ja) 2019-08-29 2020-05-18
JP1659672S (ja) * 2019-08-29 2020-05-18
JP1659673S (ja) 2019-08-29 2020-05-18
JP1659678S (ja) 2019-08-29 2020-05-18
JP1659675S (ja) 2019-08-29 2020-05-18
TWD206651S (zh) * 2020-04-24 2020-08-21 財團法人工業技術研究院 功率模組
JP1713167S (ja) * 2021-11-17 2022-04-21 半導体モジュール

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
EP0884781A3 (en) * 1997-06-12 1999-06-30 Hitachi, Ltd. Power semiconductor module
JP4151209B2 (ja) * 2000-08-29 2008-09-17 三菱電機株式会社 電力用半導体装置
US6906404B2 (en) * 2003-05-16 2005-06-14 Ballard Power Systems Corporation Power module with voltage overshoot limiting
USD556686S1 (en) * 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
JP2010147116A (ja) * 2008-12-17 2010-07-01 Mitsubishi Electric Corp 半導体装置
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
JP1536359S (ja) * 2014-08-19 2015-10-26
JP1536360S (ja) * 2014-08-19 2015-10-26
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
JP6547354B2 (ja) * 2015-03-20 2019-07-24 富士電機株式会社 半導体モジュールおよび樹脂ケース
JP6362560B2 (ja) * 2015-03-24 2018-07-25 三菱電機株式会社 半導体モジュール、電力変換装置および半導体モジュールの製造方法
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
JP1551317S (ja) * 2015-09-30 2016-06-13
JP1551316S (ja) * 2015-09-30 2016-06-13
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module

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Publication number Publication date
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