USD810706S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD810706S1 USD810706S1 US29/580,738 US201629580738F USD810706S US D810706 S1 USD810706 S1 US D810706S1 US 201629580738 F US201629580738 F US 201629580738F US D810706 S USD810706 S US D810706S
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- US
- United States
- Prior art keywords
- semiconductor module
- view
- ornamental design
- semiconductor
- rear surface
- Prior art date
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Description
The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. Plate shaped terminals are provided on the left side and right side. A plurality of post shaped pins extend from a rear surface. The cross-sections of the post shaped pins are rhombic. A hole penetrates from a front surface to the rear surface at each of four corners of the semiconductor module.
Claims (1)
- The ornamental design for a semiconductor module, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/580,738 USD810706S1 (en) | 2014-12-24 | 2016-10-12 | Semiconductor module |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2014-028806 | 2014-12-24 | ||
JPD2014-28806F JP1530511S (en) | 2014-12-24 | 2014-12-24 | |
JPD2014-28804F JP1530509S (en) | 2014-12-24 | 2014-12-24 | |
JPD2014-028804 | 2014-12-24 | ||
JPD2014-28805F JP1530510S (en) | 2014-12-24 | 2014-12-24 | |
JPD2014-028805 | 2014-12-24 | ||
US29/531,129 USD772184S1 (en) | 2014-12-24 | 2015-06-23 | Semiconductor module |
US29/580,738 USD810706S1 (en) | 2014-12-24 | 2016-10-12 | Semiconductor module |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/531,129 Division USD772184S1 (en) | 2014-12-24 | 2015-06-23 | Semiconductor module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD810706S1 true USD810706S1 (en) | 2018-02-20 |
Family
ID=57287089
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/531,129 Active USD772184S1 (en) | 2014-12-24 | 2015-06-23 | Semiconductor module |
US29/580,738 Active USD810706S1 (en) | 2014-12-24 | 2016-10-12 | Semiconductor module |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/531,129 Active USD772184S1 (en) | 2014-12-24 | 2015-06-23 | Semiconductor module |
Country Status (1)
Country | Link |
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US (2) | USD772184S1 (en) |
Cited By (29)
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---|---|---|---|---|
USD822628S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
USD822627S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
USD823270S1 (en) * | 2016-09-30 | 2018-07-17 | Rohm Co., Ltd. | Semiconductor device |
USD827593S1 (en) * | 2014-11-28 | 2018-09-04 | Fuji Electric Co., Ltd | Semiconductor module |
USD827591S1 (en) * | 2016-10-31 | 2018-09-04 | Fuji Electric Co., Ltd. | Semiconductor module |
USD837752S1 (en) * | 2017-01-31 | 2019-01-08 | Dylan James Sievers | Heatsink |
USD847103S1 (en) * | 2017-09-07 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
USD847104S1 (en) * | 2017-09-29 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
USD850309S1 (en) * | 2017-07-27 | 2019-06-04 | Aehr Test Systems | Layout of contacts |
USD851612S1 (en) * | 2017-06-30 | 2019-06-18 | Microduino Inc. | Electrical module |
USD858467S1 (en) | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
USD864132S1 (en) | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
USD879729S1 (en) * | 2017-06-30 | 2020-03-31 | Microduino Inc. | Electrical module |
USD903611S1 (en) * | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
USD917402S1 (en) * | 2017-08-22 | 2021-04-27 | Foxconn Interconnect Technology Limited | Protective cap |
USD923591S1 (en) * | 2019-03-15 | 2021-06-29 | Tamura Corporation | Semiconductor driving circuit module |
USD927437S1 (en) * | 2019-08-29 | 2021-08-10 | Rohm Co., Ltd. | Power semiconductor module |
USD934188S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Power semiconductor module |
USD934190S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD934189S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD934822S1 (en) | 2019-08-29 | 2021-11-02 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD942405S1 (en) * | 2019-01-11 | 2022-02-01 | Fuji Electric Co., Ltd. | Semiconductor module |
USD942404S1 (en) * | 2019-01-11 | 2022-02-01 | Fuji Electric Co., Ltd. | Semiconductor module |
USD942403S1 (en) | 2019-10-24 | 2022-02-01 | Wolfspeed, Inc. | Power module having pin fins |
US11355420B2 (en) * | 2018-06-27 | 2022-06-07 | Fuji Electric Co., Ltd. | Cooling apparatus, semiconductor module, and vehicle |
USD969761S1 (en) | 2019-08-29 | 2022-11-15 | Rohm Co., Ltd. | Power semiconductor module |
USD981355S1 (en) | 2019-08-29 | 2023-03-21 | Rohm Co., Ltd. | Power semiconductor module |
USD981354S1 (en) | 2019-08-29 | 2023-03-21 | Rohm Co., Ltd. | Power semiconductor module |
USD1037163S1 (en) * | 2021-11-17 | 2024-07-30 | Fuji Electric Co., Ltd. | Semiconductor module |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD754084S1 (en) | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD772184S1 (en) * | 2014-12-24 | 2016-11-22 | Fuji Electric Co., Ltd. | Semiconductor module |
JP1551316S (en) * | 2015-09-30 | 2016-06-13 | ||
JP1551317S (en) * | 2015-09-30 | 2016-06-13 | ||
USD799439S1 (en) * | 2016-05-31 | 2017-10-10 | Rohm Co., Ltd. | Power converting semiconductor module |
JP1582474S (en) * | 2016-10-14 | 2017-07-31 | ||
JP1578687S (en) * | 2016-11-08 | 2017-06-12 | ||
USD853342S1 (en) * | 2017-02-28 | 2019-07-09 | Infineon Technologies Ag | High-performance semiconductor module |
USD853978S1 (en) * | 2017-02-28 | 2019-07-16 | Infineon Technologies Ag | High-performance semiconductor module |
JP1604002S (en) * | 2017-09-27 | 2018-05-14 | ||
JP1604003S (en) * | 2017-09-27 | 2018-05-14 | ||
JP1603911S (en) * | 2017-09-27 | 2018-05-14 | ||
JP1644633S (en) * | 2019-03-26 | 2019-11-05 | ||
JP1656709S (en) * | 2019-05-31 | 2020-04-06 |
Citations (42)
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USD357671S (en) * | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
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USD705184S1 (en) | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD706232S1 (en) | 2012-12-21 | 2014-06-03 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710318S1 (en) | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710317S1 (en) | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
USD710319S1 (en) | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD712853S1 (en) | 2012-12-21 | 2014-09-09 | Fuji Electric Co., Ltd. | Semiconductor module |
USD721048S1 (en) | 2013-06-17 | 2015-01-13 | Fuji Electric Co., Ltd. | Semiconductor module |
USD721340S1 (en) | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD724554S1 (en) | 2014-02-19 | 2015-03-17 | Fuji Electric Co., Ltd. | Semiconductor module |
USD748595S1 (en) | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD759604S1 (en) * | 2015-06-17 | 2016-06-21 | Mitsubishi Electric Corporation | Semiconductor device |
USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
USD762597S1 (en) * | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
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USD772184S1 (en) * | 2014-12-24 | 2016-11-22 | Fuji Electric Co., Ltd. | Semiconductor module |
USD774479S1 (en) * | 2014-11-28 | 2016-12-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
-
2015
- 2015-06-23 US US29/531,129 patent/USD772184S1/en active Active
-
2016
- 2016-10-12 US US29/580,738 patent/USD810706S1/en active Active
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US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
USD357671S (en) * | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD357672S (en) | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD360619S (en) * | 1993-09-16 | 1995-07-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD389808S (en) * | 1996-01-09 | 1998-01-27 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD396450S (en) | 1996-12-24 | 1998-07-28 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
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USD476959S1 (en) * | 2002-07-31 | 2003-07-08 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
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Cited By (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD827593S1 (en) * | 2014-11-28 | 2018-09-04 | Fuji Electric Co., Ltd | Semiconductor module |
USD823270S1 (en) * | 2016-09-30 | 2018-07-17 | Rohm Co., Ltd. | Semiconductor device |
USD827591S1 (en) * | 2016-10-31 | 2018-09-04 | Fuji Electric Co., Ltd. | Semiconductor module |
USD858467S1 (en) | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
USD875058S1 (en) | 2017-01-05 | 2020-02-11 | Rohm Co., Ltd. | Power semiconductor module |
USD864132S1 (en) | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
USD822628S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
USD837752S1 (en) * | 2017-01-31 | 2019-01-08 | Dylan James Sievers | Heatsink |
USD822627S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
USD879729S1 (en) * | 2017-06-30 | 2020-03-31 | Microduino Inc. | Electrical module |
USD851612S1 (en) * | 2017-06-30 | 2019-06-18 | Microduino Inc. | Electrical module |
USD850309S1 (en) * | 2017-07-27 | 2019-06-04 | Aehr Test Systems | Layout of contacts |
USD875579S1 (en) | 2017-07-27 | 2020-02-18 | Aehr Test Systems | Layout of contacts |
USD917402S1 (en) * | 2017-08-22 | 2021-04-27 | Foxconn Interconnect Technology Limited | Protective cap |
USD847103S1 (en) * | 2017-09-07 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
USD847104S1 (en) * | 2017-09-29 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
US11355420B2 (en) * | 2018-06-27 | 2022-06-07 | Fuji Electric Co., Ltd. | Cooling apparatus, semiconductor module, and vehicle |
USD942405S1 (en) * | 2019-01-11 | 2022-02-01 | Fuji Electric Co., Ltd. | Semiconductor module |
USD942404S1 (en) * | 2019-01-11 | 2022-02-01 | Fuji Electric Co., Ltd. | Semiconductor module |
USD923591S1 (en) * | 2019-03-15 | 2021-06-29 | Tamura Corporation | Semiconductor driving circuit module |
USD903611S1 (en) * | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
USD927437S1 (en) * | 2019-08-29 | 2021-08-10 | Rohm Co., Ltd. | Power semiconductor module |
USD934822S1 (en) | 2019-08-29 | 2021-11-02 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD934189S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD934190S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Circuit board for power semiconductor module |
USD934188S1 (en) | 2019-08-29 | 2021-10-26 | Rohm Co., Ltd. | Power semiconductor module |
USD969761S1 (en) | 2019-08-29 | 2022-11-15 | Rohm Co., Ltd. | Power semiconductor module |
USD981355S1 (en) | 2019-08-29 | 2023-03-21 | Rohm Co., Ltd. | Power semiconductor module |
USD981354S1 (en) | 2019-08-29 | 2023-03-21 | Rohm Co., Ltd. | Power semiconductor module |
USD942403S1 (en) | 2019-10-24 | 2022-02-01 | Wolfspeed, Inc. | Power module having pin fins |
USD985517S1 (en) | 2019-10-24 | 2023-05-09 | Wolfspeed, Inc | Power module having pin fins |
USD1041429S1 (en) | 2019-10-24 | 2024-09-10 | Wolfspeed, Inc. | Power module having pin fins |
USD1037163S1 (en) * | 2021-11-17 | 2024-07-30 | Fuji Electric Co., Ltd. | Semiconductor module |
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