USD774473S1 - Heat sink module - Google Patents

Heat sink module Download PDF

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Publication number
USD774473S1
USD774473S1 US29/531,714 US201529531714F USD774473S US D774473 S1 USD774473 S1 US D774473S1 US 201529531714 F US201529531714 F US 201529531714F US D774473 S USD774473 S US D774473S
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United States
Prior art keywords
heat sink
sink module
module
view
ornamental design
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Active
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US29/531,714
Inventor
Brett A. Lindeman
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eBullient LLC
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eBullient LLC
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Priority to US29/531,714 priority Critical patent/USD774473S1/en
Assigned to EBULLIENT, LLC reassignment EBULLIENT, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LINDEMAN, BRETT A.
Assigned to EBULLIENT, INC. reassignment EBULLIENT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EBULLIENT, LLC
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FIG. 1 is top perspective view of a heat sink module;
FIG. 2 is a bottom perspective view of the heat sink module of FIG. 1;
FIG. 3 is a top view of the heat sink module of FIG. 1;
FIG. 4 is a bottom view of the heat sink module of FIG. 1;
FIG. 5 is a front view of the heat sink module of FIG. 1;
FIG. 6 is a rear view of the heat sink module of FIG. 1;
FIG. 7 is a left side view of the heat sink module of FIG. 1; and,
FIG. 8 is a right side view of the heat sink module of FIG. 1.
The broken lines shown in the drawings illustrate portions of the heat sink module and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink module, as shown and described.
US29/531,714 2015-05-28 2015-06-29 Heat sink module Active USD774473S1 (en)

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US29/531,714 USD774473S1 (en) 2015-05-28 2015-06-29 Heat sink module

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US29/528,319 USD774472S1 (en) 2015-05-28 2015-05-28 Heat sink module
US29/531,714 USD774473S1 (en) 2015-05-28 2015-06-29 Heat sink module

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US29/528,319 Continuation USD774472S1 (en) 2015-05-28 2015-05-28 Heat sink module

Publications (1)

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USD774473S1 true USD774473S1 (en) 2016-12-20

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US29/528,319 Active USD774472S1 (en) 2015-05-28 2015-05-28 Heat sink module
US29/531,714 Active USD774473S1 (en) 2015-05-28 2015-06-29 Heat sink module

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US29/528,319 Active USD774472S1 (en) 2015-05-28 2015-05-28 Heat sink module

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
USD873396S1 (en) * 2016-04-06 2020-01-21 Showa Denko K.K. Cooler
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules

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US20020117291A1 (en) * 2000-05-25 2002-08-29 Kioan Cheon Computer having cooling apparatus and heat exchanging device of the cooling apparatus
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USD553170S1 (en) * 2007-02-09 2007-10-16 Amulaire Thermal Technology, Inc Cold plate heat sink
USD553656S1 (en) * 2007-02-09 2007-10-23 Amulaire Thermal Technology, Inc. Cold plate heat sink
USD582359S1 (en) * 2008-01-07 2008-12-09 Cooler Master Co., Ltd. Heat dissipator
US20090120621A1 (en) * 2005-07-15 2009-05-14 Pulsacool Ltd. Method and apparatus for cooling electronic or other devices
US20110155353A1 (en) * 2009-12-30 2011-06-30 Man Zai Industrial Co., Ltd. Liquid cooling device
US20120182690A1 (en) * 2011-01-13 2012-07-19 Hon Hai Precision Industry Co., Ltd. Electronic device with cooler
US20140030900A1 (en) * 2012-07-27 2014-01-30 Kevin B. Leigh Component cooling
US8644021B2 (en) * 2011-11-25 2014-02-04 Inventec Corporation Cooling module
US20140069614A1 (en) * 2012-09-13 2014-03-13 Asia Vital Components Co., Ltd. Heat dissipaion device and thermal module using same
US20140131007A1 (en) * 2012-11-14 2014-05-15 Coolit Systems, Inc. Mounting system for fluid heat exchange systems
USD715747S1 (en) * 2013-09-06 2014-10-21 Mitsubishi Electric Corporation Cooling jacket
US20140311176A1 (en) * 2013-04-19 2014-10-23 Microthermal Technology Corp. Phase transfer heat dissipating device and phase transfer heat dissipating system
USD722576S1 (en) * 2013-07-12 2015-02-17 Liebherr-Elektronik Gmbh Housing for electronic modules with cooling fins
US20150124404A1 (en) * 2013-11-06 2015-05-07 Cisco Technology, Inc. System and apparatus for network device heat management
US20150138722A1 (en) * 2013-11-21 2015-05-21 International Business Machines Corporation Closed loop liquid cooling system for electronic packages
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
US20160128238A1 (en) * 2014-10-27 2016-05-05 Ebullient, Llc Hot-swappable server with cooling line assembly

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD357900S (en) * 1993-04-01 1995-05-02 Fujitsu Limited Combined heat sink and fan
USD404720S (en) * 1997-02-06 1999-01-26 Charles Gayle Heat sink and mounting plate for integrated circuits
US20020117291A1 (en) * 2000-05-25 2002-08-29 Kioan Cheon Computer having cooling apparatus and heat exchanging device of the cooling apparatus
USD494549S1 (en) * 2003-04-14 2004-08-17 Zalman Tech Co., Ltd. Supporting block of VGA chipset cooling device
US20060162340A1 (en) * 2005-01-27 2006-07-27 Iter Networking Corporation Chip-based CPU cooler and cooling method thereof
US20090120621A1 (en) * 2005-07-15 2009-05-14 Pulsacool Ltd. Method and apparatus for cooling electronic or other devices
US20070058342A1 (en) * 2005-09-12 2007-03-15 Foxconn Technology Co., Ltd. Heat dissipation device
USD553170S1 (en) * 2007-02-09 2007-10-16 Amulaire Thermal Technology, Inc Cold plate heat sink
USD553656S1 (en) * 2007-02-09 2007-10-23 Amulaire Thermal Technology, Inc. Cold plate heat sink
USD582359S1 (en) * 2008-01-07 2008-12-09 Cooler Master Co., Ltd. Heat dissipator
US20110155353A1 (en) * 2009-12-30 2011-06-30 Man Zai Industrial Co., Ltd. Liquid cooling device
US20120182690A1 (en) * 2011-01-13 2012-07-19 Hon Hai Precision Industry Co., Ltd. Electronic device with cooler
US8644021B2 (en) * 2011-11-25 2014-02-04 Inventec Corporation Cooling module
US20140030900A1 (en) * 2012-07-27 2014-01-30 Kevin B. Leigh Component cooling
US20140069614A1 (en) * 2012-09-13 2014-03-13 Asia Vital Components Co., Ltd. Heat dissipaion device and thermal module using same
US20140131007A1 (en) * 2012-11-14 2014-05-15 Coolit Systems, Inc. Mounting system for fluid heat exchange systems
US20140311176A1 (en) * 2013-04-19 2014-10-23 Microthermal Technology Corp. Phase transfer heat dissipating device and phase transfer heat dissipating system
USD722576S1 (en) * 2013-07-12 2015-02-17 Liebherr-Elektronik Gmbh Housing for electronic modules with cooling fins
USD715747S1 (en) * 2013-09-06 2014-10-21 Mitsubishi Electric Corporation Cooling jacket
US20150124404A1 (en) * 2013-11-06 2015-05-07 Cisco Technology, Inc. System and apparatus for network device heat management
US20150138722A1 (en) * 2013-11-21 2015-05-21 International Business Machines Corporation Closed loop liquid cooling system for electronic packages
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
US20160128238A1 (en) * 2014-10-27 2016-05-05 Ebullient, Llc Hot-swappable server with cooling line assembly

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* Cited by examiner, † Cited by third party
Title
Amazon, "Nhowe SC-VG46 VGA GPU Water Cooling Block . . . ", Accessed May 27, 2016, First sold on Nov. 7, 2015, (https://www.amazon.com/Nhowe-SC-VG46-Cooling-Support-version/dp/B017P09W9C?ie=UTF8&keywords=Aluminum%20Water%Block&qid=1464369241&ref-=sr-1-87&s=pc&sr=1-87). *
Linus Tech Tips, "EK Introduces Annihilator Series 1U CPU Water Block for server and workstation type motherboards", Accessed May 27, 2016, Posted May 15, 2015. (https://linustechtips.com/main/topic/367045-ek-introduces-annihilator-series-1u-cpu-water-block-for-server-and-workstation-type-motherboards/). *
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UK420 Forum, "My DIY Led panel" Topic, post #32, Accessed May 27, 2016, Posted Nov. 5, 2014, (http://www.uk420.com/boards/index.php?showtopic=349820&page=3). *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD829673S1 (en) * 2016-02-22 2018-10-02 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD873396S1 (en) * 2016-04-06 2020-01-21 Showa Denko K.K. Cooler
USD886967S1 (en) 2016-04-06 2020-06-09 Showa Denko K.K. Cooler
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules

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