USD822627S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD822627S1
USD822627S1 US29/598,525 US201729598525F USD822627S US D822627 S1 USD822627 S1 US D822627S1 US 201729598525 F US201729598525 F US 201729598525F US D822627 S USD822627 S US D822627S
Authority
US
United States
Prior art keywords
semiconductor device
view
design
part
form
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/598,525
Inventor
Kentaro NASU
Kenji Nishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2017-001615 priority Critical
Priority to JPD2017-1615F priority patent/JP1584651S/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NASU, KENTARO, NISHIDA, KENJI
Application granted granted Critical
Publication of USD822627S1 publication Critical patent/USD822627S1/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a semiconductor device showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side view thereof; and,

FIG. 7 is a left side view thereof.

The features shown in broken lines in the drawings depict portions of the article that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/598,525 2017-01-31 2017-03-27 Semiconductor device Active USD822627S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017-001615 2017-01-10
JPD2017-1615F JP1584651S (en) 2017-01-31 2017-01-31

Publications (1)

Publication Number Publication Date
USD822627S1 true USD822627S1 (en) 2018-07-10

Family

ID=59677592

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/598,525 Active USD822627S1 (en) 2017-01-31 2017-03-27 Semiconductor device

Country Status (2)

Country Link
US (1) USD822627S1 (en)
JP (1) JP1584651S (en)

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD739363S1 (en) * 2011-06-17 2015-09-22 Soraa, Inc. Array of triangular semiconductor dies
USD751999S1 (en) * 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD805485S1 (en) * 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD739363S1 (en) * 2011-06-17 2015-09-22 Soraa, Inc. Array of triangular semiconductor dies
USD803171S1 (en) * 2011-06-17 2017-11-21 Soraa, Inc. Array of triangular semiconductor dies
USD751999S1 (en) * 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD752000S1 (en) * 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD805485S1 (en) * 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module

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Publication number Publication date
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