USD864132S1 - Power semiconductor module - Google Patents

Power semiconductor module Download PDF

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Publication number
USD864132S1
USD864132S1 US29/609,637 US201729609637F USD864132S US D864132 S1 USD864132 S1 US D864132S1 US 201729609637 F US201729609637 F US 201729609637F US D864132 S USD864132 S US D864132S
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Prior art keywords
power semiconductor
semiconductor module
view
design
module
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US29/609,637
Inventor
Hideki Sawada
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Rohm Co Ltd
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Rohm Co Ltd
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Filing date
Publication date
Priority claimed from JPD2017-31F external-priority patent/JP1585830S/ja
Priority claimed from JPD2017-33F external-priority patent/JP1585962S/ja
Priority claimed from JPD2017-34F external-priority patent/JP1605558S/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAWADA, HIDEKI
Priority to US29/703,828 priority Critical patent/USD875058S1/en
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FIG. 1 is a front, top, and right side perspective view of a first embodiment of a power semiconductor module showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a front, top, and right side perspective view of a second embodiment of a power semiconductor module showing my new design;
FIG. 8 is a front view thereof;
FIG. 9 is a rear view thereof;
FIG. 10 is a top plan view thereof;
FIG. 11 is a right side view thereof; and,
FIG. 12 is a left side view thereof.
The features shown in broken lines in the drawings depict portions of the article that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power semiconductor module, as shown and described.
US29/609,637 2017-01-05 2017-07-03 Power semiconductor module Active USD864132S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/703,828 USD875058S1 (en) 2017-01-05 2019-08-29 Power semiconductor module

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2017-000031 2017-01-05
JPD2017-31F JP1585830S (en) 2017-01-05 2017-01-05
JPD2017-33F JP1585962S (en) 2017-01-05 2017-01-05
JP2017-000034 2017-01-05
JPD2017-34F JP1605558S (en) 2017-01-05 2017-01-05
JP2017-000033 2017-01-05

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US29/703,828 Division USD875058S1 (en) 2017-01-05 2019-08-29 Power semiconductor module

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US29/609,637 Active USD864132S1 (en) 2017-01-05 2017-07-03 Power semiconductor module
US29/703,828 Active USD875058S1 (en) 2017-01-05 2019-08-29 Power semiconductor module

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD883241S1 (en) * 2018-06-04 2020-05-05 Semikron Elektronik Gmbh & Co. Kg Power module
USD889423S1 (en) * 2018-12-03 2020-07-07 Semikron Elektronik Gmbh & Co. Kg Power module
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD925448S1 (en) * 2018-06-04 2021-07-20 Semikron Elektronik Gmbh & Co. Kg Powercore module
USD927437S1 (en) 2019-08-29 2021-08-10 Rohm Co., Ltd. Power semiconductor module
USD934190S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934189S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934188S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD934822S1 (en) 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD942404S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD942405S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1651622S (en) * 2019-07-17 2020-01-27

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JP4492454B2 (en) * 2005-06-20 2010-06-30 富士電機システムズ株式会社 Power semiconductor module
JP1585831S (en) * 2017-01-05 2017-09-11
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD892754S1 (en) * 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD925448S1 (en) * 2018-06-04 2021-07-20 Semikron Elektronik Gmbh & Co. Kg Powercore module
USD883241S1 (en) * 2018-06-04 2020-05-05 Semikron Elektronik Gmbh & Co. Kg Power module
USD889423S1 (en) * 2018-12-03 2020-07-07 Semikron Elektronik Gmbh & Co. Kg Power module
USD942404S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD942405S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD934190S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934188S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD934822S1 (en) 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934189S1 (en) 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD927437S1 (en) 2019-08-29 2021-08-10 Rohm Co., Ltd. Power semiconductor module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module

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