USD360619S - Hybrid integrated circuit for electric power control - Google Patents

Hybrid integrated circuit for electric power control Download PDF

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Publication number
USD360619S
USD360619S US29/019,288 US1928894F USD360619S US D360619 S USD360619 S US D360619S US 1928894 F US1928894 F US 1928894F US D360619 S USD360619 S US D360619S
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US
United States
Prior art keywords
integrated circuit
electric power
power control
hybrid integrated
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/019,288
Inventor
Noriho Terasawa
Shin Soyano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SOYANO, SHIN, TERASAWA, NORIHO
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Publication of USD360619S publication Critical patent/USD360619S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the top, front and right side of a hybrid integrated circuit for electric power control showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a rear elevational view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a hybrid integrated circuit for electric power control, as shown.
US29/019,288 1993-09-16 1994-02-28 Hybrid integrated circuit for electric power control Expired - Lifetime USD360619S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5-27993 1993-09-16
JP2799393 1993-09-16

Publications (1)

Publication Number Publication Date
USD360619S true USD360619S (en) 1995-07-25

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Family Applications (1)

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US29/019,288 Expired - Lifetime USD360619S (en) 1993-09-16 1994-02-28 Hybrid integrated circuit for electric power control

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Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD739350S1 (en) * 2013-08-30 2015-09-22 Tamura Corporation Power circuit block
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD873227S1 (en) * 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Hybrid integrated circuit on p. 106 of Electronic Design, Feb. 4, 1993.
POWEREX control module on p. 208 of EDN, Apr. 23, 1992.
Sampling amplifier on p. 126 of Electronic Design, Jan. 21, 1993.

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD739350S1 (en) * 2013-08-30 2015-09-22 Tamura Corporation Power circuit block
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD827593S1 (en) 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD875058S1 (en) 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD873227S1 (en) * 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module

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