|
US3421578A
(en)
*
|
1966-12-22 |
1969-01-14 |
Louis L Marton |
Heat dissipator
|
|
DE2107549A1
(en)
*
|
1970-02-19 |
1971-09-02 |
Texas Instruments Inc |
Carrier of an electronic circuit with a collecting system with heat conduction properties for all directions
|
|
USD291845S
(en)
*
|
1983-11-23 |
1987-09-15 |
Tonino Lamborghini |
Textile fabric
|
|
US4638858A
(en)
*
|
1985-10-16 |
1987-01-27 |
International Business Machines Corp. |
Composite heat transfer device with pins having wings alternately oriented for up-down flow
|
|
USD341944S
(en)
*
|
1990-09-11 |
1993-12-07 |
Merfin Hygienic Products Ltd. |
Embossed tissue or similar article
|
|
US5241453A
(en)
*
|
1991-11-18 |
1993-08-31 |
The Whitaker Corporation |
EMI shielding device
|
|
NL9201945A
(en)
*
|
1992-11-05 |
1994-06-01 |
Level Energietech Bv |
Heat exchanger.
|
|
USD364385S
(en)
|
1994-05-11 |
1995-11-21 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing
|
|
USD398295S
(en)
*
|
1996-10-08 |
1998-09-15 |
Chih Pin Chang |
Heat dissipating plate for computer parts
|
|
US6601299B2
(en)
*
|
2000-10-19 |
2003-08-05 |
Ibc Corporation |
Tapered fin and method of forming the same
|
|
DE10102621B4
(en)
*
|
2001-01-20 |
2006-05-24 |
Conti Temic Microelectronic Gmbh |
power module
|
|
US20040150956A1
(en)
*
|
2003-01-24 |
2004-08-05 |
Robert Conte |
Pin fin heat sink for power electronic applications
|
|
USD511251S1
(en)
*
|
2003-02-19 |
2005-11-08 |
The Procter & Gamble Company |
Cleaning sheet
|
|
US7593230B2
(en)
*
|
2005-05-05 |
2009-09-22 |
Sensys Medical, Inc. |
Apparatus for absorbing and dissipating excess heat generated by a system
|
|
US20070119568A1
(en)
*
|
2005-11-30 |
2007-05-31 |
Raytheon Company |
System and method of enhanced boiling heat transfer using pin fins
|
|
US20080066888A1
(en)
*
|
2006-09-08 |
2008-03-20 |
Danaher Motion Stockholm Ab |
Heat sink
|
|
USD564236S1
(en)
*
|
2006-11-29 |
2008-03-18 |
The Procter & Gamble Company |
Substrate with printed pattern
|
|
US20090145581A1
(en)
*
|
2007-12-11 |
2009-06-11 |
Paul Hoffman |
Non-linear fin heat sink
|
|
US8125177B2
(en)
|
2008-06-13 |
2012-02-28 |
Baker Hughes Incorporated |
System and method for adding voltages of power modules in variable frequency drives
|
|
US9255745B2
(en)
*
|
2009-01-05 |
2016-02-09 |
Hamilton Sundstrand Corporation |
Heat exchanger
|
|
USD622228S1
(en)
*
|
2009-09-11 |
2010-08-24 |
Foxsemicon Integrated Technology, Inc. |
Heat dissipation apparatus
|
|
USD622230S1
(en)
*
|
2009-11-02 |
2010-08-24 |
Foxsemicon Integrated Technology, Inc. |
Heat dissipation apparatus
|
|
USD627746S1
(en)
*
|
2009-12-25 |
2010-11-23 |
Foxsemicon Integrated Technology, Inc. |
Heat dissipation apparatus
|
|
US8441275B1
(en)
|
2010-01-14 |
2013-05-14 |
Tapt Interconnect, LLC |
Electronic device test fixture
|
|
JP2012005301A
(en)
*
|
2010-06-18 |
2012-01-05 |
Fuji Electric Co Ltd |
Power semiconductor module
|
|
US8668453B2
(en)
*
|
2011-02-15 |
2014-03-11 |
Siemens Energy, Inc. |
Cooling system having reduced mass pin fins for components in a gas turbine engine
|
|
US8466541B2
(en)
|
2011-10-31 |
2013-06-18 |
Infineon Technologies Ag |
Low inductance power module
|
|
USD673124S1
(en)
*
|
2011-12-28 |
2012-12-25 |
Foxsemicon Integrated Technology, Inc. |
Heat sink
|
|
USD672729S1
(en)
*
|
2011-12-30 |
2012-12-18 |
Foxsemicon Integrated Technology, Inc. |
Heat sink
|
|
JP5901343B2
(en)
*
|
2012-02-24 |
2016-04-06 |
三菱電機株式会社 |
Cooler and cooling device
|
|
USD672154S1
(en)
*
|
2012-03-01 |
2012-12-11 |
Rockline Industries, Inc. |
Wipe with pattern
|
|
US9472488B2
(en)
*
|
2012-04-16 |
2016-10-18 |
Fuji Electric Co., Ltd. |
Semiconductor device and cooler thereof
|
|
US9353999B2
(en)
*
|
2012-07-30 |
2016-05-31 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Cooling apparatuses and electronics modules having branching microchannels
|
|
USD699908S1
(en)
*
|
2012-08-04 |
2014-02-18 |
Hangzhou Jeenor Cleaning Supplies Co., Ltd. |
Big dot pattern wiper
|
|
JP6262422B2
(en)
*
|
2012-10-02 |
2018-01-17 |
昭和電工株式会社 |
Cooling device and semiconductor device
|
|
US9666968B2
(en)
|
2013-01-17 |
2017-05-30 |
Lear Corporation |
Electrical busbar, electrical connector assembly and power converter
|
|
USD719537S1
(en)
|
2013-05-08 |
2014-12-16 |
Mitsubishi Electric Corporation |
Semiconductor device
|
|
JP5934925B2
(en)
|
2013-06-04 |
2016-06-15 |
パナソニックＩｐマネジメント株式会社 |
Gate driver and power module including the same
|
|
CN104682722B
(en)
*
|
2013-11-26 |
2018-01-26 |
台达电子企业管理（上海）有限公司 |
Power supply change-over device and its assemble method
|
|
US9313923B2
(en)
*
|
2014-05-07 |
2016-04-12 |
Lenovo Enterprise Solutions (Singapore) Pte. Ltd. |
Multi-component heatsink with self-adjusting pin fins
|
|
US10957621B2
(en)
*
|
2014-05-30 |
2021-03-23 |
Avid Controls, Inc. |
Heat sink for a power semiconductor module
|
|
USD757450S1
(en)
*
|
2014-08-15 |
2016-05-31 |
Kimberly-Clark Worldwide, Inc. |
Tissue paper with embossing pattern
|
|
JP1536359S
(en)
*
|
2014-08-19 |
2015-10-26 |
|
|
|
EP3209965B1
(en)
*
|
2014-10-20 |
2018-06-13 |
Philips Lighting Holding B.V. |
Low weight tube fin heat sink
|
|
DE102014115847B4
(en)
|
2014-10-30 |
2018-03-08 |
Infineon Technologies Ag |
Method for producing a power semiconductor module
|
|
JP1530509S
(en)
|
2014-12-24 |
2015-08-10 |
|
|
|
USD772184S1
(en)
|
2014-12-24 |
2016-11-22 |
Fuji Electric Co., Ltd. |
Semiconductor module
|
|
CN205213228U
(en)
*
|
2015-10-30 |
2016-05-04 |
比亚迪股份有限公司 |
Radiator bottom plate and have its radiator and IGBT module
|
|
USD822626S1
(en)
*
|
2016-11-21 |
2018-07-10 |
Abl Ip Holding Llc |
Heatsink
|
|
JP7221930B2
(en)
*
|
2017-07-12 |
2023-02-14 |
ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト |
power semiconductor module
|
|
US11078847B2
(en)
*
|
2017-08-25 |
2021-08-03 |
Raytheon Technologies Corporation |
Backside features with intermitted pin fins
|
|
JP6979864B2
(en)
*
|
2017-11-30 |
2021-12-15 |
日立Astemo株式会社 |
Power semiconductor devices and their manufacturing methods
|
|
USD903590S1
(en)
|
2018-09-12 |
2020-12-01 |
Cree Fayetteville, Inc. |
Power module
|
|
US10907480B2
(en)
*
|
2018-09-28 |
2021-02-02 |
Raytheon Technologies Corporation |
Ribbed pin fins
|
|
US11071234B2
(en)
*
|
2018-10-30 |
2021-07-20 |
Board Of Trastees Of The University Of Arkansas |
Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling
|
|
USD942403S1
(en)
*
|
2019-10-24 |
2022-02-01 |
Wolfspeed, Inc. |
Power module having pin fins
|
|
US20210285727A1
(en)
*
|
2020-03-10 |
2021-09-16 |
University Of Maryland, College Park |
Cross-flow heat exchanger systems and methods for fabrication thereof
|