US20140311176A1 - Phase transfer heat dissipating device and phase transfer heat dissipating system - Google Patents

Phase transfer heat dissipating device and phase transfer heat dissipating system Download PDF

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Publication number
US20140311176A1
US20140311176A1 US14/023,989 US201314023989A US2014311176A1 US 20140311176 A1 US20140311176 A1 US 20140311176A1 US 201314023989 A US201314023989 A US 201314023989A US 2014311176 A1 US2014311176 A1 US 2014311176A1
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US
United States
Prior art keywords
transmission tube
heat dissipating
phase transfer
connecting portion
transfer heat
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Abandoned
Application number
US14/023,989
Inventor
Hsien-Chun Meng
Chih-Chiang Ku
Che-Wei Liao
Wen-Kai Tsai
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MICROTHERMAL TECHNOLOGY CORP
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MICROTHERMAL TECHNOLOGY CORP
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Assigned to MICROTHERMAL TECHNOLOGY CORP. reassignment MICROTHERMAL TECHNOLOGY CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KU, CHIH-CHIANG, LIAO, CHE-WEI, Meng, Hsien-Chun, TSAI, WEN-KAI
Publication of US20140311176A1 publication Critical patent/US20140311176A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D7/00—Devices using evaporation effects without recovery of the vapour
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28B—STEAM OR VAPOUR CONDENSERS
    • F28B9/00—Auxiliary systems, arrangements, or devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/0246—Arrangements for connecting header boxes with flow lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/028—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using inserts for modifying the pattern of flow inside the header box, e.g. by using flow restrictors or permeable bodies or blocks with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dissipating device, and particularly relates to a volumetric phase transfer heat dissipating device.
  • the heat flux per unit area (W/cm 2 ) of conventional heat dissipating systems for active electronic components fails to meet the heat dissipation requirements of high efficiency electronic components.
  • U.S. Pat. No. 7,082,778 B2 patent discloses a spray cooling module functioned similar to the inkjet.
  • heating electrode plates are cooperated with the surface tension of the working liquid to generate bubbles, so that the working liquid is squeezed to form moistures in the spraying chamber, and the moisture is then thermally contacted with the electronic components so as to vaporize them, absorbing heat from the electronic components, and thus cooling them.
  • the structure of the spray cooling module is too complicated to manufacture easily; additionally, since the electrode plates must be heated, when the working liquid is flowing to the electrode plates, the temperature of the working liquid increases, reducing heat dissipating efficiency. Therefore, it is necessary to develop another cooling system having high heat dissipating efficiency.
  • the present invention proposes a volumetric phase transfer heat dissipating device which can atomize the working fluid efficiently, so as to vaporize the working fluid.
  • the present invention has advantages such as a simplified structure, high heat dissipating performance, etc.
  • One invention concept of the present invention proposes a volumetric phase transfer heat dissipating device, including a base, a cap and an atomizing member.
  • the base includes a plurality of conducting members.
  • the cap is engaged with the base so as to form a chamber with the base.
  • the conducting members are disposed in the chamber and are extended toward the cap.
  • the cap includes an inlet connecting portion for being connected to a fluid transmission tube and includes an outlet connecting portion for being connected to a vapor transmission tube.
  • the atomizing member is sleeved to the inlet connecting portion and is disposed between the fluid transmission tube and the chamber.
  • a working fluid in the fluid transmission tube flows into the chamber via the atomizing member and forms liquid on inner walls of the chamber and outer walls of the conducting members, and the liquid is vaporized after absorbing heat and flowing out via the vapor transmission tube.
  • the condenser includes a condenser body, a fluid transmission tube and a vapor transmission tube. One end of the fluid transmission tube and one end of the vapor transmission tube are connected to the condenser body.
  • the fluid transmission tube is connected to the inlet connecting portion of the volumetric phase transfer heat dissipating device.
  • the vapor transmission tube is connected to the outlet connecting portion of the volumetric phase transfer heat dissipating device.
  • the working fluid in the fluid transmission tube is flowing into the chamber via the atomizing member and forms liquid on the inner walls of the chamber. The liquid is vaporized after absorbing heat and flows to the condenser body via the vapor transmission tube.
  • the atomizing member is disposed in the inlet connecting portion of the cap, so that the working fluid is flowing into the chamber to form the liquid. Further, the liquid is disposed on the inner walls of the chamber and the outer walls of the conducting members and provided for heat absorption.
  • the conducting members are disposed in the chamber so as to increase the contact area between the conducting members and the liquid to enhance the heat dissipating performance.
  • FIG. 1 is a constructional schematic view of a volumetric phase transfer heat dissipating system of a first embodiment of the present invention
  • FIG. 2 is a perspective view of the volumetric phase transfer heat dissipating system of the first embodiment of the present invention
  • FIG. 3 is a partial exploded view of the phase transfer heat dissipating system of the first embodiment of the present invention
  • FIG. 4 is a partial lateral view of the volumetric phase transfer heat dissipating system of the first embodiment of the present invention.
  • FIG. 5 is a partial enlarged view of the volumetric phase transfer heat dissipating system of the first embodiment of the present invention.
  • FIGS. 1-5 are a constructional schematic view, a perspective view, a partial exploded view, a partial lateral view and a partial enlarged view of the volumetric phase transfer heat dissipating system of a first embodiment of the present invention respectively.
  • the volumetric phase transfer heat dissipating system of the first embodiment of the present invention includes a volumetric phase transfer heat dissipating device 1 and a condenser 5 .
  • the volumetric phase transfer heat dissipating device 1 is connected to the condenser 5 for operation.
  • the condenser 5 includes a condenser body 51 , a fluid transmission tube 53 and a vapor transmission tube 54 .
  • One end of the fluid transmission tube 53 and one end of the vapor transmission tube 54 are connected to the condenser body 51 .
  • the phase transfer heat dissipating device 1 includes a base 11 , a cap 12 and an atomizing member 15 .
  • the base 11 has a base body 111 which is approximately formed as a polygonal plate. One side of the base body 111 is contacted with a heat source 8 (for example: a LED chip or a CPU). A plurality of conducting members 112 is disposed on a central region of the other side of the base body 111 . A first combining portion 113 formed as stair shaped is disposed on a periphery of the base body 111 .
  • the shape of the base body 111 and the shape of the first combining portion 113 described above are only examples, but embodiments of the present invention are not limited thereto.
  • the conducting members 112 are formed as rod-shaped structures, but embodiments of the present invention are not limited thereto.
  • the conducting members 112 are formed as groove-shaped structures or other non-planar surface shaped structures which can increase the surface area of the base 11 so as to increase the heat exchange area and enhance the condensing performance.
  • the cap 12 has a cap body 121 which is approximately formed as a polygonal plate.
  • the cap body 121 has a supporting wall 122 extended from a periphery thereof.
  • An end portion of the supporting wall 122 has a second combining portion 123 .
  • the shape of the second combining portion 123 corresponds to the shape of the first combining portion 113 , so that the second combining portion 123 is engaged with the first combining portion 113 and the base 11 is combined with the cap 12 so as to form a chamber 10 .
  • the base 11 and the cap 12 are capable of forming a hollow structure, the structures of the base 11 and the cap 12 described above are only examples, the present invention is not limited thereto.
  • the conducting members 112 are rod structures, the conducting members 112 are disposed in the chamber 10 and extended toward the cap 12 .
  • the cap 12 has an inlet connecting portion 124 and an outlet connecting portion 125 .
  • the fluid transmission tube 53 is connected to the inlet connecting portion 124 and the vapor transmission tube 54 is connected to the outlet connecting portion 125 , so that the working fluid 6 in the fluid transmission tube 53 is capable of flowing into the chamber 10 , and the vapor of the working fluid 6 in the chamber 10 is capable of flowing out via the vapor transmission tube 54 .
  • the inlet connecting portion 124 has an inlet threading portion 1241 for threading with the fluid transmission tube 53
  • the outlet connecting portion 125 has an outlet threading portion 1251 for threading with the vapor transmission tube 54 .
  • the chamber 10 gradually expands from one end thereof which is adjacent to the inlet connecting portion 124 toward the other end thereof which is adjacent to the outlet connecting portion 125 ; namely, the upper wall of the chamber 10 is inclined, resulting in that the chamber 10 gradually expands from one end thereof which is adjacent to the inlet connecting portion 124 toward the other end thereof which is adjacent to the outlet connecting portion 125 .
  • the conducting members 112 are disposed corresponding to the cap body 121 but are not directly disposed toward the inlet connecting portion 124 and the outlet connecting portion 125 . That is to say, the conducting members 112 correspond to regions between the inlet connecting portion 124 and the outlet connecting portion 125 .
  • the atomizing member 15 is plate structure and is disposed in the inlet connecting portion 124 .
  • the atomizing member 15 has a main body 151 and a plurality of micro-pores 152 .
  • the micro-pores 152 are disposed on the main body 151 , so that the working fluid 6 in the fluid transmission tube 53 is atomized via the atomizing member 15 so as to enhance the heat dissipating performance.
  • the pore diameters of the micro-pores 152 are defined between 5 micrometers to 1000 micrometers, preferably defined between 20 micrometers to 300 micrometers. Further, the distance between any two neighboring micro-pores 152 is defined between 5 micrometers to 2000 micrometers.
  • the inlet connecting portion 124 has a sleeving unit 127 assembled thereon and provided for sleeving the atomizing member 15 .
  • the sleeving unit 127 further includes an upper sleeving member 1271 and a lower sleeving member 1272 .
  • the upper sleeving member 1271 and the lower sleeving member 1272 are hollow shaped, and the atomizing member 15 is disposed between the upper sleeving member 1271 and the lower sleeving member 1272 .
  • the upper sleeving member 1271 is attached to the cap body 121 , and the atomizing member 15 is sandwiched between the upper sleeving member 1271 and the lower sleeving member 1272 ; in addition, the lower sleeving member 1272 is fastened on the cap body 121 via a plurality of fastening members 1273 .
  • the atomizing member 15 is disposed in the inlet connecting portion 124 and attached to one end of the fluid transmission tube 53 , so that the working fluid 6 in the fluid transmission tube 53 is atomized via the atomizing member 15 .
  • the manufacturing method of the atomizing member 15 includes following steps. At first, by physical vapor deposition, chemical vapor deposition or other technologies like LIGA (Lithographie GalVanoformung Abformung), a deposited metal layer is formed on the surface of a substrate in which the substrate is made of glass or silicon. Next, a photo resist layer is formed by spin coating method or by immersion method; in this way the photo resist layer is exposed through a mask by photolithography, and is developed to remove the photo resist layer under the unexposed region so as to reveal the ready-to-remove deposited metal layer.
  • LIGA Lithographie GalVanoformung Abformung
  • the deposited metal layer which is not protected by the photo resist layer is removed by etching, and the remainder of the photo resist layer is removed; at this time, the deposited metal layer with a plurality of through holes is formed on the surface of the substrate, the through holes are substantially the predetermined holes of the micro-pores 152 of the atomizing member 15 , and the diameter of the through holes is larger than that of the micro-pores 152 .
  • an electrocasting metal layer is formed on the surface of the deposited metal layer by electrocasting method. Finally, a demoulding process is applied, so that the electrocasting metal layer is separated from the deposited metal layer and the substrate so as to form the atomizing member 15 .
  • the working fluid 6 in the fluid transmission tube 53 is flowing to the atomizing member 15 and forms a plurality of tiny liquid drops or moistures.
  • the tiny liquid drops or moistures become liquid which is disposed on the inner walls of the chamber 10 and the outer walls of the conducting members 112 , and because of absorbing the heat from the heat source 8 , the liquid is vaporized and converted to vapors which are flowing to the condenser body 51 via the vapor transmission tube 54 .
  • the vapors are condensed in the condenser body 51 so as to form the working fluid 6
  • the working fluid 6 is flows again into the atomizing member 15 via the fluid transmission tube 53 and further flows into the chamber 10 .
  • a circulating system is formed without pumps or other driving devices. Additionally, since the chamber 10 gradually expands from one end thereof which is adjacent to the inlet connecting portion 124 toward the other end thereof which is adjacent to the outlet connecting portion 125 , the atomized working fluid and the vapors are prone to flow toward the outlet connecting portion 125 .
  • the atomizing member 15 is disposed in the inlet connecting portion 124 of the cap 12 , so that the working fluid 6 is flowing into the chamber 10 to form the liquid. Further, the liquid is disposed on the inner walls of the chamber 10 and the outer walls of the conducting members 112 for heat absorption.
  • the conducting members 112 are disposed in the chamber 10 so as to increase the contact area between the conducting members 112 and the liquid to enhance the heat dissipating performance. Additionally, without applying pumps or other driving devices, the present invention provides an automatically circulated condensing system which has advantages such as a simplified structure, high heat dissipating performance, etc.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A volumetric phase transfer heat dissipating system includes a base, a cap and an atomizing member. The base includes a plurality of conducting members. The cap is engaged with the base to form a chamber. The conducting members are disposed in the chamber and extended toward the cap. The cap includes an inlet connecting portion for being connected to a fluid transmission tube and includes an outlet connecting portion for being connected to a vapor transmission tube. The atomizing member is sleeved to the inlet connecting portion and disposed between the fluid transmission tube and the chamber. A working fluid in the fluid transmission tube flows into the chamber via the atomizing member and forms liquid on inner walls of the chamber and outer walls of the conducting members, and the liquid is vaporized after absorbing heat and flows out via the vapor transmission tube.

Description

    CROSS-REFERENCES TO RELATED APPLICATIONS
  • This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No. 102114026 filed in Taiwan, R.O.C. on 2013/04/19, the entire contents of which are hereby incorporated by reference.
    • BACKGROUND
  • 1. Technical Field
  • The present invention relates to a heat dissipating device, and particularly relates to a volumetric phase transfer heat dissipating device.
  • 2. Related Art
  • In general, the heat flux per unit area (W/cm2) of conventional heat dissipating systems for active electronic components, such as a fan with cooling fins or a fan with cooling fins and heat pipes, fails to meet the heat dissipation requirements of high efficiency electronic components.
  • In order to meet the heat dissipation requirements of high efficiency electronic components, in recent years, technologies for cooling electronic components using the phase transfer principle have been developed. For example, U.S. Pat. No. 7,082,778 B2 patent discloses a spray cooling module functioned similar to the inkjet. In the spray cooling module, heating electrode plates are cooperated with the surface tension of the working liquid to generate bubbles, so that the working liquid is squeezed to form moistures in the spraying chamber, and the moisture is then thermally contacted with the electronic components so as to vaporize them, absorbing heat from the electronic components, and thus cooling them. However, the structure of the spray cooling module is too complicated to manufacture easily; additionally, since the electrode plates must be heated, when the working liquid is flowing to the electrode plates, the temperature of the working liquid increases, reducing heat dissipating efficiency. Therefore, it is necessary to develop another cooling system having high heat dissipating efficiency.
    • SUMMARY
  • In view of this, the present invention proposes a volumetric phase transfer heat dissipating device which can atomize the working fluid efficiently, so as to vaporize the working fluid. The present invention has advantages such as a simplified structure, high heat dissipating performance, etc.
  • One invention concept of the present invention proposes a volumetric phase transfer heat dissipating device, including a base, a cap and an atomizing member. The base includes a plurality of conducting members. The cap is engaged with the base so as to form a chamber with the base. The conducting members are disposed in the chamber and are extended toward the cap. The cap includes an inlet connecting portion for being connected to a fluid transmission tube and includes an outlet connecting portion for being connected to a vapor transmission tube. The atomizing member is sleeved to the inlet connecting portion and is disposed between the fluid transmission tube and the chamber. A working fluid in the fluid transmission tube flows into the chamber via the atomizing member and forms liquid on inner walls of the chamber and outer walls of the conducting members, and the liquid is vaporized after absorbing heat and flowing out via the vapor transmission tube.
  • One invention concept of the present invention proposes a volumetric phase transfer heat dissipating system, including a condenser and a volumetric phase transfer heat dissipating device as mentioned above. The condenser includes a condenser body, a fluid transmission tube and a vapor transmission tube. One end of the fluid transmission tube and one end of the vapor transmission tube are connected to the condenser body. The fluid transmission tube is connected to the inlet connecting portion of the volumetric phase transfer heat dissipating device. The vapor transmission tube is connected to the outlet connecting portion of the volumetric phase transfer heat dissipating device. The working fluid in the fluid transmission tube is flowing into the chamber via the atomizing member and forms liquid on the inner walls of the chamber. The liquid is vaporized after absorbing heat and flows to the condenser body via the vapor transmission tube.
  • According to the present invention, the atomizing member is disposed in the inlet connecting portion of the cap, so that the working fluid is flowing into the chamber to form the liquid. Further, the liquid is disposed on the inner walls of the chamber and the outer walls of the conducting members and provided for heat absorption. The conducting members are disposed in the chamber so as to increase the contact area between the conducting members and the liquid to enhance the heat dissipating performance.
  • The detailed features and advantages of the present invention are described below in great detail through the following embodiments, the content of the detailed description is sufficient for those skilled in the art to understand the technical content of the present invention and to implement the present invention there accordingly. Based on the content of the specification, the claims, and the drawings, those skilled in the art can easily understand the relevant objectives and advantages of the present invention.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention will become more fully understood from the detailed description given herein below for illustration only, and thus not limitative of the present invention, wherein:
  • FIG. 1 is a constructional schematic view of a volumetric phase transfer heat dissipating system of a first embodiment of the present invention;
  • FIG. 2 is a perspective view of the volumetric phase transfer heat dissipating system of the first embodiment of the present invention;
  • FIG. 3 is a partial exploded view of the phase transfer heat dissipating system of the first embodiment of the present invention;
  • FIG. 4 is a partial lateral view of the volumetric phase transfer heat dissipating system of the first embodiment of the present invention; and
  • FIG. 5 is a partial enlarged view of the volumetric phase transfer heat dissipating system of the first embodiment of the present invention.
    •  DETAILED DESCRIPTION
  • FIGS. 1-5 are a constructional schematic view, a perspective view, a partial exploded view, a partial lateral view and a partial enlarged view of the volumetric phase transfer heat dissipating system of a first embodiment of the present invention respectively.
  • The volumetric phase transfer heat dissipating system of the first embodiment of the present invention includes a volumetric phase transfer heat dissipating device 1 and a condenser 5. In this embodiment, the volumetric phase transfer heat dissipating device 1 is connected to the condenser 5 for operation. The condenser 5 includes a condenser body 51, a fluid transmission tube 53 and a vapor transmission tube 54. One end of the fluid transmission tube 53 and one end of the vapor transmission tube 54 are connected to the condenser body 51.
  • The phase transfer heat dissipating device 1 includes a base 11, a cap 12 and an atomizing member 15.
  • The base 11 has a base body 111 which is approximately formed as a polygonal plate. One side of the base body 111 is contacted with a heat source 8 (for example: a LED chip or a CPU). A plurality of conducting members 112 is disposed on a central region of the other side of the base body 111. A first combining portion 113 formed as stair shaped is disposed on a periphery of the base body 111. Here, the shape of the base body 111 and the shape of the first combining portion 113 described above are only examples, but embodiments of the present invention are not limited thereto. In addition, in this embodiment, the conducting members 112 are formed as rod-shaped structures, but embodiments of the present invention are not limited thereto. In some embodiments, the conducting members 112 are formed as groove-shaped structures or other non-planar surface shaped structures which can increase the surface area of the base 11 so as to increase the heat exchange area and enhance the condensing performance.
  • The cap 12 has a cap body 121 which is approximately formed as a polygonal plate. The cap body 121 has a supporting wall 122 extended from a periphery thereof. An end portion of the supporting wall 122 has a second combining portion 123. The shape of the second combining portion 123 corresponds to the shape of the first combining portion 113, so that the second combining portion 123 is engaged with the first combining portion 113 and the base 11 is combined with the cap 12 so as to form a chamber 10. In this embodiment, what is required is that the base 11 and the cap 12 are capable of forming a hollow structure, the structures of the base 11 and the cap 12 described above are only examples, the present invention is not limited thereto. When the conducting members 112 are rod structures, the conducting members 112 are disposed in the chamber 10 and extended toward the cap 12.
  • Here, the cap 12 has an inlet connecting portion 124 and an outlet connecting portion 125. The fluid transmission tube 53 is connected to the inlet connecting portion 124 and the vapor transmission tube 54 is connected to the outlet connecting portion 125, so that the working fluid 6 in the fluid transmission tube 53 is capable of flowing into the chamber 10, and the vapor of the working fluid 6 in the chamber 10 is capable of flowing out via the vapor transmission tube 54. Further, the inlet connecting portion 124 has an inlet threading portion 1241 for threading with the fluid transmission tube 53, and the outlet connecting portion 125 has an outlet threading portion 1251 for threading with the vapor transmission tube 54. In this embodiment, the chamber 10 gradually expands from one end thereof which is adjacent to the inlet connecting portion 124 toward the other end thereof which is adjacent to the outlet connecting portion 125; namely, the upper wall of the chamber 10 is inclined, resulting in that the chamber 10 gradually expands from one end thereof which is adjacent to the inlet connecting portion 124 toward the other end thereof which is adjacent to the outlet connecting portion 125.
  • Additionally, the conducting members 112 are disposed corresponding to the cap body 121 but are not directly disposed toward the inlet connecting portion 124 and the outlet connecting portion 125. That is to say, the conducting members 112 correspond to regions between the inlet connecting portion 124 and the outlet connecting portion 125.
  • The atomizing member 15 is plate structure and is disposed in the inlet connecting portion 124. The atomizing member 15 has a main body 151 and a plurality of micro-pores 152. The micro-pores 152 are disposed on the main body 151, so that the working fluid 6 in the fluid transmission tube 53 is atomized via the atomizing member 15 so as to enhance the heat dissipating performance. Here, the pore diameters of the micro-pores 152 are defined between 5 micrometers to 1000 micrometers, preferably defined between 20 micrometers to 300 micrometers. Further, the distance between any two neighboring micro-pores 152 is defined between 5 micrometers to 2000 micrometers.
  • In this embodiment, the inlet connecting portion 124 has a sleeving unit 127 assembled thereon and provided for sleeving the atomizing member 15. The sleeving unit 127 further includes an upper sleeving member 1271 and a lower sleeving member 1272. The upper sleeving member 1271 and the lower sleeving member 1272 are hollow shaped, and the atomizing member 15 is disposed between the upper sleeving member 1271 and the lower sleeving member 1272. Here, the upper sleeving member 1271 is attached to the cap body 121, and the atomizing member 15 is sandwiched between the upper sleeving member 1271 and the lower sleeving member 1272; in addition, the lower sleeving member 1272 is fastened on the cap body 121 via a plurality of fastening members 1273.
  • In some implementation aspects, the atomizing member 15 is disposed in the inlet connecting portion 124 and attached to one end of the fluid transmission tube 53, so that the working fluid 6 in the fluid transmission tube 53 is atomized via the atomizing member 15.
  • In the present invention, the manufacturing method of the atomizing member 15 includes following steps. At first, by physical vapor deposition, chemical vapor deposition or other technologies like LIGA (Lithographie GalVanoformung Abformung), a deposited metal layer is formed on the surface of a substrate in which the substrate is made of glass or silicon. Next, a photo resist layer is formed by spin coating method or by immersion method; in this way the photo resist layer is exposed through a mask by photolithography, and is developed to remove the photo resist layer under the unexposed region so as to reveal the ready-to-remove deposited metal layer. Subsequently, the deposited metal layer which is not protected by the photo resist layer is removed by etching, and the remainder of the photo resist layer is removed; at this time, the deposited metal layer with a plurality of through holes is formed on the surface of the substrate, the through holes are substantially the predetermined holes of the micro-pores 152 of the atomizing member 15, and the diameter of the through holes is larger than that of the micro-pores 152. Thereafter, an electrocasting metal layer is formed on the surface of the deposited metal layer by electrocasting method. Finally, a demoulding process is applied, so that the electrocasting metal layer is separated from the deposited metal layer and the substrate so as to form the atomizing member 15.
  • Upon operating the present invention, the working fluid 6 in the fluid transmission tube 53 is flowing to the atomizing member 15 and forms a plurality of tiny liquid drops or moistures. After flowing to the chamber 10, the tiny liquid drops or moistures become liquid which is disposed on the inner walls of the chamber 10 and the outer walls of the conducting members 112, and because of absorbing the heat from the heat source 8, the liquid is vaporized and converted to vapors which are flowing to the condenser body 51 via the vapor transmission tube 54. Thereafter, the vapors are condensed in the condenser body 51 so as to form the working fluid 6, and the working fluid 6 is flows again into the atomizing member 15 via the fluid transmission tube 53 and further flows into the chamber 10. Under such conditions, a circulating system is formed without pumps or other driving devices. Additionally, since the chamber 10 gradually expands from one end thereof which is adjacent to the inlet connecting portion 124 toward the other end thereof which is adjacent to the outlet connecting portion 125, the atomized working fluid and the vapors are prone to flow toward the outlet connecting portion 125.
  • In the present invention, the atomizing member 15 is disposed in the inlet connecting portion 124 of the cap 12, so that the working fluid 6 is flowing into the chamber 10 to form the liquid. Further, the liquid is disposed on the inner walls of the chamber 10 and the outer walls of the conducting members 112 for heat absorption. The conducting members 112 are disposed in the chamber 10 so as to increase the contact area between the conducting members 112 and the liquid to enhance the heat dissipating performance. Additionally, without applying pumps or other driving devices, the present invention provides an automatically circulated condensing system which has advantages such as a simplified structure, high heat dissipating performance, etc.
  • While the present invention has been described by the way of example and in terms of the preferred embodiments, it is to be understood that the invention need not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structures.

Claims (15)

What is claimed is:
1. A volumetric phase transfer heat dissipating device, comprising:
a base, comprising a plurality of conducting members;
a cap, engaged with the base so as to form a chamber with the base, the conducting members being disposed in the chamber, the cap comprising an inlet connecting portion for being connected to a fluid transmission tube and comprising an outlet connecting portion for being connected to a vapor transmission tube; and
an atomizing member, being sleeved to the inlet connecting portion and disposed between the fluid transmission tube and the chamber;
wherein a working fluid in the fluid transmission tube flows into the chamber via the atomizing member and liquid is formed on inner walls of the chamber and outer walls of the conducting members, the liquid is vaporized after absorbing heat and flows out via the vapor transmission tube.
2. The volumetric phase transfer heat dissipating device according to claim 1, wherein the base further comprises a first combining portion, and the cap further comprises a second combining portion, the second combining portion is engaged with the first combining portion so as to combine the base with the cap.
3. The volumetric phase transfer heat dissipating device according to claim 1, wherein the chamber gradually expands from one end thereof which is adjacent to the inlet connecting portion toward the other end thereof which is adjacent to the outlet connecting portion.
4. The volumetric phase transfer heat dissipating device according to claim 1, wherein the inlet connecting portion comprises an inlet threading portion for threading with the fluid transmission tube, the outlet connecting portion comprises an outlet threading portion for threading with the vapor transmission tube.
5. The volumetric phase transfer heat dissipating device according to claim 1, wherein the inlet connecting portion comprises a sleeving unit for sleeving the atomizing member.
6. The volumetric phase transfer heat dissipating device according to claim 5, wherein the sleeving unit comprises an upper sleeving member and a lower sleeving member, the atomizing member is disposed between the upper sleeving member and the lower sleeving member.
7. The volumetric phase transfer heat dissipating device according to claim 1, wherein the atomizing member is attached to one end of the fluid transmission tube.
8. The volumetric phase transfer heat dissipating device according to claim 1, wherein the atomizing member comprises a main body and a plurality of micro-pores disposed on the main body.
9. A volumetric phase transfer heat dissipating system, comprising:
a condenser, comprising a condenser body, a fluid transmission tube and a vapor transmission tube, one end of the fluid transmission tube and one end of the vapor transmission tube being connected to the condenser body; and
a volumetric phase transfer heat dissipating device, comprising:
a base, comprising a plurality of conducting members;
a cap, engaged with the base so as to form a chamber with the base, the conducting members being disposed in the chamber, the cap comprising an inlet connecting portion for being connected to the fluid transmission tube and comprising an outlet connecting portion for being connected to the vapor transmission tube; and
an atomizing member, being sleeved to the inlet connecting portion and disposed between the fluid transmission tube and the chamber;
wherein the fluid transmission tube is connected to the inlet connecting portion of the volumetric phase transfer heat dissipating device, the vapor transmission tube is connected to the outlet connecting portion of the volumetric phase transfer heat dissipating device, a working fluid in the fluid transmission tube flows into the chamber via the atomizing member, the liquid is formed on the inner walls of the chamber and outer walls of the conducting members, and the liquid is vaporized after absorbing heat and flows to the condenser body via the vapor transmission tube.
10. The volumetric phase transfer heat dissipating system according to claim 9, wherein the base further comprises a first combining portion, and the cap further comprises a second combining portion, the second combining portion is engaged with the first combining portion so as to combine the base with the cap.
11. The volumetric phase transfer heat dissipating system according to claim 9, wherein the chamber gradually expands from one end thereof which is adjacent to the inlet connecting portion toward the other end thereof which is adjacent to the outlet connecting portion.
12. The volumetric phase transfer heat dissipating system according to claim 9, wherein the inlet connecting portion comprises an inlet threading portion for threading with the fluid transmission tube, the outlet connecting portion comprises an outlet threading portion for threading with the vapor transmission tube.
13. The volumetric phase transfer heat dissipating system according to claim 9, wherein the inlet connecting portion comprises a sleeving unit for sleeving the atomizing member.
14. The volumetric phase transfer heat dissipating system according to claim 13, wherein the sleeving unit comprises an upper sleeving member and a lower sleeving member, the atomizing member is disposed between the upper sleeving member and the lower sleeving member.
15. The volumetric phase transfer heat dissipating system according to claim 9, wherein the atomizing member is attached to one end of the fluid transmission tube.
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD772179S1 (en) * 2015-08-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772178S1 (en) * 2015-09-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
USD772822S1 (en) * 2015-06-11 2016-11-29 Ebullient, Inc. Redundant heat sink module
USD773409S1 (en) * 2015-09-16 2016-12-06 Ebullient, Llc Multi-chamber heat sink module
USD774472S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD812022S1 (en) * 2015-09-12 2018-03-06 Ebullient, Llc Multi-chamber heat sink module
US20200404805A1 (en) * 2019-06-19 2020-12-24 Baidu Usa Llc Enhanced cooling device
US11175102B1 (en) * 2021-04-15 2021-11-16 Chilldyne, Inc. Liquid-cooled cold plate
US11262136B2 (en) 2016-03-31 2022-03-01 Nec Corporation Phase change cooling system and electronic device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI551817B (en) * 2015-06-05 2016-10-01 錦鑫光電股份有限公司 Phase-change heat dissipation device and lamp
CN106481997A (en) * 2016-12-14 2017-03-08 中国人民大学 The ultra high power density LED component that heat conduction with phase change is combined with fan cooling
KR102107746B1 (en) * 2018-05-15 2020-05-07 한국원자력연구원 Heat transferring device with pumping structure
TWI687960B (en) * 2018-11-12 2020-03-11 台灣積體電路製造股份有限公司 Ion implantation apparatus and heat dissipating member thereof
CN114071945A (en) 2020-08-06 2022-02-18 台达电子工业股份有限公司 Liquid cooling conduit
TWI757821B (en) * 2020-08-06 2022-03-11 台達電子工業股份有限公司 Liquid cooling manifold

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5522452A (en) * 1990-10-11 1996-06-04 Nec Corporation Liquid cooling system for LSI packages
US5924482A (en) * 1997-10-29 1999-07-20 Motorola, Inc. Multi-mode, two-phase cooling module
US6108201A (en) * 1999-02-22 2000-08-22 Tilton; Charles L Fluid control apparatus and method for spray cooling
US6457321B1 (en) * 1999-09-13 2002-10-01 Hewlett-Packard Company Spray cooling system
US6498725B2 (en) * 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
US20030131980A1 (en) * 2002-01-16 2003-07-17 General Electric Company Multiple impingement cooled structure
US6888720B2 (en) * 2002-06-18 2005-05-03 Sun Microsystems, Inc. Distributed graphitic foam heat exchanger system
US6889515B2 (en) * 2002-11-12 2005-05-10 Isothermal Systems Research, Inc. Spray cooling system
US7331377B1 (en) * 2004-01-30 2008-02-19 Isothermal Systems Research, Inc. Diamond foam spray cooling system
US8194406B2 (en) * 2009-09-23 2012-06-05 International Business Machines Corporation Apparatus and method with forced coolant vapor movement for facilitating two-phase cooling of an electronic device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002046677A1 (en) * 2000-12-04 2002-06-13 Fujitsu Limited Cooling system and heat absorbing device
US7082778B2 (en) 2001-02-22 2006-08-01 Hewlett-Packard Development Company, L.P. Self-contained spray cooling module
CN1591278A (en) * 2003-09-03 2005-03-09 广达电脑股份有限公司 Phase change heat radiator
JP4128986B2 (en) * 2003-09-04 2008-07-30 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． Free-standing spray cooling module
CN2701074Y (en) * 2004-04-29 2005-05-18 鸿富锦精密工业（深圳）有限公司 Liquid cooling type heat sink
CN1993030A (en) * 2005-12-30 2007-07-04 财团法人工业技术研究院 Compact spray cooling heat exchanger
JP4899997B2 (en) * 2007-03-30 2012-03-21 日本電気株式会社 Thermal siphon boiling cooler
JP5757086B2 (en) * 2008-10-29 2015-07-29 日本電気株式会社 COOLING STRUCTURE, ELECTRONIC DEVICE, AND COOLING METHOD
US7885074B2 (en) * 2009-06-25 2011-02-08 International Business Machines Corporation Direct jet impingement-assisted thermosyphon cooling apparatus and method
CN102157467A (en) * 2010-02-12 2011-08-17 微邦科技股份有限公司 Cooling heat-dissipation system and cooling device thereof
TW201128154A (en) * 2010-02-12 2011-08-16 Micro Base Technology Corp Cooling and heat-dissipation system, and cooling device thereof
JP5519353B2 (en) * 2010-03-19 2014-06-11 株式会社ティラド heatsink
CN102209452B (en) * 2010-03-29 2013-06-26 研能科技股份有限公司 Atomization heat radiation cooling system
JP5720338B2 (en) * 2011-03-17 2015-05-20 富士通株式会社 Loop type heat pipe

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5522452A (en) * 1990-10-11 1996-06-04 Nec Corporation Liquid cooling system for LSI packages
US5924482A (en) * 1997-10-29 1999-07-20 Motorola, Inc. Multi-mode, two-phase cooling module
US6108201A (en) * 1999-02-22 2000-08-22 Tilton; Charles L Fluid control apparatus and method for spray cooling
US6457321B1 (en) * 1999-09-13 2002-10-01 Hewlett-Packard Company Spray cooling system
US6498725B2 (en) * 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
US20030131980A1 (en) * 2002-01-16 2003-07-17 General Electric Company Multiple impingement cooled structure
US6888720B2 (en) * 2002-06-18 2005-05-03 Sun Microsystems, Inc. Distributed graphitic foam heat exchanger system
US6889515B2 (en) * 2002-11-12 2005-05-10 Isothermal Systems Research, Inc. Spray cooling system
US7331377B1 (en) * 2004-01-30 2008-02-19 Isothermal Systems Research, Inc. Diamond foam spray cooling system
US8194406B2 (en) * 2009-09-23 2012-06-05 International Business Machines Corporation Apparatus and method with forced coolant vapor movement for facilitating two-phase cooling of an electronic device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD774472S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD774473S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD772822S1 (en) * 2015-06-11 2016-11-29 Ebullient, Inc. Redundant heat sink module
USD773408S1 (en) * 2015-06-11 2016-12-06 Ebullient, Inc. Redundant heat sink module
USD772179S1 (en) * 2015-08-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
USD812022S1 (en) * 2015-09-12 2018-03-06 Ebullient, Llc Multi-chamber heat sink module
USD773409S1 (en) * 2015-09-16 2016-12-06 Ebullient, Llc Multi-chamber heat sink module
USD772178S1 (en) * 2015-09-26 2016-11-22 Ebullient, Inc. Heat sink module
USD786806S1 (en) * 2015-09-26 2017-05-16 Ebullient, Inc. Heat sink module
US11262136B2 (en) 2016-03-31 2022-03-01 Nec Corporation Phase change cooling system and electronic device
US20200404805A1 (en) * 2019-06-19 2020-12-24 Baidu Usa Llc Enhanced cooling device
US11175102B1 (en) * 2021-04-15 2021-11-16 Chilldyne, Inc. Liquid-cooled cold plate

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JP3196017U (en) 2015-02-19
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CN104111711A (en) 2014-10-22
JP2014212293A (en) 2014-11-13
EP2793259A3 (en) 2015-08-12

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