USD942403S1 - Power module having pin fins - Google Patents

Power module having pin fins Download PDF

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Publication number
USD942403S1
USD942403S1 US29/710,592 US201929710592F USD942403S US D942403 S1 USD942403 S1 US D942403S1 US 201929710592 F US201929710592 F US 201929710592F US D942403 S USD942403 S US D942403S
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United States
Prior art keywords
power module
pin fins
pin
fins
view
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US29/710,592
Inventor
Brice Mcpherson
Matthew Feurtado
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Wolfspeed Inc
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Wolfspeed Inc
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Assigned to CREE FAYETTEVILLE, INC. reassignment CREE FAYETTEVILLE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FEURTADO, MATTHEW, MCPHERSON, BRICE
Priority to US29/710,592 priority Critical patent/USD942403S1/en
Application filed by Wolfspeed Inc filed Critical Wolfspeed Inc
Priority to JPD2020-16754F priority patent/JP1683675S/ja
Priority to JPD2020-8293F priority patent/JP1682056S/ja
Priority to JPD2020-16753F priority patent/JP1683876S/ja
Assigned to CREE, INC. reassignment CREE, INC. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: CREE FAYETTEVILLE, INC.
Priority to US29/821,330 priority patent/USD985517S1/en
Publication of USD942403S1 publication Critical patent/USD942403S1/en
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Assigned to WOLFSPEED, INC. reassignment WOLFSPEED, INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION reassignment U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WOLFSPEED, INC.
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Description

FIG. 1 is a front right side perspective view of a power module having pin fins;
FIG. 2 is a bottom right side perspective view of the power module having pin fins shown in FIG. 1;
FIG. 3 is a top view of the power module having pin fins shown in FIG. 1;
FIG. 4 is a left side view of the power module having pin fins shown in FIG. 1;
FIG. 5 is a right side view of the power module having pin fins shown in FIG. 1;
FIG. 6 is a bottom view of the power module having pin fins shown in FIG. 1;
FIG. 7 is a back side view of the power module having pin fins shown in FIG. 1; and,
FIG. 8 is a front side view of the power module having pin fins shown in FIG. 1.
The subject matter shown in dashed lines, and any surfaces of the design not shown, including interior surfaces, form no part of the claimed invention.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a power module having pin fins, as shown and described.
US29/710,592 2019-10-24 2019-10-24 Power module having pin fins Active USD942403S1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US29/710,592 USD942403S1 (en) 2019-10-24 2019-10-24 Power module having pin fins
JPD2020-16754F JP1683675S (en) 2019-10-24 2020-04-22
JPD2020-8293F JP1682056S (en) 2019-10-24 2020-04-22
JPD2020-16753F JP1683876S (en) 2019-10-24 2020-04-22
US29/821,330 USD985517S1 (en) 2019-10-24 2021-12-29 Power module having pin fins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/710,592 USD942403S1 (en) 2019-10-24 2019-10-24 Power module having pin fins

Related Child Applications (1)

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US29/821,330 Division USD985517S1 (en) 2019-10-24 2021-12-29 Power module having pin fins

Publications (1)

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USD942403S1 true USD942403S1 (en) 2022-02-01

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US29/710,592 Active USD942403S1 (en) 2019-10-24 2019-10-24 Power module having pin fins
US29/821,330 Active USD985517S1 (en) 2019-10-24 2021-12-29 Power module having pin fins

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US29/821,330 Active USD985517S1 (en) 2019-10-24 2021-12-29 Power module having pin fins

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JP (3) JP1683876S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD969740S1 (en) * 2018-09-12 2022-11-15 Wolfspeed, Inc. Power module
USD985517S1 (en) * 2019-10-24 2023-05-09 Wolfspeed, Inc Power module having pin fins

Citations (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3421578A (en) * 1966-12-22 1969-01-14 Louis L Marton Heat dissipator
US3790859A (en) * 1970-02-19 1974-02-05 Texas Instruments Inc Electronic package header system having omni-directional heat dissipation characteristic
US4638858A (en) * 1985-10-16 1987-01-27 International Business Machines Corp. Composite heat transfer device with pins having wings alternately oriented for up-down flow
USD291845S (en) * 1983-11-23 1987-09-15 Tonino Lamborghini Textile fabric
US5241453A (en) * 1991-11-18 1993-08-31 The Whitaker Corporation EMI shielding device
USD341944S (en) * 1990-09-11 1993-12-07 Merfin Hygienic Products Ltd. Embossed tissue or similar article
USD364385S (en) 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
US5725051A (en) * 1992-11-05 1998-03-10 Level Energietechniek B.V. Heat exchanger
USD398295S (en) * 1996-10-08 1998-09-15 Chih Pin Chang Heat dissipating plate for computer parts
US6601299B2 (en) * 2000-10-19 2003-08-05 Ibc Corporation Tapered fin and method of forming the same
US20040150956A1 (en) * 2003-01-24 2004-08-05 Robert Conte Pin fin heat sink for power electronic applications
US6952347B2 (en) * 2001-01-20 2005-10-04 Conti Temic Microelectronic Gmbh Power module
USD511251S1 (en) * 2003-02-19 2005-11-08 The Procter & Gamble Company Cleaning sheet
US20070119568A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and method of enhanced boiling heat transfer using pin fins
US20080066888A1 (en) * 2006-09-08 2008-03-20 Danaher Motion Stockholm Ab Heat sink
US20090145581A1 (en) * 2007-12-11 2009-06-11 Paul Hoffman Non-linear fin heat sink
US20090309524A1 (en) 2008-06-13 2009-12-17 Rider Jerald R System and Method for Adding Voltages of Power Modules in Variable Frequency Drives
USD611255S1 (en) * 2006-11-29 2010-03-09 The Procter & Gamble Company Substrate with printed pattern
US7751192B2 (en) * 2005-05-05 2010-07-06 Sensys Medical, Inc. Heatsink method and apparatus
USD622230S1 (en) * 2009-11-02 2010-08-24 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD622228S1 (en) * 2009-09-11 2010-08-24 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD627746S1 (en) * 2009-12-25 2010-11-23 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
US20120001227A1 (en) * 2010-06-18 2012-01-05 Fuji Electric Co., Ltd. Power semiconductor module
US20120207591A1 (en) * 2011-02-15 2012-08-16 Ching-Pang Lee Cooling system having reduced mass pin fins for components in a gas turbine engine
USD672154S1 (en) * 2012-03-01 2012-12-11 Rockline Industries, Inc. Wipe with pattern
USD672729S1 (en) * 2011-12-30 2012-12-18 Foxsemicon Integrated Technology, Inc. Heat sink
USD673124S1 (en) * 2011-12-28 2012-12-25 Foxsemicon Integrated Technology, Inc. Heat sink
US20130105961A1 (en) 2011-10-31 2013-05-02 Infineon Technologies Ag Low inductance power module
US8441275B1 (en) 2010-01-14 2013-05-14 Tapt Interconnect, LLC Electronic device test fixture
US20140029199A1 (en) * 2012-07-30 2014-01-30 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and electronics modules having branching microchannels
USD699908S1 (en) * 2012-08-04 2014-02-18 Hangzhou Jeenor Cleaning Supplies Co., Ltd. Big dot pattern wiper
US20140091453A1 (en) * 2012-10-02 2014-04-03 Kabushiki Kaisha Toyota Jidoshokki Cooling device and semiconductor device
US20140198475A1 (en) 2013-01-17 2014-07-17 Lear Corporation Electrical busbar, electrical connector assembly and power converter
USD719537S1 (en) 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
US20140376184A1 (en) * 2012-04-16 2014-12-25 Fuji Electric Co. Ltd. Semiconductor device and cooler thereof
US20150137871A1 (en) 2013-06-04 2015-05-21 Panasonic Intellectual Property Management Co., Ltd. Gate driver and power module equipped with same
US20150146377A1 (en) * 2013-11-26 2015-05-28 Delta Electronics (Shanghai) Co., Ltd. Power conversion device and method for assembling the same
JP1530509S (en) 2014-12-24 2015-08-10
US20150327394A1 (en) * 2014-05-07 2015-11-12 International Business Machines Corporation Multi-component heatsink with self-adjusting pin fins
US9255745B2 (en) * 2009-01-05 2016-02-09 Hamilton Sundstrand Corporation Heat exchanger
US9291404B2 (en) * 2012-02-24 2016-03-22 Mitsubishi Electric Corporation Cooler and cooling device
USD757450S1 (en) * 2014-08-15 2016-05-31 Kimberly-Clark Worldwide, Inc. Tissue paper with embossing pattern
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD822626S1 (en) * 2016-11-21 2018-07-10 Abl Ip Holding Llc Heatsink
US10020237B2 (en) 2014-10-30 2018-07-10 Infineon Technologies Ag Power semiconductor module and method for producing a power semiconductor module
US10297525B2 (en) * 2015-10-30 2019-05-21 Byd Company Limited Base plate for heat sink as well as heat sink and IGBT module having the same
US10302371B2 (en) * 2014-10-20 2019-05-28 Signify Holding B.V. Low weight tube fin heat sink
US20200102839A1 (en) * 2018-09-28 2020-04-02 United Technologies Corporation Ribbed pin fins
US20200144140A1 (en) * 2017-07-12 2020-05-07 Abb Schweiz Ag Power semiconductor module
JP1660592S (en) 2018-09-12 2020-06-01
US20200388556A1 (en) * 2017-11-30 2020-12-10 Hitachi Automotive Systems, Ltd. Power semiconductor device and manufacturing method of the same
US10957621B2 (en) * 2014-05-30 2021-03-23 Avid Controls, Inc. Heat sink for a power semiconductor module
US11071234B2 (en) * 2018-10-30 2021-07-20 Board Of Trastees Of The University Of Arkansas Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling
US11078847B2 (en) * 2017-08-25 2021-08-03 Raytheon Technologies Corporation Backside features with intermitted pin fins
US20210285727A1 (en) * 2020-03-10 2021-09-16 University Of Maryland, College Park Cross-flow heat exchanger systems and methods for fabrication thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD942403S1 (en) * 2019-10-24 2022-02-01 Wolfspeed, Inc. Power module having pin fins

Patent Citations (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3421578A (en) * 1966-12-22 1969-01-14 Louis L Marton Heat dissipator
US3790859A (en) * 1970-02-19 1974-02-05 Texas Instruments Inc Electronic package header system having omni-directional heat dissipation characteristic
USD291845S (en) * 1983-11-23 1987-09-15 Tonino Lamborghini Textile fabric
US4638858A (en) * 1985-10-16 1987-01-27 International Business Machines Corp. Composite heat transfer device with pins having wings alternately oriented for up-down flow
USD341944S (en) * 1990-09-11 1993-12-07 Merfin Hygienic Products Ltd. Embossed tissue or similar article
US5241453A (en) * 1991-11-18 1993-08-31 The Whitaker Corporation EMI shielding device
US5725051A (en) * 1992-11-05 1998-03-10 Level Energietechniek B.V. Heat exchanger
USD364385S (en) 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD398295S (en) * 1996-10-08 1998-09-15 Chih Pin Chang Heat dissipating plate for computer parts
US6601299B2 (en) * 2000-10-19 2003-08-05 Ibc Corporation Tapered fin and method of forming the same
US6952347B2 (en) * 2001-01-20 2005-10-04 Conti Temic Microelectronic Gmbh Power module
US20040150956A1 (en) * 2003-01-24 2004-08-05 Robert Conte Pin fin heat sink for power electronic applications
USD511251S1 (en) * 2003-02-19 2005-11-08 The Procter & Gamble Company Cleaning sheet
US7751192B2 (en) * 2005-05-05 2010-07-06 Sensys Medical, Inc. Heatsink method and apparatus
US20070119568A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and method of enhanced boiling heat transfer using pin fins
US20080066888A1 (en) * 2006-09-08 2008-03-20 Danaher Motion Stockholm Ab Heat sink
USD611255S1 (en) * 2006-11-29 2010-03-09 The Procter & Gamble Company Substrate with printed pattern
US20090145581A1 (en) * 2007-12-11 2009-06-11 Paul Hoffman Non-linear fin heat sink
US20090309524A1 (en) 2008-06-13 2009-12-17 Rider Jerald R System and Method for Adding Voltages of Power Modules in Variable Frequency Drives
US9255745B2 (en) * 2009-01-05 2016-02-09 Hamilton Sundstrand Corporation Heat exchanger
USD622228S1 (en) * 2009-09-11 2010-08-24 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD622230S1 (en) * 2009-11-02 2010-08-24 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD627746S1 (en) * 2009-12-25 2010-11-23 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
US8441275B1 (en) 2010-01-14 2013-05-14 Tapt Interconnect, LLC Electronic device test fixture
US20120001227A1 (en) * 2010-06-18 2012-01-05 Fuji Electric Co., Ltd. Power semiconductor module
US20120207591A1 (en) * 2011-02-15 2012-08-16 Ching-Pang Lee Cooling system having reduced mass pin fins for components in a gas turbine engine
US20130105961A1 (en) 2011-10-31 2013-05-02 Infineon Technologies Ag Low inductance power module
USD673124S1 (en) * 2011-12-28 2012-12-25 Foxsemicon Integrated Technology, Inc. Heat sink
USD672729S1 (en) * 2011-12-30 2012-12-18 Foxsemicon Integrated Technology, Inc. Heat sink
US9291404B2 (en) * 2012-02-24 2016-03-22 Mitsubishi Electric Corporation Cooler and cooling device
USD672154S1 (en) * 2012-03-01 2012-12-11 Rockline Industries, Inc. Wipe with pattern
US20140376184A1 (en) * 2012-04-16 2014-12-25 Fuji Electric Co. Ltd. Semiconductor device and cooler thereof
US20140029199A1 (en) * 2012-07-30 2014-01-30 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and electronics modules having branching microchannels
USD699908S1 (en) * 2012-08-04 2014-02-18 Hangzhou Jeenor Cleaning Supplies Co., Ltd. Big dot pattern wiper
US20140091453A1 (en) * 2012-10-02 2014-04-03 Kabushiki Kaisha Toyota Jidoshokki Cooling device and semiconductor device
US20140198475A1 (en) 2013-01-17 2014-07-17 Lear Corporation Electrical busbar, electrical connector assembly and power converter
USD719537S1 (en) 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
US20150137871A1 (en) 2013-06-04 2015-05-21 Panasonic Intellectual Property Management Co., Ltd. Gate driver and power module equipped with same
US20150146377A1 (en) * 2013-11-26 2015-05-28 Delta Electronics (Shanghai) Co., Ltd. Power conversion device and method for assembling the same
US20150327394A1 (en) * 2014-05-07 2015-11-12 International Business Machines Corporation Multi-component heatsink with self-adjusting pin fins
US10957621B2 (en) * 2014-05-30 2021-03-23 Avid Controls, Inc. Heat sink for a power semiconductor module
USD757450S1 (en) * 2014-08-15 2016-05-31 Kimberly-Clark Worldwide, Inc. Tissue paper with embossing pattern
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
US10302371B2 (en) * 2014-10-20 2019-05-28 Signify Holding B.V. Low weight tube fin heat sink
US10020237B2 (en) 2014-10-30 2018-07-10 Infineon Technologies Ag Power semiconductor module and method for producing a power semiconductor module
USD810706S1 (en) 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
JP1530509S (en) 2014-12-24 2015-08-10
US10297525B2 (en) * 2015-10-30 2019-05-21 Byd Company Limited Base plate for heat sink as well as heat sink and IGBT module having the same
USD822626S1 (en) * 2016-11-21 2018-07-10 Abl Ip Holding Llc Heatsink
US20200144140A1 (en) * 2017-07-12 2020-05-07 Abb Schweiz Ag Power semiconductor module
US11078847B2 (en) * 2017-08-25 2021-08-03 Raytheon Technologies Corporation Backside features with intermitted pin fins
US20200388556A1 (en) * 2017-11-30 2020-12-10 Hitachi Automotive Systems, Ltd. Power semiconductor device and manufacturing method of the same
JP1660592S (en) 2018-09-12 2020-06-01
USD903590S1 (en) * 2018-09-12 2020-12-01 Cree Fayetteville, Inc. Power module
JP1660547S (en) 2018-09-12 2020-06-01
JP1660593S (en) 2018-09-12 2020-06-01
US20200102839A1 (en) * 2018-09-28 2020-04-02 United Technologies Corporation Ribbed pin fins
US11071234B2 (en) * 2018-10-30 2021-07-20 Board Of Trastees Of The University Of Arkansas Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling
US20210285727A1 (en) * 2020-03-10 2021-09-16 University Of Maryland, College Park Cross-flow heat exchanger systems and methods for fabrication thereof

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
"IGBT power semiconductor module" M & E, published by Kogyo Chosakai, vol. 33, No. 7, Jul. 1, 2006, pp. 137, Product No. KAL100, Special License Office Design Division Publicly known document No. HA1800853600 [With machine-generated translation].
"Semiconductor devices for electric power" 2003 CVCF constant voltage, constant frequency uninterruptible power supply (UPS) catalog, 2004, Domestic Catalog No. 262, p. 3, Public Document No. HC1605031600, Design Division, Japan Patent Office; retrieved from the Internet on Mar. 1, 2005 [With machine-generated translation].
German Design Bulletin, vol. 3, Feb. 25, 1995, p. 979, Register No. M9407438, Design Nos. M9407438-0001, M9407438-0002 and M9407438-0003; Public Document No. HH08013675, Design Division, Japan Patent Office [With machine-generated translation].

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD969740S1 (en) * 2018-09-12 2022-11-15 Wolfspeed, Inc. Power module
USD985517S1 (en) * 2019-10-24 2023-05-09 Wolfspeed, Inc Power module having pin fins

Also Published As

Publication number Publication date
JP1683675S (en) 2021-04-19
JP1683876S (en) 2021-04-19
USD985517S1 (en) 2023-05-09
JP1682056S (en) 2021-03-29

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