1314208 '九、發明說明： 【發明所屬之技術領域】 本發明係關於一種液冷裝 卻之微液滴冷卻裝置。 【先前技術】 置，特別是一種以微液滴進行冷1314208 'IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a liquid droplet cooling device for liquid cooling. [Prior Art], especially one that uses micro droplets for cooling
電 了使電 移除。 子a曰片之功率不斷提升，使得其熱功率也不斷上升，為 子晶片保持適當的工作溫度，必須將其產生之熱量迅速 現有針對電腦晶片的冷卻’目前女客柄丨、7 #、人4 # — 1曰刖大多仍以虱冷式散熱器進The electricity is removed. The power of the sub-chip is continuously increased, so that its thermal power is also rising. To maintain the proper operating temperature for the sub-wafer, the heat generated by it must be quickly cooled by the existing computer chip. 'Current female passengers, 7#, people 4 # — 1曰刖 Most of them still use the cooling radiator
仰卻。氣冷式散熱H細域對師走錢，為了提升散熱 功率丄必須加域糾散熱器之散熱表面積、或是以風扇加強 對流氣流之流量與流速。在有限體積下，散熱表面積的增加有 其上限’且過於密集的散熱器表面結構，例如狹窄的散熱鰭片 間隔距離，反而會提升流場阻力，不利於空氣對流。而提升風 扇功率的枝’容#造成噪音及鶴問題。目此較佳的替代方 案既是以液冷裝置對電腦晶片進行冷卻。 液體’例如水等具有高比熱的優點，可迅速透過流動帶走 熱I。若是進-步進油變化’由液態純賴蒸發為氣態， 可發揮更好的冷卻絲。為了使液態之卫作流體有效而迅速的 吸收潛熱蒸發為氣態’最佳的方歧以微麵領於放熱表 面’使液體不需達到沸點就可以迅速蒸發，並避免積存之液體 出現過熱沸騰現象，導致溫度過高。 針對微液滴的形成，有許多以壓電材料提供致動力的微液 6 1314208 •滴喷射裝置被提出，這些微液滴噴射裝置具有體積小且作動迅 速的優點’因此適合整合進體積有限的電子I置冷卻震置中。 . 例如美國專利US6629646號及提出-種微液滴嘴射裝置，其 ； 細壓紐料產生震動，使卫錢體通過喷孔形成微液滴了 • US6629646所使用的工作流體係由儲液艙提供，蒸發後的基Reward. The air-cooled heat-dissipating H-domain is used to save money. In order to improve the heat dissipation, the heat-dissipating surface area of the heat sink must be added, or the flow and flow rate of the convection airflow should be enhanced by the fan. In a finite volume, the increase in the heat dissipating surface area has an upper limit' and an excessively dense heat sink surface structure, such as a narrow fin spacing, which in turn increases the flow field resistance and is not conducive to air convection. The increase in fan power caused a noise and crane problem. A preferred alternative is to cool the computer wafer with a liquid cooling device. Liquids such as water have the advantage of high specific heat and can quickly pass through the flow belt to remove heat I. If the in-step oil change is evaporated from the liquid pure lysate to a gaseous state, a better cooling wire can be exerted. In order to make the liquid servant fluid effectively and quickly absorb the latent heat and evaporate into a gaseous state, the 'optimal square shape, the micro-face is exposed to the exothermic surface', so that the liquid can evaporate quickly without reaching the boiling point, and avoid the boiling of the accumulated liquid. , causing the temperature to be too high. For the formation of micro-droplets, there are many micro-Liquids 6 1314208 that provide actuation force with piezoelectric materials. • Droplet ejection devices have been proposed. These micro-droplet ejection devices have the advantages of small size and rapid actuation'. Therefore, they are suitable for integration into a limited volume. The electronic I is placed in a cooling state. For example, U.S. Patent No. 6,629,646 and the disclosure of a micro-droplet ejection device, wherein the fine pressure material generates vibration, so that the money body forms micro-droplets through the orifices. • The workflow system used by US6629646 is from a liquid storage tank. Provided, evaporated base
' 汽缺乏一個冷凝及回收的循環路徑。因此若直接應用於冷卻"I 則必須不斷補充工作流體，使用上相當不便。 " • 美國專利US6650542號專利案提出-種液冷裝置，係利 ㈣f材料鶴卫傾職環触，錄體㈣麵結構縮 小’以利於整合於體積有限的電子裝置冷卻裝置中。但是 US6650542號僅涉及了液態工作流體的顯熱變化，缺乏^ 化過程’因此散熱功率不佳。 又 美國專利US59432H號專利_提出—種透過工作流體 進订相變化’且讀流體可進行循環流動之冷卻裝置。 • US59432n 被係 體會對⑽流體回路產生正勤，在小躲冷裝置中容: 出現官路播法承受壓力而造成液體茂漏的問題。同時以系浦驅 動工作流體的設計也料進行小型化。·，如何使工作流體 • 可以有效進行據化以讀潛熱，並確保工作流體可循環利 用，成為待解決的問題。 【發明内容】 鑒於以上的問題’本㈣提供—種微錢冷卻裝置 ，係可 1314208 工在嫩取恤咖，並確保 環流置•輸送-順體循 液管及—冷凝容器:二二接-蒸汽管、-第-供 且蒸發容器内部可_==—待降溫之熱源’ 體係填充·她㈣板胁其中工作液 ^上 ㈤槪°又置於瘵發容器中以將墓發容器 祕區及勤腔區，其中區隔板包含有_致糾及一位 ==片中間_噴孔片，加上具_個喷孔。致動 片係用以驅使噴孔片產生震動，力腔區之工作液體通過嗔 郷成微制射4魏，《财輕綠容ϋ之底部， 力精以使工作魏熱源之熱量岐發為蒸汽。冷凝容器之底 部係用以接觸一致冷源，冷凝容器中形成一冷凝區，且冷凝容 器之底部積存部分之工作液體。蒸汽管之—端鱗接於蒸發 區’另-端連接於冷凝容器之冷凝區，用以供蒸汽由塞發容哭 之蒸發區進人冷凝區對致冷源放熱而冷凝驗態之工作流 體。第一供液管之-端係連接於勤腔區，另一端延伸入冷凝 區’亚位於工作液體之液面下，藉以使壓力腔區以負壓經由第 -供液管由冷凝區則工作㈣，達成工作·之循雜動。 η本發明可提供微液滴進行冷卻，透過相變化快速移除熱 篁’亚可供工作液體循環流動，以利工作液體循環利用。於本 發明係以板狀賴提供:^作㈣觀流動之驅動力，有利系統 微型化，工作液體循環流動係以系統管路負壓達成，避免系統 1314208 管路正屢造成管路破裂漏液問題。 以下在貫施方式中詳細敘述本發明之詳細特徵以及優 ·: 點’其内谷足以使任舰習蝴技藝者了解本發明之技術内容 ·- 並_實施’且減#棚書所之内容、ΐ請專利範圍及 圖式，任何熟習相關技藝者可輕易地理解本發明相關之目的及 " 優點。 /以上之關於本發_容之·及以下之實财式之說明 參 係用以示範與解釋本發明之原理，並且提供本發明之專利申請 範圍更進一步之解釋。 【實施方式】 為使對本發明的目的、構造、特徵、及其功能有進—步的 瞭解，茲配合實施例詳細說明如下。 '、 參 請參閱「第！圖」所示，係為本發明第一實施例所揭露之 -種微液滴冷卻裝置觸，其包含有一蒸發容器ΐι〇及— 容器12〇’蒸發容器110及冷凝容器12〇之間以管路連接二 中条發容器110 _以接觸—待降溫之獅Ή，使蒸發/哭 no中液態之ji作液體F蒸發為氣態，透過f路進人冷= 120中冷凝。❿冷凝容器12◦可持續接觸—致冷源c二各器 界冷空氣’使氣態之工作液體F降溫冷凝，再透過=外 回到蒸發容器110。 路輪送 請參閱「第2圖」所示，係為本發明第一實施 意圖。蒸發容器11。及冷凝容H⑼之高度大致二2不 具荨接 14208 觸之熱源Η及致冷源C也大致位於同—平面。蒸發容器ιι〇 内具有-區隔板130,將蒸發容器11〇内部區隔為—蒸發區⑴ 及一麗力腔區Π2，其中蒸發區in係位於蒸發容器ιι〇之下 半部，而壓力腔區112位於蒸發容器11〇之上半部。區隔板 130包含有-致動片131及-位於致動片131中間區域的喷孔 片132,其中喷孔片132上具有複數個喷孔132a，用以供工作 液體F通過形成微顏D，而致㈣131 _以驅動嗔孔片 132產生震動’並擾動位於壓力腔區112之工作液體F，使工 作液體F通射孔132a形成微賴並私蒸發區⑴。其中 致動f m可為壓電材料所製成，接受高頻之脈衝電壓輸入後 產生向頻震動。蒸發區lu係對應於熱源H，m發容哭11〇 之底部係用以接觸熱源Η，微液滴D噴至蒸發容器\1(；之底 部時，吸熱蒸發成蒸汽G進入蒸發區lu中。 之底部可進-步設置-熱體113,介於蒸發區m及熱抑之 間’用以接觸熱源Η。體113可採用熱導係數高於蒸發容器 阻材質衣成以降低条發容器11〇底部與熱源^之間的熱 參閱結合「第2圖」及「第3圖」所示，熱體⑴於墓發 ^11之—側，形成凹凸微結構⑴a，例如凸點、微凹孔、 以增加微液滴D掉落在熱體113上時，工作液體ρ …、、體113之接觸面積，而提升熱交換率。 121巧再參照「弟2圖」所示，冷凝容器120中形成-冷凝區 、凝區121之底部係用以接觸致冷源C，II以降低冷凝 1 Λ 1314208 區121内部之溫度，而使冷凝區121中工作液體蒸汽g冷凝 為液態之工作液體F。冷凝容器120之底部可進一步設置二冷 體122，介於冷凝區121及致冷源c之間，用以接觸致冷源2 冷體122可採用熱導係數高於冷凝容器120之材質製成，以降 低冷凝容器120底部與致冷源C之_熱阻。同時，冷體 於冷凝區m之-側，可形成凸點、微凹孔、韓片等，以增加 冷體122暴露於冷凝區121之面積，而提升熱交換率。'The steam lacks a circulation path for condensation and recovery. Therefore, if it is directly applied to the cooling "I, it is necessary to continuously replenish the working fluid, which is quite inconvenient to use. " • US Patent No. 6,650,542 patent proposes a liquid cooling device, which is a (four)f material, He Wei, and a circular body structure, which facilitates integration into a limited-sized electronic device cooling device. However, US Pat. No. 6,650,542 only deals with the sensible heat change of the liquid working fluid, and lacks the chemical process, so the heat dissipation power is not good. Further, U.S. Patent No. 5,942, 312, the disclosure of which is incorporated herein by reference in its entire entire entire entire entire entire entire entire entire entire entire entire entire entire the • The US59432n is being used by the system to create a working fluid in the (10) fluid circuit. In the small cold storage device, there is a problem that the pressure is caused by the pressure of the official road broadcasting method. At the same time, the design of the working fluid driven by the pump is also expected to be miniaturized. • How to make the working fluid • Can be effectively chemicalized to read latent heat and ensure that the working fluid can be recycled, becoming a problem to be solved. SUMMARY OF THE INVENTION In view of the above problems 'this (four) provides a kind of micro-money cooling device, can be 1314208 work in tender t-shirt coffee, and to ensure that the circulation of the flow-transport-shun-circulation pipe and - condensation container: two or two - Steam tube, - the first - supply and evaporation container inside can be _ = = - the heat source to be cooled 'system filling · her (four) plate flank where the working fluid ^ (5) 槪 ° is placed in the hair container to the tomb container secret area And the diligent cavity area, wherein the zone partition comprises a _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The actuating film is used to drive the orifice to vibrate, and the working fluid in the force chamber passes through the micro-injection 4 Wei, "the bottom of the green light, the force is used to make the heat of the working heat source burst into steam. The bottom of the condensing vessel is adapted to contact a uniform source of cold, a condensing zone is formed in the condensing vessel, and a portion of the working fluid is accumulated at the bottom of the condensing vessel. The end of the steam tube is connected to the evaporation zone, and the other end is connected to the condensation zone of the condensing vessel, and is used for the steam to be condensed from the evaporation zone of the clogging chamber to enter the condensing zone to release the heat from the cooling source and condense the working fluid. . The end of the first liquid supply pipe is connected to the diligent chamber region, and the other end is extended into the condensation zone, which is located under the liquid surface of the working liquid, so that the pressure chamber region is operated by the negative pressure through the first liquid supply pipe from the condensation zone. (4) To achieve the work and the rhythm. η The present invention can provide micro droplets for cooling, and rapidly removes the heat 透过' sub-phase through the phase change to facilitate the circulation of the working liquid to facilitate the recycling of the working liquid. In the present invention, the plate is provided with: (4) the driving force of the flow, and the system is miniaturized, and the working liquid circulation flow is achieved by the system pipeline negative pressure, so as to avoid the pipeline 1315208 pipeline causing the pipeline to rupture and leak. problem. The detailed features of the present invention and the advantages of the present invention are described in detail below. The point is that the inner valley is sufficient for the craftsman to understand the technical contents of the present invention. The scope of the patent and the drawings are intended to be readily understood by those skilled in the art. The above description of the present invention is intended to demonstrate and explain the principles of the present invention and to provide further explanation of the scope of the patent application of the present invention. [Embodiment] In order to further understand the object, structure, features, and functions of the present invention, the following detailed description will be given in conjunction with the embodiments. As shown in the "FIG. Figure", the micro-droplet cooling device disclosed in the first embodiment of the present invention comprises an evaporation container ΐι〇 and a container 12〇' evaporation container 110 and Between the condensing container 12〇, the two middle hair containers 110 are connected by a pipe to contact the lion cub to be cooled, so that the liquid EF in the evaporation/cry no is evaporated into a gaseous state, and the cold is passed through the f road. Condensation. The enthalpy condensing vessel 12 is continuously contacted - the cooling source c and the two chambers are cooled by air. The gaseous working fluid F is cooled and condensed, and then passed through the outer vessel to return to the evaporation vessel 110. The road wheel transmission is shown in Fig. 2, which is the first embodiment of the present invention. The vessel 11 is evaporated. The height of the condensing capacity H(9) is approximately two or two. The heat source Η and the cooling source C are also located substantially in the same plane. The evaporating container has a partition plate 130, and the inner portion of the evaporation container 11 is partitioned into an evaporation zone (1) and a Lili cavity zone ,2, wherein the evaporation zone in is located in the lower half of the evaporation container ιι, and the pressure The cavity region 112 is located above the evaporation container 11〇. The partition plate 130 includes an actuating plate 131 and an orifice sheet 132 located at an intermediate portion of the actuating plate 131. The orifice plate 132 has a plurality of spray holes 132a for the working liquid F to form a microscopic surface D. And (4) 131 _ to drive the boring plate 132 to generate vibration 'and disturb the working fluid F located in the pressure chamber region 112, so that the working fluid F through the hole 132a forms a micro-lying and private evaporation zone (1). The actuating f m can be made of a piezoelectric material, and receives a high frequency pulse voltage input to generate a directional vibration. The evaporation zone lu corresponds to the heat source H, and the bottom of the evaporation zone is used to contact the heat source. The microdroplet D is sprayed to the evaporation vessel\1 (at the bottom, the heat is evaporated into steam G into the evaporation zone lu). The bottom can be step-set - the hot body 113, between the evaporation zone m and the heat is used to contact the heat source. The body 113 can be made of a material having a thermal conductivity higher than that of the evaporation container to reduce the hair container. The heat between the bottom of the 11 与 and the heat source ^ is shown in conjunction with "Fig. 2" and "Fig. 3". The hot body (1) is formed on the side of the tomb, forming a concave-convex microstructure (1)a, such as a bump or a dimple. The hole, in order to increase the contact area of the working liquid ρ ..., the body 113 when the micro-droplet D is dropped on the hot body 113, and increase the heat exchange rate. 121. Referring again to the "different 2 diagram", the condensing container 120 The middle forming-condensing zone and the bottom of the condensing zone 121 are for contacting the refrigerant source C, II to lower the temperature inside the condensing 1 Λ 1314208 zone 121, and condensing the working liquid vapor g in the condensing zone 121 into a liquid working fluid F The bottom of the condensation container 120 may further be provided with a second cold body 122 between the condensation zone 121 and the refrigeration source c. The contact body 2 can be made of a material having a higher thermal conductivity than the condensing vessel 120 to reduce the thermal resistance of the bottom of the condensing vessel 120 and the source C. At the same time, the cold body is in the condensing zone m. On the side, bumps, micro-recessed holes, Korean sheets, and the like may be formed to increase the area in which the cold body 122 is exposed to the condensing area 121, thereby increasing the heat exchange rate.
續请茶閱「第2圖」所示，蒸發容器11〇與冷凝容器⑽ 係以複數個管路連接，以形成迴流迴路。迴流迴路用以將蒸發 區hi產生之蒸汽G傳送至冷凝區121進行冷凝，並將於ς 凝區121冷凝為液態之卫作液體F，贿將工作液體f傳送至 壓力腔區m，使1作液體F通過噴孔片132之噴孔^形 成微液滴D ’滴落至冷凝容器12Q之熱體113，再度吸熱氣化 至蒸發區111巾。蚊瓣包含m通過之管路及供液體通 過=官路，中供蒸汽通過之管路包含—蒸汽管2⑻，用以連 接鍅容器11G之蒸發區m及冷凝容器12Q之冷凝區121 , 使’^區111中的療汽G透過蒸汽管朋進入冷凝區⑵中。 此外，蒸汽管之—義直接物^蒸發容請之壁面以 ^冷凝請。喊汽_之另_賴橫向延伸進入冷凝 谷益m巾’使蒸汽管連接冷凝請之管口位於冷凝區 121之中央而非位於冷凝容器12G之壁面。 菸茶々閱「第2圖」所示’供液態之工作液體F通過之 吕路已3 #供液管21〇及—第二供液管跡第一供液管 1314208 210及第二供液管22〇係用以連接蒸發容器11〇之壓力腔區 112及冷凝容器12〇之冷凝區121，使冷凝區121中的液態工 / 作液體F透過第一供液管210及第二供液管22〇進入壓力腔 區112。第一供液管210及第二供液管220之管口係接近冷凝 r 區121之底部，藉以使第一供液管21〇及第二供液管22〇之管 口位於工作液體F之液面下方。此外，第一供液管21〇及第 一供液管220係為不等長，使得第一供液管21〇及第二供液管 ⑩ 220之管口與蒸發容器11〇之距離也不相等，也就是說，第一 供液管210之管口係較第二供液管220之管口接近蒸發容器 110。以本貫施例為例，第一供液管210之管口係位於蒸發區 - 1U的左半部，而第二供液管220之管口係位於蒸發區^域 之右半部。而蒸汽管200在冷凝容器120之一端的管口，係介 於第一供液管210的管口與第二供液管220的管口之間。 參照「第4圖」所示，當壓力腔區112出現氣泡（工作液 # 體F沒有充滿整個壓力腔區112)，或是工作液體f剛填充於 冷凝容器120中，必須排除壓力腔區112内的氣體。此時排除 氣體的方法係先移動微液滴冷卻裝置100以改變冷凝容界 與蒸發容器110之相對位置，使冷凝容器120與蒸發容器11〇 - 皆為橫向擺設，且冷凝容器120位於蒸發容器Π0之上。此時， . 由於蒸汽管200位於冷凝容器120之管口係介於第一供液管 210的管口與第二供液管220的管口之間，因此蒸汽管2〇〇的 管口高度會高於第二供液管220的管口，並突出於工作液體F 之液面，因此工作液體F不會經過蒸汽管2〇〇進入蒸發容哭 12 1314208 110之蒸發區111。又，第一供液管2i〇之管口係位於工作液 體F之液面下，且第一供液管220之管口係位於工作液體f 之液面上，因此工作液體F經由第一供液管21〇進入蒸發容 器110之壓力腔區112中，逐漸將壓力腔區112填滿，且壓力 腔區112之氣體可由第二供液管22〇排放置冷凝區121中，以 利壓力腔區112的氣體排出，並使工作液體F順利填滿壓力 腔區112。 接著再將微液滴冷卻裝置回覆初始狀態，如「第2圖」所 不，使冷凝容器120與蒸發容器11〇都呈現直立。此時，第一 供液官210及第二供液管220之管口皆位於工作液體F之液 面下方，使氣體不會進入第一供液管21〇及第二供液管22〇。 同日可，於喷孔片132之嘴孔i32a的工作液體f，係可透過表 面張力抵抗重力，使工作液體F不會由噴孔132a下落，且氣 體不會由喷孔132a進人壓力麵112巾，如此便可使壓力腔 區112保持填滿工作液體f的狀態。 參閱「第5A圖」及「第5B圖」所示，為了產生足夠之 表面張力抵抗重力，並避免氣體通過喷孔132a，喷孔132a之 孔徑需配合工作液體F之表面張力侧整，财作為工作液 體F為例，噴孔132a之孔徑必須小於1〇〇微米（“①），其中 又以小於80微米（"m)之孔徑為最佳。此外，喷孔mb係 為錐形孔，由靠近壓力腔區m之—侧朝向蒸魏lu漸縮， 也就是靠近壓力祕m之孔徑大，而靠近蒸發區ηι之孔徑 小，藉以產生方向性流阻，使工作液體F由壓力腔區112流 13 1314208 向条發區111之流阻，小於 m 屢力腔區id雜 11流向之流阻 時，工作液1驅動嘴孔片132產生震動 液滴噴出 :，M力腔區112流向蒸發區111並形成微 、、而不s逆向流動將氣體帶入壓力腔區112。 為了避免工作液體F與喷孔片132的表面出規车, 用，使得p 读面出現毛細作 面，* ★ 文到毛細力吸引溢流到噴孔片132的表For the continuation of the tea, as shown in "Fig. 2", the evaporation vessel 11〇 and the condensing vessel (10) are connected by a plurality of pipes to form a reflux circuit. The return circuit is used to transfer the steam G generated in the evaporation zone hi to the condensing zone 121 for condensation, and condenses the condensed zone 121 into a liquid liquid F, and transfers the working fluid f to the pressure chamber m, so that 1 As the liquid F passes through the orifice of the orifice sheet 132, the micro-droplet D' is dropped onto the hot body 113 of the condensing vessel 12Q, and is again heat-absorbed to the evaporation zone 111. The mosquito valve includes a pipeline through which m passes and a liquid passage through the official road, and the pipeline through which the steam is supplied includes a steam pipe 2 (8) for connecting the evaporation zone m of the helium vessel 11G and the condensation zone 121 of the condensation vessel 12Q, so that ' The treatment gas G in the zone 111 enters the condensation zone (2) through the steam pipe. In addition, the steam pipe - the direct object ^ evaporation allows the wall to condense please. Shouting steam _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Tobacco tea read "Figure 2" as shown in Figure 2, the liquid working fluid F passed through the Lulu has 3 #liquid supply pipe 21〇 and the second liquid supply pipe first supply pipe 1314208 210 and the second liquid supply pipe 22〇 is used to connect the pressure chamber 112 of the evaporation vessel 11 and the condensation zone 121 of the condensation vessel 12〇, so that the liquid/liquid F in the condensation zone 121 passes through the first supply pipe 210 and the second supply pipe 22〇 enters the pressure chamber region 112. The nozzles of the first liquid supply pipe 210 and the second liquid supply pipe 220 are close to the bottom of the condensation r zone 121, so that the nozzles of the first liquid supply pipe 21 and the second liquid supply pipe 22 are located at the working liquid F. Below the liquid level. In addition, the first liquid supply tube 21 and the first liquid supply tube 220 are not equal in length, so that the distance between the nozzles of the first liquid supply tube 21 and the second liquid supply tube 10 220 and the evaporation container 11 is not Equally, that is, the nozzle of the first liquid supply tube 210 is closer to the evaporation container 110 than the nozzle of the second liquid supply tube 220. Taking the present embodiment as an example, the nozzle of the first liquid supply pipe 210 is located in the left half of the evaporation zone - 1U, and the nozzle of the second liquid supply pipe 220 is located in the right half of the evaporation zone. The nozzle of the steam pipe 200 at one end of the condensing vessel 120 is interposed between the orifice of the first liquid supply pipe 210 and the nozzle of the second liquid supply pipe 220. Referring to "Fig. 4", when a bubble occurs in the pressure chamber region 112 (the working fluid # body F does not fill the entire pressure chamber region 112), or the working fluid f is just filled in the condensing vessel 120, the pressure chamber region 112 must be excluded. The gas inside. At this time, the method of removing the gas first moves the micro-droplet cooling device 100 to change the relative position of the condensation boundary and the evaporation container 110, so that the condensation container 120 and the evaporation container 11 are both disposed laterally, and the condensation container 120 is located in the evaporation container. Above Π0. At this time, since the nozzle of the steam pipe 200 located in the condensing vessel 120 is between the nozzle of the first liquid supply pipe 210 and the nozzle of the second liquid supply pipe 220, the nozzle height of the steam pipe 2〇〇 It will be higher than the nozzle of the second liquid supply pipe 220 and protrude from the liquid surface of the working liquid F, so that the working liquid F does not pass through the steam pipe 2 into the evaporation zone 111 of the evaporation cry 12 1314208 110. Moreover, the nozzle of the first liquid supply tube 2i is located under the liquid surface of the working liquid F, and the nozzle of the first liquid supply tube 220 is located on the liquid surface of the working liquid f, so the working liquid F is supplied via the first The liquid tube 21〇 enters the pressure chamber region 112 of the evaporation vessel 110, and gradually fills the pressure chamber region 112, and the gas in the pressure chamber region 112 can be placed in the condensation chamber 121 by the second liquid supply tube 22 to facilitate the pressure chamber. The gas in the zone 112 is discharged and the working fluid F is smoothly filled in the pressure chamber region 112. Then, the micro-droplet cooling device is returned to the initial state, and as shown in Fig. 2, the condensation container 120 and the evaporation container 11 are both erected. At this time, the nozzles of the first liquid supply member 210 and the second liquid supply tube 220 are located below the liquid surface of the working liquid F so that the gas does not enter the first liquid supply tube 21 and the second liquid supply tube 22. On the same day, the working fluid f of the nozzle hole i32a of the orifice sheet 132 can resist the gravity through the surface tension, so that the working fluid F does not fall from the orifice 132a, and the gas does not enter the pressure surface 112 from the orifice 132a. The towel thus maintains the pressure chamber region 112 in a state of filling the working fluid f. Referring to "5A" and "5B", in order to generate sufficient surface tension to resist gravity and to prevent gas from passing through the orifice 132a, the pore diameter of the orifice 132a needs to match the surface tension of the working fluid F. For example, the working fluid F has a pore size of less than 1 〇〇 micrometer ("1), and preferably has a pore diameter of less than 80 micrometers ("m). Further, the orifice mb is a tapered hole. It is tapered from the side close to the pressure chamber region m toward the steaming Wei, that is, the pore diameter near the pressure secret m is large, and the pore diameter near the evaporation region ηι is small, thereby generating directional flow resistance, so that the working fluid F is from the pressure chamber region. 112 flow 13 1314208 flow resistance to the strip area 111, less than m flow force resistance id 11 flow direction resistance, the working fluid 1 drives the nozzle orifice 132 to produce a shock droplet ejection: the M force chamber region 112 flows to evaporation The zone 111 is formed into a micro, and does not reverse flow, the gas is carried into the pressure chamber region 112. In order to avoid the working fluid F and the surface of the orifice plate 132, the p-reading surface is made to have a capillary surface, * ★ The table to the capillary force to attract the overflow to the orifice sheet 132
斥太^破壞卫作液體F絲面張力，喷孔片出上必須進行 处理’例如塗佈鐵氟龍（Telfon)於喷孔片132上。同時 ^ 了避免已經_在彻^ 132絲缸伽麟續以内聚 力，通過噴孔ma吸附工作液體，喷孔片132朝向蒸發區⑴ 形絲數舰細132b，魏各轨孤且不與喷孔 lia又會’使細在喷孔片132表面的工作液體，持續被吸 附於微溝槽132b中，而無法朗聚力通過噴孔l32a吸附 液體。The repulsion of the liquid F-filament tension is required to be treated, for example, by applying Teflon to the orifice sheet 132. At the same time, ^ has avoided the cohesion of the _ in the wire cylinder, and the working fluid is adsorbed through the orifice ma, the orifice sheet 132 is directed toward the evaporation zone (1), the number of filaments is 132b, and the rails are separate and not associated with the orifice. Lia will again 'move the working liquid finely on the surface of the orifice sheet 132 to be continuously adsorbed in the microgrooves 132b, and it is impossible to absorb the liquid through the orifices l32a.
再參閱「第6A圖」及「第紐圖」，喷孔片m係以膠合 方式固定於致動片132’為了提昇黏著強度，喷孔片132具有 複數個微小孔132c，形成於噴孔片132接觸致動# ΐ3ι之區 域，且致動片131也具有複數個微小孔131a，對應於噴孔片 132之微小孔132c。當黏劑G填充於噴孔片132及致動片131 之介面時，黏劑可填入喷孔片132及致動片ι31微小孔131a、 132c，以增加黏著強度，並免噴孔片132相對於致動片131 產生剪力而導致黏劑G脫落。. 再參閱「第2圖」所示，微液滴冷卻裝置係用以在一熱源 14 1314208 及致冷源C間提供一熱傳路徑，使熱源η產生之熱量迅 速地傳遞至致冷源C，以將控制熱源Η溫度。熱源π可為一 间功率電子晶片’例如一中央處理器（cpu)，致冷源c可為 一與外界進行熱交換之熱交換器，或是直接以外界冷空氣作為 致~源C。瘵發容器11〇係以其底部之熱體丨a接觸熱源η， 而冷凝容1 120細其底狀冷體122翻致冷源（〕。當熱源 Η開始運作，且必須對熱源Η進行致冷以控制溫度時，係對 致動片131通入一高頻脈衝電壓，使致動片131產生高頻震 動。致動片131產生之震動，可使壓力腔區112的工作液體F 被擾動’同時工作液體？於喷孔片132之噴孔132&形成的張 力表面也會被破壞，使工作液體F受到中立吸引通過噴孔 132a，並形成微液滴D進入蒸發區111巾。接著微液滴D落 在瘵發容器11〇底部之熱體113上，透過熱體113之熱傳導， 將熱源Η之熱量傳遞至微液滴D，使微液滴D形成蒸汽。透 過壓力平衡及擴散_，工作親F之蒸汽便可逐漸通過蒸 汽管200進入冷凝容器12〇之冷凝區121 +，透過冷體122 將熱量傳遞至致冷源〇便可紅作㈣F之蒸汽冷凝於冷凝 容器120之底部。為了避免蒸汽在蒸汽管巾冷凝，導致蒸 汽管200巾積水’影響蒸汽麗之平衡及蒸汽之擴散，蒸汽管 200可經過斥水處理，例如塗佈鐵氟龍，使蒸汽不會在蒸汽管 200中冷凝。 麗力腔區112之工作液體F通過噴孔# 132之喷孔现 流出並形成微賴D後’由於氣體無法由噴孔片132之喷孔 15 1314208 132a，因此壓力腔區112中的壓力會形成負壓，也就是說壓力 腔區112的壓力會小於冷凝區121之壓力。由於壓力腔區112 以第一供液管210及第二供液管220連接冷凝區121，且第一 供液官210及第二供液管220之管口皆位於冷凝區丨21中工作 液體F之液面下方，因此壓力腔區η〕可以透過負壓吸引工 作液體F通過第一供液管21〇及第二供液管22〇，進入壓力腔 區112中，以補充壓力腔區112喷送出的工作液體卩量。透過 上述組合，即可構成一個工作液體F的循環，使工作液體F 於壓力腔區112、蒸發區ni及冷凝區121不斷循環。 再參照「第7A圖」及「第7B圖」所示，致動片131的 展動糾:及頻率’必須配合熱源H之熱功率，以確保微液滴 D的噴灑量可達細定之散熱量，且避免微液滴D在蒸發區 Ul中積存，覆盍*發容器11〇的底部及熱體113表面。一旦 裔發容器110的底部及熱體113積存工作液體F，便會使得蒸 發效果變差’特敲熱體113表面容易出現過熱沸騰的現象， 此得工作顏F在高於汽化鱗才汽化。當蒸發容器110的 底部及熱體m積存工作液體F時，移動微液滴冷卻裝置1〇〇 以改變絲容ϋ 12〇與蒸發妨⑽之姉位置，使冷凝容器 12〇與祭發谷态11〇皆為橫向擺設，且冷凝容器12〇位於蒸發 W 110之下’如「第4圖」所示。.此時於蒸發區ηι的液體 曰通過瘵汽官200流動至冷凝容器12〇的冷凝區121中，但壓 力腔區112中的工作液體F也會通過第一供液管21〇及第二 供液官22〇'流動至冷凝容器12〇的冷凝區121中。因此接著必 16 1314208 須再私動微液滴冷卻裝置100以改變冷凝容器120與蒸發容器 110之相對位置，使冷凝容器120與蒸發容器11〇皆為橫向擺 設，且冷凝容器120位於蒸發容器110之上，如「第4圖」所 ' 示。此時，第一供液管210之管口係位於工作液體F之液面 下，且第二供液管220之管口係位於工作液體F之液面上， . 因此工作液體F經由第一供液管210進入蒸發容器HQ之壓 力腔區112中，逐漸將塵力腔區H2填滿，且屋力腔區H2 • 之氣體可由第二供液管220排放置冷凝區121中，以利壓力腔 區112的氣體排出，並使工作液體F順利填滿壓力腔區112。 請筝閱「第8圖」所示，係為本發明第二實施例所揭露之 一種彳政液滴冷卻裝置其包含有一蒸發容器110及一冷凝 容器120。蒸發容器no係用以接觸一待降溫之熱源H，使蒸 發容器110中液態之工作液體F蒸發為氣態，透過一蒸汽管 200進入冷凝容器120中冷凝。而冷凝容器12〇可持續接觸一 • 致冷源C，例如外界冷空氣，使氣態之工作液體F降溫冷凝， 再透過一第一供液管210及一第二供液管220送回到蒸發容器 110。 蒸發容器110内具有一區隔板130，將蒸發容器110内部 區隔為一蒸發區111及一壓力腔區112，其中蒸發區m係位 於蒸發容器110之下半部，而壓力腔區112位於蒸發容器110 之上半部。區隔板130包含有一致動片131及一位於致動片 ⑶中間區域的噴孔片132，其中喷孔片132上具有複數個喷 孔’用以供液體通過形成微液滴D ’而致動片131係可接受脈 17 1314208 衝電壓輸入後產生震動’以擾動位於壓力腔區112之工作液體 F，使工作液體F通過噴孔形成微液滴D，進入蒸發區中 " 亚落在祕容器11()底部之熱體出上，吸熱蒸發成氣態進入 条發區111中。瘵汽管200係用以連接蒸發容器11〇之蒸發區 111及冷凝容器120之冷凝區121，使蒸發區ln中的蒸汽透 ， 過蒸汽管200進入冷凝區121中。 第一供液官210及第二供液管220係用以連接蒸發容器 • n〇之壓力腔區112及冷凝容器120之冷凝區121，使冷凝^ 121中的液態工作液體F透過，第一供液管21〇及第二供液管 220進入壓力腔區112。苐一供液管21〇及第二供液管2如二 管口係接近冷凝區121之底部，藉以使第一供液管21〇及第二 . 供液管220之管口位於工作液體F之液面下方。此外，第一 供液管210及第二供液管220係為不等長，使得第一供液管 21〇及第二供液管22〇之管σ與蒸發容器⑽之距離也不相 • 等:也紋說，第—供液管⑽之管口係較第二供液管22〇 之吕口接近療發容③110。以本實施例為例，第一供液管⑽ 之管口係位於蒸發區m的左半部，而第二供液管22〇之管口 係位於蒸發區111域之右半部。 . 此外，第一供液管210上更設有—送液栗浦23〇，用以由 • 冷凝區121泵虹舰體F進人屋力觀m。在某些場合 下，並無时接移動微液滴冷卻裝置，來排除蒸發區ιη赫 工作液體F或是壓力腔區112出現氣體的問題。在墓發區出 積存工作液體時，可先停止致動片131的作動，使墓發區山 18 1314208 中的積存的液體持續蒸發，待蒸發完畢在啟動致動片⑶，使 動腔區112中的工作賴度進人蒸發區⑴卜當動 腔區112出現氣體時，以送液泵浦23〇直接栗送液體，通過第 -供液管210，進人勤麵112中。第—供液管別連接於 Q力祕m的端，以及第二供液管22〇連接於壓力腔區 112中的-端具有一高度差，亦即第二供液管⑽連接於麼力 腔區112中的一端高於帛一供液管21〇連接於壓力腔區112 的一端，因此在送液泵浦230直接泵送液體通過第一供液管 210進入動腔區112時，動腔區112的氣體可由第二供液 官220離開，並進入蒸發區111中，直到第二供液管220也充 ^^體F時，就完成了氣體的排除’此時便可停止送液 采浦2j〇。 剌料叙纽例減如上，料鱗用以 :發明。在不脫離本發明之精神和範_，所為之更動鱼潤 ，均屬本發狄專利賴顧。_本發 圍請參考_之申請翻制。 κ之保邊祀 【圖式簡單說明】 第1圖為本發明第一實施例之外觀立體圖； 第2圖為树明第—實施例之剖面 例之運作狀態； 口揭不弟一貫施 第3圖為本發明第一實施例中，熱體之 第4圖為本發明第一實施例中之剖面示意圖，揭二，工作 19 1314208 液體填充於壓力腔區並排出氣體之狀態； 第5A圖為本發明第一實施例中，喷孔片之平面圖； 第5B圖為第5A圖中，喷孔片之剖面示意圖； 第6A圖為本發明第一實施例中，區隔板之剖面示意圖； 第6B圖為第6A圖中，喷孔片及致動片之局部剖面示意 圖； 第7A及7B圖為本發明第一實施例之剖面示意圖，揭示 排除蒸發區積存液態之工作液體；及 第8圖為本發明第二實施例之剖面示意圖，揭示第二實施 例之運作狀態。 【主要元件符號說明】 100 微液滴冷卻裝置 110 蒸發容器 111 蒸發區 112 壓力腔區 113 熱體 113a 微結構 120 冷凝容器 121 冷凝區 122 冷體 131 致動片 13ia 微小孔 132 喷孔片 20 1314208 132a 喷孔 132b 微溝槽 132c 微小孔 200 蒸汽管 210 第一供液管 220 第二供液管 230 送液泵浦 H 熱源 C 致冷源 D 微液滴 F 液態之工作液體 G 工作液體之蒸汽Referring to "Aug. 6A" and "New Zealand", the orifice sheet m is fixed to the actuation piece 132' by gluing. In order to improve the adhesion strength, the orifice sheet 132 has a plurality of micro holes 132c formed in the orifice sheet. The contact actuator 131 has a plurality of micro holes 131a corresponding to the minute holes 132c of the orifice sheet 132. When the adhesive G is filled in the interface between the orifice sheet 132 and the actuating sheet 131, the adhesive can be filled into the orifice sheet 132 and the micro holes 131a, 132c of the actuating sheet ι31 to increase the adhesion strength and prevent the orifice sheet 132 from being immersed. The shearing force is generated with respect to the actuating piece 131 to cause the adhesive G to fall off. Referring to FIG. 2 again, the micro-droplet cooling device is used to provide a heat transfer path between a heat source 14 1314208 and a cooling source C, so that the heat generated by the heat source η is quickly transmitted to the cooling source C. To control the heat source Η temperature. The heat source π can be a power electronic chip, such as a central processing unit (cpu). The cooling source c can be a heat exchanger that exchanges heat with the outside world, or directly uses external cold air as the source C. The bursting container 11 is in contact with the heat source η with the hot body 丨a at the bottom thereof, and the condensing capacity 1 120 is finely cooled by the bottom cold body 122. When the heat source Η starts to operate, the heat source must be caused When the temperature is controlled by the cold, a high-frequency pulse voltage is applied to the actuating piece 131 to cause the high-frequency vibration of the actuating piece 131. The vibration generated by the actuating piece 131 can disturb the working fluid F of the pressure chamber 112. 'At the same time working liquid? The tension surface formed by the orifice 132 & of the orifice sheet 132 is also destroyed, so that the working fluid F is attracted by the neutral orifice through the orifice 132a, and the microdroplet D is formed into the evaporation zone 111. The droplet D falls on the hot body 113 at the bottom of the bursting container 11, passes through the heat conduction of the hot body 113, transfers the heat of the heat source to the micro-droplet D, and causes the micro-droplet D to form steam. The pressure balance and diffusion _ The steam of the working pro-F can gradually enter the condensing zone 121+ of the condensing vessel 12 through the steam pipe 200, and the heat is transmitted to the cooling source through the cold body 122, and the steam of the F (four) F is condensed at the bottom of the condensing vessel 120. In order to avoid condensation of steam in the steam tube, The steam pipe 200 causes the water to accumulate the balance of the steam and the diffusion of the steam. The steam pipe 200 can be subjected to water repellent treatment, for example, coating Teflon so that the steam does not condense in the steam pipe 200. The Lili cavity area 112 After the working liquid F passes through the orifice of the orifice #132, it flows out and forms a micro-dip D. Since the gas cannot pass through the orifice 15 1314208 132a of the orifice sheet 132, the pressure in the pressure chamber region 112 forms a negative pressure, that is, It is said that the pressure in the pressure chamber region 112 is smaller than the pressure in the condensation chamber 121. Since the pressure chamber region 112 is connected to the condensation zone 121 by the first liquid supply pipe 210 and the second liquid supply pipe 220, and the first liquid supply officer 210 and the second supply The nozzles of the liquid pipe 220 are located below the liquid surface of the working liquid F in the condensing zone , 21, so that the pressure chamber zone η can suck the working fluid F through the negative pressure to pass the first liquid supply pipe 21 and the second liquid supply pipe 22 〇, entering the pressure chamber region 112 to supplement the amount of working liquid sprayed from the pressure chamber region 112. Through the above combination, a circulation of the working fluid F can be formed, so that the working fluid F is in the pressure chamber region 112 and the evaporation region. And the condensation zone 121 is continuously circulated. Refer again. As shown in Fig. 7A and Fig. 7B, the motion correction of the actuating piece 131 and the frequency 'must match the heat power of the heat source H to ensure that the amount of spray of the microdroplets D can reach a fine heat dissipation amount, and The micro-droplet D is prevented from accumulating in the evaporation zone U1, covering the bottom of the container 11 and the surface of the hot body 113. Once the bottom of the hair-receiving container 110 and the hot body 113 accumulate the working liquid F, the evaporation effect is deteriorated. 'The surface of the hot body 113 is prone to hot boiling, so that the working face F is vaporized above the vaporization scale. When the bottom of the evaporation vessel 110 and the hot body m accumulate the working liquid F, the moving microdroplet cooling device 1 〇〇To change the position of the silk ϋ 12〇 and evaporate (10), the condensing container 12 〇 and the 谷 谷 谷 〇 〇 〇 祭 , , , , , , , , , , , , , , , , 冷凝 冷凝 冷凝 冷凝 冷凝 冷凝 冷凝 冷凝 冷凝Figure". At this time, the liquid enthalpy in the evaporation zone ηι flows through the sputum vaporizer 200 to the condensing zone 121 of the condensing vessel 12, but the working fluid F in the pressure chamber zone 112 also passes through the first liquid supply pipe 21 and the second The liquid supply member 22' flows into the condensation zone 121 of the condensing vessel 12A. Therefore, the micro-droplet cooling device 100 must be further moved to change the relative position of the condensation container 120 and the evaporation container 110, so that the condensation container 120 and the evaporation container 11 are both disposed laterally, and the condensation container 120 is located in the evaporation container 110. Above, as shown in "Figure 4". At this time, the nozzle of the first liquid supply pipe 210 is located under the liquid surface of the working liquid F, and the nozzle of the second liquid supply pipe 220 is located on the liquid surface of the working liquid F, so the working liquid F passes through the first The liquid supply pipe 210 enters the pressure chamber region 112 of the evaporation container HQ, and gradually fills the dust chamber region H2, and the gas of the house chamber region H2 can be placed in the condensation region 121 by the second liquid supply tube 220, so as to facilitate The gas in the pressure chamber region 112 is discharged, and the working fluid F is smoothly filled in the pressure chamber region 112. Please refer to the "Fig. 8" for a second embodiment of the present invention, which comprises a vaporization vessel 110 and a condensing vessel 120. The evaporation container no is used to contact a heat source H to be cooled, and the liquid working liquid F in the evaporation container 110 is evaporated to a gaseous state, and is condensed through a steam tube 200 into the condensation container 120. The condensing container 12 〇 can continuously contact a cooling source C, such as outside cold air, to cool and condense the gaseous working liquid F, and then send it back to the evaporation through a first liquid supply pipe 210 and a second liquid supply pipe 220. Container 110. The evaporation vessel 110 has a zone partition 130 therein, which partitions the interior of the evaporation vessel 110 into an evaporation zone 111 and a pressure chamber zone 112, wherein the evaporation zone m is located in the lower half of the evaporation vessel 110, and the pressure chamber zone 112 is located. The upper half of the vessel 110 is evaporated. The partition plate 130 includes an actuating piece 131 and a perforating piece 132 located at an intermediate portion of the actuating piece (3), wherein the orifice piece 132 has a plurality of orifices for allowing liquid to pass through the formation of the microdroplets D' The moving piece 131 can receive the pulse 17 1314208, and the shock voltage is input to generate the vibration 'to disturb the working liquid F located in the pressure chamber area 112, so that the working liquid F forms the micro-droplet D through the orifice, and enters the evaporation zone. The hot body at the bottom of the secret container 11 () is discharged, and the heat is evaporated to a gaseous state and enters the firing zone 111. The steam pipe 200 is connected to the evaporation zone 111 of the evaporation vessel 11 and the condensation zone 121 of the condensation vessel 120 to allow the vapor in the evaporation zone ln to pass through the steam pipe 200 into the condensation zone 121. The first liquid supply unit 210 and the second liquid supply tube 220 are connected to the pressure chamber area 112 of the evaporation container, and the condensation area 121 of the condensation container 120, so that the liquid working liquid F in the condensation unit 121 is transmitted. The supply pipe 21 and the second supply pipe 220 enter the pressure chamber region 112. The first liquid supply pipe 21 and the second liquid supply pipe 2 are connected to the bottom of the condensation zone 121, so that the first liquid supply pipe 21 and the second liquid supply pipe 220 are located at the working fluid F. Below the liquid level. In addition, the first liquid supply pipe 210 and the second liquid supply pipe 220 are not equal in length, so that the distance between the pipe σ of the first liquid supply pipe 21 and the second liquid supply pipe 22 and the evaporation container (10) is not the same. Etc.: It is also said that the nozzle of the first liquid supply tube (10) is closer to the hair treatment volume 3110 than the second liquid supply tube 22. Taking this embodiment as an example, the nozzle of the first liquid supply pipe (10) is located in the left half of the evaporation zone m, and the nozzle of the second liquid supply pipe 22 is located in the right half of the evaporation zone 111 domain. In addition, the first liquid supply pipe 210 is further provided with a liquid-feeding pump 23 〇 for pumping the hull body F into the house. In some cases, there is no time to move the micro-droplet cooling device to eliminate the problem of gas in the evaporation zone or the gas in the pressure zone 112. When the working fluid is accumulated in the tomb area, the actuation of the actuating piece 131 may be stopped first, so that the accumulated liquid in the mountain 18 1314208 of the tomb area is continuously evaporated, and after the evaporation is completed, the actuating piece (3) is activated to make the movable cavity area 112 The working temperature in the person enters the evaporation zone (1). When the gas is present in the dynamic cavity area 112, the liquid is directly pumped by the liquid feeding pump 23, and passes through the first liquid supply pipe 210 to enter the working surface 112. The first liquid supply pipe is connected to the end of the Q force secret m, and the second liquid supply pipe 22 is connected to the end of the pressure chamber area 112 to have a height difference, that is, the second liquid supply pipe (10) is connected to the force force. One end of the cavity region 112 is higher than the one end of the first liquid supply pipe 21 〇 connected to the pressure chamber region 112, so when the liquid supply pump 230 directly pumps the liquid through the first liquid supply pipe 210 into the dynamic cavity region 112, The gas in the cavity region 112 can be separated from the second liquid supply official 220 and enter the evaporation zone 111 until the second liquid supply pipe 220 is also charged with the body F, and the gas is eliminated. Caipu 2j〇. The sputum is reduced as above, and the scale is used: invention. Without departing from the spirit and scope of the present invention, it is a matter of moving the fish, which belongs to the patent of the present invention. _ This issue please refer to _ application for conversion. κ 保 保 祀 图 图 图 祀 第 第 第 第 第 第 第 第 第 第 第 外观 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; FIG. 4 is a cross-sectional view showing a first embodiment of the present invention. FIG. 5A is a view showing a state in which a liquid is filled in a pressure chamber region and a gas is discharged; In the first embodiment of the present invention, a plan view of the orifice sheet; FIG. 5B is a schematic cross-sectional view of the orifice sheet in FIG. 5A; and FIG. 6A is a schematic cross-sectional view of the partition plate in the first embodiment of the present invention; 6B is a partial cross-sectional view of the orifice sheet and the actuating sheet in FIG. 6A; FIGS. 7A and 7B are schematic cross-sectional views showing the first embodiment of the present invention, and revealing a working liquid which excludes the liquid in the evaporation zone; and FIG. A schematic cross-sectional view of a second embodiment of the present invention reveals the operational state of the second embodiment. [Main component symbol description] 100 micro-droplet cooling device 110 evaporation vessel 111 evaporation zone 112 pressure chamber zone 113 hot body 113a microstructure 120 condensation vessel 121 condensation zone 122 cold body 131 actuator 13ia micro-hole 132 orifice sheet 20 1314208 132a orifice 132b microchannel 132c microhole 200 steam pipe 210 first liquid supply pipe 220 second liquid supply pipe 230 liquid delivery pump H heat source C refrigerant source D micro droplet F liquid working liquid G working liquid steam
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